JPH01118429A - 熱可塑性樹脂発泡体の製造方法及び成形型 - Google Patents

熱可塑性樹脂発泡体の製造方法及び成形型

Info

Publication number
JPH01118429A
JPH01118429A JP62275848A JP27584887A JPH01118429A JP H01118429 A JPH01118429 A JP H01118429A JP 62275848 A JP62275848 A JP 62275848A JP 27584887 A JP27584887 A JP 27584887A JP H01118429 A JPH01118429 A JP H01118429A
Authority
JP
Japan
Prior art keywords
mold
holes
foam
resin
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62275848A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0518705B2 (OSRAM
Inventor
Takeshi Saburi
佐部利　武司
Chukei Fuyuki
冬木　忠敬
Motoharu Onishi
大西　基晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Kasei Co Ltd
Original Assignee
Sekisui Plastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Plastics Co Ltd filed Critical Sekisui Plastics Co Ltd
Priority to JP62275848A priority Critical patent/JPH01118429A/ja
Publication of JPH01118429A publication Critical patent/JPH01118429A/ja
Publication of JPH0518705B2 publication Critical patent/JPH0518705B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Molding Of Porous Articles (AREA)
JP62275848A 1987-11-02 1987-11-02 熱可塑性樹脂発泡体の製造方法及び成形型 Granted JPH01118429A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62275848A JPH01118429A (ja) 1987-11-02 1987-11-02 熱可塑性樹脂発泡体の製造方法及び成形型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62275848A JPH01118429A (ja) 1987-11-02 1987-11-02 熱可塑性樹脂発泡体の製造方法及び成形型

Publications (2)

Publication Number Publication Date
JPH01118429A true JPH01118429A (ja) 1989-05-10
JPH0518705B2 JPH0518705B2 (OSRAM) 1993-03-12

Family

ID=17561277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62275848A Granted JPH01118429A (ja) 1987-11-02 1987-11-02 熱可塑性樹脂発泡体の製造方法及び成形型

Country Status (1)

Country Link
JP (1) JPH01118429A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6940164B1 (en) * 2000-08-18 2005-09-06 Mitsubishi Denki Kabushiki Kaisha Power module
JP2022513582A (ja) * 2018-10-25 2022-02-09 ヒコング コング ベンチレーテッド、スタッカブル、プレス型

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6940164B1 (en) * 2000-08-18 2005-09-06 Mitsubishi Denki Kabushiki Kaisha Power module
JP2022513582A (ja) * 2018-10-25 2022-02-09 ヒコング コング ベンチレーテッド、スタッカブル、プレス型

Also Published As

Publication number Publication date
JPH0518705B2 (OSRAM) 1993-03-12

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