JPH01118437U - - Google Patents
Info
- Publication number
- JPH01118437U JPH01118437U JP1415188U JP1415188U JPH01118437U JP H01118437 U JPH01118437 U JP H01118437U JP 1415188 U JP1415188 U JP 1415188U JP 1415188 U JP1415188 U JP 1415188U JP H01118437 U JPH01118437 U JP H01118437U
- Authority
- JP
- Japan
- Prior art keywords
- chips
- package
- semiconductor device
- substrate
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1415188U JPH01118437U (ko) | 1988-02-04 | 1988-02-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1415188U JPH01118437U (ko) | 1988-02-04 | 1988-02-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01118437U true JPH01118437U (ko) | 1989-08-10 |
Family
ID=31225094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1415188U Pending JPH01118437U (ko) | 1988-02-04 | 1988-02-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01118437U (ko) |
-
1988
- 1988-02-04 JP JP1415188U patent/JPH01118437U/ja active Pending
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