JPH01115246U - - Google Patents

Info

Publication number
JPH01115246U
JPH01115246U JP1988011003U JP1100388U JPH01115246U JP H01115246 U JPH01115246 U JP H01115246U JP 1988011003 U JP1988011003 U JP 1988011003U JP 1100388 U JP1100388 U JP 1100388U JP H01115246 U JPH01115246 U JP H01115246U
Authority
JP
Japan
Prior art keywords
resin
power transistor
metal plate
semiconductor pellet
sealed power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988011003U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988011003U priority Critical patent/JPH01115246U/ja
Publication of JPH01115246U publication Critical patent/JPH01115246U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1988011003U 1988-01-28 1988-01-28 Pending JPH01115246U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988011003U JPH01115246U (enExample) 1988-01-28 1988-01-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988011003U JPH01115246U (enExample) 1988-01-28 1988-01-28

Publications (1)

Publication Number Publication Date
JPH01115246U true JPH01115246U (enExample) 1989-08-03

Family

ID=31219172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988011003U Pending JPH01115246U (enExample) 1988-01-28 1988-01-28

Country Status (1)

Country Link
JP (1) JPH01115246U (enExample)

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