JPS60210469A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS60210469A JPS60210469A JP59065963A JP6596384A JPS60210469A JP S60210469 A JPS60210469 A JP S60210469A JP 59065963 A JP59065963 A JP 59065963A JP 6596384 A JP6596384 A JP 6596384A JP S60210469 A JPS60210469 A JP S60210469A
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- glaze layer
- generating body
- heat generating
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000011521 glass Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 7
- 238000005498 polishing Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 4
- 230000001681 protective effect Effects 0.000 abstract description 4
- 238000001259 photo etching Methods 0.000 abstract description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 238000005336 cracking Methods 0.000 abstract 1
- 230000007812 deficiency Effects 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 238000007788 roughening Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical compound [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 238000004031 devitrification Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、感熱式又は熱転写式プリンタの主要部分を構
成するサーマルヘッドに関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a thermal head that constitutes a main part of a thermal or thermal transfer printer.
(従来例の構成とその問題点)
一般に、サーマルヘッドは、第1図又は第2図に示した
ように構成されている。図において、1はアルミナ等の
絶縁基板、2はガラスグレーズ層、3は導体リード線、
4は発熱体、5は保護膜である。このように構成された
サーマルヘッドの上を紙6が移動し、適時に発熱体4が
発熱し紙6に印字される。(Conventional Structure and Problems thereof) Generally, a thermal head is structured as shown in FIG. 1 or 2. In the figure, 1 is an insulating substrate such as alumina, 2 is a glass glaze layer, 3 is a conductor lead wire,
4 is a heating element, and 5 is a protective film. The paper 6 moves over the thermal head configured in this manner, and the heating element 4 generates heat at a timely manner to print on the paper 6.
第1図のように、グレーズ層2がほとんど基板全体に及
んでいる構造のものはラインプリンタに多く用いられ、
第2図のように、グレーズ層2が発熱体の真下の部分の
みにある構造のものはシリアル式のプリンタに多く用い
られている。As shown in Figure 1, a structure in which the glaze layer 2 covers almost the entire board is often used in line printers.
As shown in FIG. 2, a printer having a structure in which the glaze layer 2 is located only directly below the heating element is often used in serial type printers.
ところで、従来のサーマルヘッドにおいては、グレーズ
層20表面粗さRaが0.01μm以下と非常に滑らか
であるため、このグレーズ層2とその上に形成された発
熱体4との接着強度があまシ強いものではなかった。一
方、発熱体4の温度は、発熱時に瞬間的に600℃以上
になることもあシ、従ってその熱衝撃により、発熱体4
が剥離欠落してしまうこともあって、耐久性に問題があ
った。By the way, in the conventional thermal head, the glaze layer 20 has a very smooth surface roughness Ra of 0.01 μm or less, so the adhesive strength between the glaze layer 2 and the heating element 4 formed thereon is very low. It wasn't strong. On the other hand, the temperature of the heating element 4 may instantaneously rise to 600°C or higher when it generates heat, so the thermal shock may cause the heating element 4 to
There was a problem with durability, as it sometimes peeled off and was missing.
(発明の目的)
本発明は、このよう々従来の欠点を除去するものであシ
、グレーズ層と発熱体との強固な接着強度が得られるよ
うにした、耐久性、信頼性の高いサーマルヘッドを提供
するものである。(Objective of the Invention) The present invention aims to eliminate these conventional drawbacks, and provides a highly durable and reliable thermal head that provides strong adhesive strength between the glaze layer and the heating element. It provides:
(発明の構成)
本発明は、従来非結晶質ガラスで形成されていてその表
面粗さRaが0.01μm以下と非常に滑らかであった
グレーズ層を、Raが0.01μm〜0.2μmと粗く
したグレーズ層で置き換えることにより、グレーズ層と
発熱体の機械的接着強度を上げ、熱衝撃による発熱体の
剥離をなくするものである。(Structure of the Invention) The present invention provides a glaze layer with a surface roughness Ra of 0.01 μm to 0.2 μm, which is conventionally made of amorphous glass and has a very smooth surface roughness Ra of 0.01 μm or less. By replacing the glaze with a roughened glaze layer, the mechanical adhesion strength between the glaze layer and the heating element is increased, and peeling of the heating element due to thermal shock is eliminated.
その方法として、通常のグレーズ材を普通に焼付けるだ
けでは、表面粗さの小さい滑らかなものになってしまう
ので、グレーズ材として、結晶化ガラスを用いる。結晶
化ガラスを用いると、ガラスが細かい結晶の集った多結
晶体とカシ、表面が滑らか過ぎない適尚々表面粗さのグ
レーズ層と々る。As a method for this, simply baking a normal glaze material would result in a smooth surface with little surface roughness, so crystallized glass is used as the glaze material. When crystallized glass is used, the glass becomes a polycrystalline body made up of fine crystals, and a glaze layer with a moderately rough surface that is not too smooth.
一般にエツチングと呼ばれる化学研摩も表面を粗面化す
る方法として有効である。ガラスグレーズ層形成後、H
FやNH4F等の溶液に基板を浸すことによシ、滑らか
過ぎる表面を適度に粗くすることが出来る。この粗面化
の方法は一般にフロスト加工、ソングレア加工と呼ばれ
る方法を応用することにより実現される。Chemical polishing, generally called etching, is also an effective method for roughening the surface. After forming the glass glaze layer, H
By immersing the substrate in a solution such as F or NH4F, a surface that is too smooth can be made appropriately rough. This surface roughening method is generally achieved by applying a method called frost processing or sing glare processing.
ガラス材質がホウケイ酸系の場合などは、特に熱処理に
よる表面失透も滑らか々表面を適度に粗面化する方法と
して有効である。ガラス表面の水利層を熱によシ強制的
に取り去る、即ちホウ酸アルカリ等を揮発させる方法で
粗面化を実現出来る。When the glass material is borosilicate-based, surface devitrification by heat treatment is particularly effective as a method for smoothing and appropriately roughening the surface. Roughening can be achieved by forcibly removing the water reservoir layer on the glass surface using heat, that is, by volatilizing alkali borate or the like.
(実施例の説明)
結晶化ガラスのグレーズ法は、結晶化する組成のガラス
成分の混合物を溶融し、これを粗砕、粉砕して分級した
粉体を、例えばエチル七ルロースのイン酢酸アミル溶液
のバインダーと混合して、サーマルヘッドの基板1に塗
布し、高温で焼付けてグレーズ層2とするものである。(Explanation of Examples) The glazing method for crystallized glass involves melting a mixture of glass components with a composition that will crystallize, crushing the mixture, crushing it, and classifying the resulting powder. It is mixed with a binder, applied to the substrate 1 of the thermal head, and baked at high temperature to form the glaze layer 2.
結晶化ガラスの組成としては、At203− B203
−5in2. ZnO−B203−5i02. MgO
−At20.− Sin、 、 BaO−At203−
8iO2等の組成が適当である。The composition of crystallized glass is At203-B203
-5in2. ZnO-B203-5i02. MgO
-At20. - Sin, , BaO-At203-
A composition such as 8iO2 is suitable.
化学研摩による表面処理は、基板上に通常のグレーズ層
を形成した後、エツチング溶液に浸漬して表面を粗面化
する。エツチング液としては、例えばHF 10 %、
NH4F 30%の水溶液にアンモニウム塩を温和した
溶液を用いる。HFとNH4Fでガラスを腐食させ々が
ら、腐食生成物をアンモニウム塩で適当に錯体にするこ
とで、微細な凹凸をもつガラス表面を得るととが出来る
。In surface treatment by chemical polishing, a normal glaze layer is formed on a substrate, and then the substrate is immersed in an etching solution to roughen the surface. As the etching solution, for example, HF 10%,
A mild solution of ammonium salt in 30% NH4F aqueous solution is used. By corroding glass with HF and NH4F and appropriately complexing the corrosion products with ammonium salt, it is possible to obtain a glass surface with fine irregularities.
熱処理による表面失透は、例えば600℃に加熱した若
干の水蒸気を含有する雰囲気で行うものであり、これに
よシグレーズ層の表面に微細な凹凸が出来る。Surface devitrification by heat treatment is carried out in an atmosphere heated to, for example, 600° C. and containing some water vapor, and this creates fine irregularities on the surface of the glaze layer.
以上のようにして粗面化したグレーズ層上に、(5)
発熱体4と導体リード線3を、蒸着及びフォトエツチン
グ法を用いて形成した後、保護膜5をスパッタにより形
成してサーマルヘッドとする。On the glaze layer whose surface has been roughened as described above, (5) a heating element 4 and a conductor lead wire 3 are formed by vapor deposition and photoetching, and then a protective film 5 is formed by sputtering to form a thermal head. shall be.
以上のように構成された本実施例のサーマルヘッドは、
下地のグレーズ層2と発熱体4の付着強度が強いために
熱衝撃に強く、したがって耐久性に強いものである。The thermal head of this embodiment configured as described above is
Since the adhesive strength between the underlying glaze layer 2 and the heating element 4 is strong, it is resistant to thermal shock and therefore has high durability.
々お、表面粗さは、Raが0.01μm〜02μmの範
囲が良く、それよりも平滑表面では付着強度が小さいた
め効果が少く、またそれよシも粗く々ると、発熱体膜が
0.1〜1μm程度の厚みであるから発熱体膜そのもの
にキズ、クラック、ピンホール等の欠陥が出易くカシ、
不適当である。Regarding the surface roughness, Ra is preferably in the range of 0.01 μm to 0.02 μm. If the surface is smoother than that, the adhesion strength will be lower and the effect will be less, and if the surface is rougher than that, the heating element film will be 0.01 μm to 0.02 μm. Since the thickness is approximately 1 to 1 μm, defects such as scratches, cracks, and pinholes are likely to occur on the heating element membrane itself.
It's inappropriate.
(発明の効果)
以上説明したように、本発明によれば、グレーズ層の表
面を粗面化することにより、その上に形成する発熱体の
接着強度が強くカシ、従って、熱衝撃による発熱体の欠
落も発生せず、サーマルヘッドとしての耐久性及び信頼
性を向上することができる利点がある。(Effects of the Invention) As explained above, according to the present invention, by roughening the surface of the glaze layer, the adhesive strength of the heating element formed thereon is strong, and therefore the heating element due to thermal shock is This has the advantage that the durability and reliability of the thermal head can be improved without any occurrence of chipping.
(6)(6)
第1図及び第2図は、それぞれ一般的なサーマルヘッド
の構成図である。
1・・・基板、2・・・グレーズ層、3・・・導体リー
ド線、4・・・発熱体、5・・・保護膜。
(7)
第1図
第2図FIGS. 1 and 2 are configuration diagrams of common thermal heads, respectively. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Glaze layer, 3... Conductor lead wire, 4... Heating element, 5... Protective film. (7) Figure 1 Figure 2
Claims (1)
成し、そのグレーズ層上に発熱体を形成して々るサーマ
ルヘッドにおいて、発熱体形成前の前記グレーズ層の表
面粗さRaを0.01〜02μmとしたことを特徴とす
るサーマルヘッド。 (2) グレーズ層が、結晶化ガラスからなることを特
徴とする特許請求の範囲第(1)項記載のサーマルヘッ
ド。 (3ン グレーズ層が、グレーズ処理後に化学研摩を施
されてなることを特徴とする特許請求の範囲第(1)項
記載のサーマルヘッド。 (4)グレーズ層が、グレーズ処理後に熱処理による表
面失透を施されてなることを特徴とする特許請求の範囲
第(1)項記載のサーマルヘッド。[Scope of Claims] (1) In a thermal head in which a glaze layer is formed on the entire surface or part of an insulating substrate and a heating element is formed on the glaze layer, the surface of the glaze layer before the heating element is formed. A thermal head characterized in that the roughness Ra is 0.01 to 02 μm. (2) The thermal head according to claim (1), wherein the glaze layer is made of crystallized glass. (3) The thermal head according to claim (1), characterized in that the glaze layer is subjected to chemical polishing after the glaze treatment. (4) The glaze layer has surface loss due to heat treatment after the glaze treatment. The thermal head according to claim 1, wherein the thermal head is transparent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59065963A JPS60210469A (en) | 1984-04-04 | 1984-04-04 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59065963A JPS60210469A (en) | 1984-04-04 | 1984-04-04 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60210469A true JPS60210469A (en) | 1985-10-22 |
Family
ID=13302151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59065963A Pending JPS60210469A (en) | 1984-04-04 | 1984-04-04 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60210469A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62103158A (en) * | 1985-10-30 | 1987-05-13 | Futaki Itsuo | Thermal head |
JP2011025417A (en) * | 2009-07-21 | 2011-02-10 | Seiko Instruments Inc | Manufacturing method for thermal head, thermal head and printer |
JPWO2021200869A1 (en) * | 2020-03-31 | 2021-10-07 |
-
1984
- 1984-04-04 JP JP59065963A patent/JPS60210469A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62103158A (en) * | 1985-10-30 | 1987-05-13 | Futaki Itsuo | Thermal head |
JP2011025417A (en) * | 2009-07-21 | 2011-02-10 | Seiko Instruments Inc | Manufacturing method for thermal head, thermal head and printer |
US8212849B2 (en) | 2009-07-21 | 2012-07-03 | Seiko Instruments Inc. | Thermal head, manufacturing method therefor, and printer |
JPWO2021200869A1 (en) * | 2020-03-31 | 2021-10-07 | ||
WO2021200869A1 (en) * | 2020-03-31 | 2021-10-07 | 京セラ株式会社 | Thermal head and thermal printer |
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