JPH01118449A - Manufacture of thermal head substrate - Google Patents
Manufacture of thermal head substrateInfo
- Publication number
- JPH01118449A JPH01118449A JP27654287A JP27654287A JPH01118449A JP H01118449 A JPH01118449 A JP H01118449A JP 27654287 A JP27654287 A JP 27654287A JP 27654287 A JP27654287 A JP 27654287A JP H01118449 A JPH01118449 A JP H01118449A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- borosilicate glass
- layer
- thermal head
- molten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 27
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 18
- 239000005388 borosilicate glass Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000003513 alkali Substances 0.000 claims abstract description 13
- 239000002253 acid Substances 0.000 claims abstract description 3
- 239000005373 porous glass Substances 0.000 abstract description 10
- 238000004381 surface treatment Methods 0.000 abstract description 9
- 239000000919 ceramic Substances 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 3
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 abstract description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000007639 printing Methods 0.000 abstract description 2
- 235000011149 sulphuric acid Nutrition 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 238000007598 dipping method Methods 0.000 abstract 2
- 238000005406 washing Methods 0.000 abstract 2
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000006386 neutralization reaction Methods 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、サーマルヘッド用基板の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing a thermal head substrate.
従来のサーマルヘッド用基板としては例えはアルミナセ
ラミクス基板上に保温層としてのグレーズ層を設けたも
のであって、このグレーズ層をガラスで構成したものが
ある。An example of a conventional thermal head substrate is one in which a glaze layer as a heat insulating layer is provided on an alumina ceramic substrate, and this glaze layer is made of glass.
ところが、近年サーマルヘッドに対し、より高精細でよ
り高速に且つより小さなパワーで印字の可能な性能が求
められており、この性能を満足させるため、上記ガラス
ゲレース層に替えて多孔質ガラスグレーズ層を用いたサ
ーマルヘッド用基板が本出願人によって特願昭６２−５
８７９６号明細書に提案されている。第２図は多孔質ガ
ラスゲレース層を用いた上記従来例の側断面図であり、
同図において、１はアルミナセラミクス基板、２は上記
アルミナセラミクス基板１上に形成された多孔質ガラス
ゲレース層である。このサーマルヘッド用基板の製造方
法は、先ず、アルミナセラミクス基板１上にホウケイ酸
カラスの層を形成し、次に、これを熱処理し、続いて酸
処理することにより、この層を多孔質カラスフレース層
２とするものである。However, in recent years, thermal heads have been required to have the ability to print with higher resolution, higher speed, and lower power. A substrate for a thermal head using a layer was filed by the present applicant in a patent application filed in 1986-5.
It is proposed in the specification of No. 8796. FIG. 2 is a side sectional view of the above conventional example using a porous glass gelase layer,
In the figure, 1 is an alumina ceramic substrate, and 2 is a porous glass gelase layer formed on the alumina ceramic substrate 1. This method of manufacturing a substrate for a thermal head involves first forming a layer of borosilicate glass on an alumina ceramic substrate 1, then heat-treating this, and then acid-treating this layer to form a porous glass flake. This is layer 2.
しかしながら、上記した従来の製造方法によれば、多孔
質カラスグレーズ層２と、アルミナセラミクス基板１と
の密着性が悪く、接着性能が不十分であるなめに、剥離
を生じやすく、しかも機械的強度が弱くなるため基板の
製造歩留りを低下せしめるという問題点があった。However, according to the above-mentioned conventional manufacturing method, the adhesion between the porous glass glaze layer 2 and the alumina ceramic substrate 1 is poor, and peeling is likely to occur due to insufficient adhesion performance. There was a problem in that the manufacturing yield of the substrate was lowered because of the weakening of the bond.
そこで、本発明は従来技術の上記した問題点を解決する
ためになされたもので、その目的とするところは、基板
とグレーズ層の密着性をよくすることによって、基板の
製造歩留りを向上させることを可能としたサーマルヘッ
ド用基板の製造方法を提供することにある。Therefore, the present invention was made to solve the above-mentioned problems of the prior art, and its purpose is to improve the manufacturing yield of the substrate by improving the adhesion between the substrate and the glaze layer. An object of the present invention is to provide a method for manufacturing a thermal head substrate that enables the following.
上記の目的を達成するために、本発明に係るサーマルヘ
ッド用基板の製造方法は、アルミナセラミクス基板を溶
融アルカリに浸漬させ表面処理を施す工程と、この表面
処理を施されたアルミナセラミクス基板上にホウケイ酸
ガラスよりなるクレーズ層を形成する工程と、これを熱
処理する工程と、これを酸処理する工程とを含むことを
特徴としている。In order to achieve the above object, the method for manufacturing a thermal head substrate according to the present invention includes a step of immersing an alumina ceramic substrate in molten alkali to perform a surface treatment, and a step of applying a surface treatment to the alumina ceramic substrate that has been subjected to the surface treatment. It is characterized in that it includes a step of forming a craze layer made of borosilicate glass, a step of heat-treating the craze layer, and a step of treating the craze layer with an acid.
本発明の製造方法においては、アルミナセラミクス基板
を溶融アルカリに浸漬させ、表面処理を施し、この後、
この表面処理を施されたアルミナセラミクス基板上にポ
ウケイ酸カラスよりなるグレーズ層を形成することによ
って、アルミナセラミクス基板とグレーズ層との密着性
を良好にする役目を果す。このためグレーズ層の剥離が
生じにくくなると共に、グレーズ層自体の機械的強度か
向上する。In the manufacturing method of the present invention, an alumina ceramic substrate is immersed in molten alkali, surface treatment is performed, and then,
By forming a glaze layer made of porosilicate glass on the surface-treated alumina ceramic substrate, it serves to improve the adhesion between the alumina ceramic substrate and the glaze layer. Therefore, the glaze layer is less likely to peel off, and the mechanical strength of the glaze layer itself is improved.
以下に本発明を図示の実施例に基づいて説明する。第１
図（ａ）、（ｂ）、（Ｃ）は本発明に係るサーマルヘッ
ド用基板の製造方法の一実施例を示す１稈説明図である
。同図において、１１はアルミナセラミクス基板、１４
はアルミナセラミクス基板１１上に形成されたホウケイ
酸カラス層、１２はホウケイ酸カラス層１４より形成さ
れた多孔質カラスクレーズ層である。ここで、アルミナ
セラミクス基板１１としては、９９．６％アルミナ（京
セラ社製）のものを用いた。The present invention will be explained below based on illustrated embodiments. 1st
Figures (a), (b), and (C) are explanatory views of one culm showing an embodiment of the method for manufacturing a thermal head substrate according to the present invention. In the same figure, 11 is an alumina ceramic substrate, 14
1 is a borosilicate glass layer formed on an alumina ceramic substrate 11, and 12 is a porous glass crase layer formed from a borosilicate glass layer 14. Here, as the alumina ceramic substrate 11, 99.6% alumina (manufactured by Kyocera Corporation) was used.
次に、本発明に係るサーマルヘッド用基板の製造方法の
具体例について説明する。先ず、最初の工程では、第１
図（ａ）示すようにアルミナセラミクス基板１１を溶融
アルカリ１３、例えば２００〜４５０℃の溶融ＫＯＨ又
は３４０〜４５０℃の溶融ＮａＯＨに３０秒〜３０分間
浸漬させ、その後湯洗、水洗、希塩酸による中和を施し
て表面処理を行う。Next, a specific example of the method for manufacturing a thermal head substrate according to the present invention will be described. First, in the first process, the first
As shown in Figure (a), an alumina ceramic substrate 11 is immersed in a molten alkali 13, for example, molten KOH at 200 to 450°C or molten NaOH at 340 to 450°C, for 30 seconds to 30 minutes, and then washed with hot water, water, and diluted with dilute hydrochloric acid. Perform surface treatment by applying Japanese.
次の工程では、重量組成で、 ５ｉ０２を５５ｗｔ％、
Ｂ２Ｏ３を３５ｗｔ％、Ｎ ａ ２０を８ｗｔ％、Ａｊ
２０３を２．０ｗｔ％としたホウゲイ酸ガラス粉のペ
ーストを厚膜印刷法によりアルミナセラミクス基板１１
上に塗布し、これを焼成することにより、第１図（ｂ）
に示すようなホウケイ酸カラス層１４を形成した。In the next step, the weight composition is 55 wt% of 5i02,
B2O3 35wt%, Na20 8wt%, Aj
An alumina ceramic substrate 11 was formed using a thick film printing method using a paste of borogate glass powder containing 2.0 wt% of 203.
By coating it on top and firing it, the result shown in Fig. 1(b) is obtained.
A borosilicate glass layer 14 as shown in FIG.
次の工程では、このホウケイ酸ガラス１４を備えた基板
を５５０℃で１００時間熱処理し、その後９０℃、ＩＮ
のＨ２ＳＯ４水溶液に２０時間浸漬させてポウケイ酸ガ
ラス層１４を多孔質ガラスグレーズ層１２とし、第１図
（Ｃ）に示すようなサーマルヘッド用基板の製造を完了
する。In the next step, the substrate provided with this borosilicate glass 14 is heat treated at 550°C for 100 hours, and then heated to 90°C, IN
The borosilicate glass layer 14 was immersed in an aqueous H2SO4 solution for 20 hours to form the porous glass glaze layer 12, completing the production of a thermal head substrate as shown in FIG. 1(C).
次に、本実施例の製造方法によって製造されたサーマル
ヘッド用基板の不良発生率について説明する。ここでは
、溶融アルカリの温度及び浸漬時間を変えてアルミナセ
ラミクス基板に表面処理をおこない、クレーズ層の剥離
による不良の発生率を調べた。不良発生率を低くするた
めには、低い温度の溶融アルカリの場合には長い浸漬時
間か必要となる。但し、３５０℃以上の溶融アルカリで
は、長時間の浸漬でアルミナセラミクス基板の機械的強
度の低下が生ずるため、浸漬時間は３０分以下とするこ
とが好ましい。Next, the failure rate of the thermal head substrate manufactured by the manufacturing method of this example will be explained. Here, we performed surface treatment on alumina ceramic substrates by varying the temperature and immersion time of molten alkali, and investigated the incidence of defects due to peeling of the craze layer. In order to reduce the failure rate, long immersion times are required in the case of low temperature molten alkali. However, in the case of molten alkali at a temperature of 350° C. or higher, the mechanical strength of the alumina ceramic substrate decreases if immersed for a long time, so the immersion time is preferably 30 minutes or less.
第１表及び第２表は、それぞれ溶融Ｋ ＯＨ又は溶融Ｎ
ａＯＨに各温度で最適な時間、浸漬処理を行ったときの
グレーズ層の剥離による不良発生率を調べた結果を示す
ものである。ここでは、サンプル数は各柴件で２０個ず
つとしな。尚、アルカリ処理を施さなかったものにおけ
る不良発生率は６５％であった。また、Ｎａ ＯＨは３
４０℃以下では完全に溶融しないので３４０℃以上の各
温度について調べな。Tables 1 and 2 show molten KOH or molten N, respectively.
This figure shows the results of investigating the failure rate due to peeling of the glaze layer when immersion treatment was performed in aOH at each temperature for an optimal time. Here, the number of samples is 20 for each case. Incidentally, the failure rate in those not subjected to alkali treatment was 65%. Also, NaOH is 3
It will not melt completely at temperatures below 40°C, so please investigate temperatures above 340°C.
溶融ＫＯＨによる処理効果
溶融ＮａＯＨによる処理効果
第１表に示された結果より、溶融ＫＯＨで表面処理する
場合には、２５０℃以上の溶融Ｋ ＯＨを用いることに
より不良発生率の低下が顕著に現われはじめ、３５０°
Ｃ以上の溶融ＫＯＨを用いることにより、グレーズ層の
剥離による不良の発生を略完全になくすることかできた
。また、第２表に示された結果より、溶融ＮａＯＨで表
面処理する場合には、Ｎａ０）Ｉが完全に溶融している
温度、即ち３４０℃以上であれば、グレーズ層の不良の
発生を略完全になくすることかできた。Treatment effect with molten KOH Treatment effect with molten NaOH From the results shown in Table 1, when surface treatment is performed with molten KOH, there is a noticeable reduction in the defect rate by using molten KOH at 250°C or higher. At the beginning, 350°
By using molten KOH of C or higher, it was possible to almost completely eliminate the occurrence of defects due to peeling of the glaze layer. Furthermore, from the results shown in Table 2, when surface treatment is performed with molten NaOH, if the temperature is above 340°C, which is the temperature at which Na0)I is completely melted, the occurrence of defects in the glaze layer can be almost avoided. I could have eliminated it completely.
尚、本実施例ではホウケイ酸ガラスの組成を前記のよう
にしなか、空孔率を変化させるなめに、この組成をＳｉ
Ｏ３０〜 ７０Ｘｖ１％、Ｂ２Ｏ３２０〜６８ｓｖｔ％
、Ｎ ａ２０１〜１７．５ｗｔ％の範囲内で変化させて
てもよい。また、以下に示す第３表の■〜ＩＶの組成の
グレーズ層を備えたものについでも、第１表及び第２表
と同じ効果が確認された。In this example, the composition of the borosilicate glass was as described above, but in order to change the porosity, this composition was changed to Si.
O30~70Xv1%, B2O320~68svt%
, Na may be varied within the range of 201 to 17.5 wt%. Furthermore, the same effects as in Tables 1 and 2 were confirmed for those provided with glaze layers having compositions ① to IV in Table 3 shown below.
重量％
また、熱処理温度は５００〜６５０℃の範囲内で、多孔
質ガラスゲレース層１２に求められる性能を考慮して適
当に設定すればよく、酸処理工程においても、Ｈ２ＳＯ
４以外にＨＣ，ｌ！、Ｈ３ＰＯ４、ＨＮＯ３等他の酸溶
液を用いてもよい。Weight% The heat treatment temperature may be appropriately set within the range of 500 to 650°C, taking into consideration the performance required of the porous glass gelase layer 12.
Besides 4, HC, l! , H3PO4, HNO3, etc. may also be used.
以上説明したように本発明によれば、アルミナセラミク
ス基板上に剥離が生じにくく機械的強度の強いグレーズ
層を形成することができるので、製造歩留りを良くする
ことができる。これによって多孔質カラスグレーズ層を
用いた優れたサーマルヘッド用基板を安価に製造するこ
とができるという効果を有する。As explained above, according to the present invention, it is possible to form a glaze layer on an alumina ceramic substrate that is unlikely to peel off and has strong mechanical strength, so that the manufacturing yield can be improved. This has the effect that an excellent thermal head substrate using a porous glass glaze layer can be manufactured at low cost.
第１図（ａ）、（ｂ）、（Ｃ）は本発明に係るサーマル
ヘッド用基板の製造方法の一実施例を示す工程説明図、
第２図は従来のサーマルヘッド用基板の側断面図である
。
１１・・・アルミナセラミクス基板、
１２・・・多孔質ガラスゲレース層、
１２′・・・ホウケイ酸ガラス層、
１３・・・溶融アルカリ。FIGS. 1(a), (b), and (C) are process explanatory diagrams showing an embodiment of the method for manufacturing a thermal head substrate according to the present invention,
FIG. 2 is a side sectional view of a conventional thermal head substrate. 11... Alumina ceramics substrate, 12... Porous glass gelase layer, 12'... Borosilicate glass layer, 13... Molten alkali.
Claims (1)
て表面処理を施す工程と、 この表面処理を施されたアルミナセラミクス基板上にホ
ウケイ酸ガラスよりなるグレーズ層を形成する工程と、 これを熱処理する工程と、 これを酸処理する工程と を含むことを特徴とするサーマルヘッド用基板の製造方
法。 ２、上記溶融アルカリが３４０℃以上のＮａＯＨである
ことを特徴とする特許請求の範囲第１項記載のサーマル
ヘッド用基板の製造方法 ３、上記溶融アルカリが２５０℃以上のＫＯＨであるこ
とを特徴とする特許請求の範囲第１項記載のサーマルヘ
ッド用基板の製造方法。[Claims] 1. A step of surface-treating an alumina ceramic substrate by immersing it in molten alkali, and a step of forming a glaze layer made of borosilicate glass on the surface-treated alumina ceramic substrate. A method for manufacturing a thermal head substrate, comprising the steps of heat treating the substrate and acid treating the substrate. 2. The method for manufacturing a thermal head substrate according to claim 1, characterized in that the molten alkali is NaOH at a temperature of 340° C. or higher. 3. The method for manufacturing a substrate for a thermal head according to claim 1, characterized in that the molten alkali is KOH at a temperature of 250° C. or higher. A method for manufacturing a thermal head substrate according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27654287A JPH01118449A (en) | 1987-10-30 | 1987-10-30 | Manufacture of thermal head substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27654287A JPH01118449A (en) | 1987-10-30 | 1987-10-30 | Manufacture of thermal head substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01118449A true JPH01118449A (en) | 1989-05-10 |
Family
ID=17570926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27654287A Pending JPH01118449A (en) | 1987-10-30 | 1987-10-30 | Manufacture of thermal head substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01118449A (en) |
-
1987
- 1987-10-30 JP JP27654287A patent/JPH01118449A/en active Pending
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