JPH01176950U - - Google Patents

Info

Publication number
JPH01176950U
JPH01176950U JP1988073502U JP7350288U JPH01176950U JP H01176950 U JPH01176950 U JP H01176950U JP 1988073502 U JP1988073502 U JP 1988073502U JP 7350288 U JP7350288 U JP 7350288U JP H01176950 U JPH01176950 U JP H01176950U
Authority
JP
Japan
Prior art keywords
package
positioning groove
semiconductor
stacked
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988073502U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988073502U priority Critical patent/JPH01176950U/ja
Publication of JPH01176950U publication Critical patent/JPH01176950U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1988073502U 1988-06-01 1988-06-01 Pending JPH01176950U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988073502U JPH01176950U (ko) 1988-06-01 1988-06-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988073502U JPH01176950U (ko) 1988-06-01 1988-06-01

Publications (1)

Publication Number Publication Date
JPH01176950U true JPH01176950U (ko) 1989-12-18

Family

ID=31298644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988073502U Pending JPH01176950U (ko) 1988-06-01 1988-06-01

Country Status (1)

Country Link
JP (1) JPH01176950U (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030001032A (ko) * 2001-06-28 2003-01-06 동부전자 주식회사 멀티 스택형 패키지의 실장 구조
KR20030057186A (ko) * 2001-12-28 2003-07-04 동부전자 주식회사 반도체패키지 및 그 제조 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030001032A (ko) * 2001-06-28 2003-01-06 동부전자 주식회사 멀티 스택형 패키지의 실장 구조
KR20030057186A (ko) * 2001-12-28 2003-07-04 동부전자 주식회사 반도체패키지 및 그 제조 방법

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