JPS61117260U - - Google Patents

Info

Publication number
JPS61117260U
JPS61117260U JP1985000733U JP73385U JPS61117260U JP S61117260 U JPS61117260 U JP S61117260U JP 1985000733 U JP1985000733 U JP 1985000733U JP 73385 U JP73385 U JP 73385U JP S61117260 U JPS61117260 U JP S61117260U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor device
recess
mounting surface
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985000733U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985000733U priority Critical patent/JPS61117260U/ja
Publication of JPS61117260U publication Critical patent/JPS61117260U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1985000733U 1985-01-08 1985-01-08 Pending JPS61117260U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985000733U JPS61117260U (enExample) 1985-01-08 1985-01-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985000733U JPS61117260U (enExample) 1985-01-08 1985-01-08

Publications (1)

Publication Number Publication Date
JPS61117260U true JPS61117260U (enExample) 1986-07-24

Family

ID=30472842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985000733U Pending JPS61117260U (enExample) 1985-01-08 1985-01-08

Country Status (1)

Country Link
JP (1) JPS61117260U (enExample)

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