JPH01111869A - Barrel type ion plating device - Google Patents
Barrel type ion plating deviceInfo
- Publication number
- JPH01111869A JPH01111869A JP26631287A JP26631287A JPH01111869A JP H01111869 A JPH01111869 A JP H01111869A JP 26631287 A JP26631287 A JP 26631287A JP 26631287 A JP26631287 A JP 26631287A JP H01111869 A JPH01111869 A JP H01111869A
- Authority
- JP
- Japan
- Prior art keywords
- rotating body
- arc discharge
- metal
- evaporation source
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007733 ion plating Methods 0.000 title claims description 4
- 238000001704 evaporation Methods 0.000 claims abstract description 25
- 230000008020 evaporation Effects 0.000 claims abstract description 25
- 238000010891 electric arc Methods 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000010408 film Substances 0.000 abstract description 8
- 230000015572 biosynthetic process Effects 0.000 abstract description 6
- 239000010409 thin film Substances 0.000 abstract description 6
- 239000000498 cooling water Substances 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、イオンプレーティング装置に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an ion plating apparatus.
バレル式薄膜形成装置の従来技術としては、例えば第４
図に示す特開昭５８−７７５７１号公報がある。As a conventional technology of barrel type thin film forming apparatus, for example,
There is Japanese Unexamined Patent Publication No. 58-77571 as shown in the figure.
真空にされた真空槽２１の内部には、上方に網目状の箔
体２０が回転自在に取付けられ、下方に蒸発源２３が取
付けられている。網目状の箔体２０の内部に多数収納さ
れた工作物２４の表面は、下方の蒸発源２６よりの蒸発
金属が網目の一部を通過して被膜が形成される。Inside the evacuated vacuum chamber 21, a mesh foil body 20 is rotatably attached to the upper part, and an evaporation source 23 is attached to the lower part. A film is formed on the surface of a large number of workpieces 24 housed inside the mesh foil body 20 as evaporated metal from the evaporation source 26 below passes through a portion of the mesh.
しかしながら従来のバレル式薄膜形成装置に於ては、網
目状の箔体２０の内部に工作物２４があるため下方にあ
る蒸発源２３よりの蒸発金属が網目に耐着してしまい、
箔体２０の内部にある工作物２４への被膜形成効率が著
しく悪くなる。その結果工作物２４に形成した被膜厚に
バラツキが太き（１色ムラを生じやすい。その上、蒸発
金属のムダが太き（コストアップの原因にもなっている
。However, in the conventional barrel-type thin film forming apparatus, since the workpiece 24 is inside the mesh-like foil body 20, the evaporated metal from the evaporation source 23 located below is stuck to the mesh.
The efficiency of forming a coating on the workpiece 24 inside the foil body 20 is significantly reduced. As a result, the thickness of the coating formed on the workpiece 24 is highly uneven (one-color unevenness is likely to occur).Furthermore, the evaporated metal is wasted (which is also a cause of increased costs).
また、蒸発源２３は金属が溶融しているので、蒸発源２
６を奮め方向や下向き等自由に変えることができず、工
作物２４への被膜形成効率を上げることができない欠点
も有している。In addition, since the evaporation source 23 has molten metal, the evaporation source 23
6 cannot be freely changed such as upward direction or downward direction, and also has the drawback that the efficiency of forming a coating on the workpiece 24 cannot be increased.
本発明は上記の様な欠点を解決し、製品を大量にしかも
被膜形成効率が高（、均一で密着性の高い被膜を形成さ
せることを目的とするものである。The purpose of the present invention is to solve the above-mentioned drawbacks and to form a product in large quantities with high film formation efficiency (uniform and highly adhesive film).
本発明の構成は、電極と蒸発金属とが一体で。 The structure of the present invention is that the electrode and the evaporated metal are integrated.
冷却され、負電位が印加されるアーク放電蒸発源と、処
理物入れで、摺動接点により負のバイアスが印加される
回転体とよりなり、該回転体の内部に前記アーク放電蒸
発源を配設し、該アーク放電蒸発源を略中心に前記回転
体が回転または揺動する。It consists of an arc discharge evaporation source that is cooled and to which a negative potential is applied, and a rotating body to which a negative bias is applied by a sliding contact in a processing material container, and the arc discharge evaporation source is disposed inside the rotating body. The rotating body rotates or swings approximately around the arc discharge evaporation source.
以下、本発明の一実施例を図面により詳細に説明する。 Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
第１図は、本発明の一実施例であるバレル式イオンプレ
ーティング装置の断面図である。第２図は第１図の回転
体の要部斜視図である。FIG. 1 is a sectional view of a barrel-type ion plating apparatus that is an embodiment of the present invention. FIG. 2 is a perspective view of a main part of the rotor shown in FIG. 1.
真空槽１の中央部に、略円胴形で一端に略同心に回転軸
１１を設けた網目状の回転体２を配設し、該回転体２０
回転軸１１は軸受８を介したうえモーター乙に軸設され
ている。A mesh-like rotating body 2 having a substantially cylindrical shape and having a rotating shaft 11 provided substantially concentrically at one end is disposed in the center of the vacuum chamber 1.
The rotating shaft 11 is mounted on the motor B via a bearing 8.
前記回転体２の他端は支持台９と該支持台９に内設され
た摺動接点であるローラ１０により支えられ、前記モー
ター３により回転体２は回転又は揺動自在に構成されて
いる。The other end of the rotating body 2 is supported by a support stand 9 and a roller 10 which is a sliding contact installed inside the support stand 9, and the rotary body 2 is configured to be rotatable or swingable by the motor 3. .
回転体２には支持台９及びローラ１０より負のバイアス
が印加される。一方、アーク放電蒸発源４は、銅製の電
極４ａと蒸発金属４ｂとが一体になっている。アーク放
電蒸発源４の電極４ａと蒸発金属４ｂの接合面には冷却
水が通るように一本の水路が形成されており、該水路に
接続された水冷銅管６より冷却水が導入され、該水路を
冷却水が通ることによりアーク放電蒸発源５が冷却され
る。水路を通った冷却水は水冷銅管６より排水される。A negative bias is applied to the rotating body 2 from the support base 9 and the rollers 10 . On the other hand, the arc discharge evaporation source 4 is made up of an electrode 4a made of copper and an evaporation metal 4b. A water channel is formed at the joint surface of the electrode 4a and the evaporation metal 4b of the arc discharge evaporation source 4 so that cooling water can pass therethrough, and the cooling water is introduced from a water-cooled copper pipe 6 connected to the water channel. The arc discharge evaporation source 5 is cooled by the cooling water passing through the water channel. The cooling water that has passed through the water channel is drained from the water-cooled copper pipe 6.
該アーク放電蒸発源５は前記回転体２の内部に配設され
、電極４ａに負電位が印加される。The arc discharge evaporation source 5 is arranged inside the rotating body 2, and a negative potential is applied to the electrode 4a.
ボルト、ナツト等の小物の処理物７は回転体２の内部に
入れられ、該回転体２と接触することにより負のバイア
スが印加されることになる。また真空槽１はアース電位
となっている。Small items to be processed 7 such as bolts and nuts are placed inside the rotating body 2, and a negative bias is applied by contacting the rotating body 2. Further, the vacuum chamber 1 is at ground potential.
次に、アーク放電を利用して蒸発金属４ｂを蒸発、イオ
ン化し、処理物７の表面に薄膜を形成させる。この時１
回転体２が回転又は揺動するため処理物７は撹乱され、
該処理物７の表面には均一で密着性の高い薄膜が効率良
（形成される。Next, the evaporated metal 4b is evaporated and ionized using arc discharge to form a thin film on the surface of the object 7. At this time 1
As the rotating body 2 rotates or oscillates, the processed material 7 is disturbed,
A uniform and highly adhesive thin film is efficiently formed on the surface of the treated object 7.
又、前記回転体２が回転状態にある場合、該回転体２の
内部に収納されている処理物７は、第３図に示すごと（
下部の回転方向に集中する。Further, when the rotating body 2 is in a rotating state, the processing object 7 stored inside the rotating body 2 is rotated as shown in FIG.
Concentrate on the direction of rotation at the bottom.
そのため、より一層被膜形成効率を向上させるＫは、ア
ーク放電蒸発源４を処理物７の方向、即ち斜め下方へ向
きを持たせる。Therefore, K, which further improves the film formation efficiency, causes the arc discharge evaporation source 4 to be oriented in the direction of the processing object 7, that is, diagonally downward.
また、アーク放電蒸発源４は蒸発金属４ｂが溶融してい
ないので、処理物７の仕様、回転体の形状等の条件によ
り位置及び方向を自在に設定することができる。In addition, since the evaporated metal 4b of the arc discharge evaporation source 4 is not melted, the position and direction can be freely set depending on conditions such as the specifications of the object 7 and the shape of the rotating body.
尚、回転体２は網目状ではな（、ドラム状の物を用いる
こともできる。又、真空槽１の内部条件として真空度１
０−” ｔｏｒｒ−１０−’ ｔｃ）ｒｒ で、不活性
ガスとしてＡｒ１反応性ガスとしてＮ２゜０２、Ｃ，Ｉ
−Ｉ、等を用い、蒸発金属４ｂとしてＴｉ又はＨｒ又は
２「等の金属を用いる。Note that the rotating body 2 is not mesh-shaped (or a drum-shaped body can also be used. Also, the internal condition of the vacuum chamber 1 is that the degree of vacuum is 1.
0-” torr-10-' tc)rr, Ar as inert gas, N2 as reactive gas, C, I
-I, etc., and a metal such as Ti or Hr or 2' is used as the evaporation metal 4b.
以上の説明で明らかなように１本発明によればアーク放
電蒸発源が回転体の内部にあるため、°蒸発金属と処理
物の間には、成膜を阻害する障害物がなく、その上、処
理物の仕様や種々の条件によりアーク放電蒸発源を斜め
、又は下方に自由自在な方向に調整が出来るので、被膜
形成効率がよ（、処理物を大量に均一で密着性の高い被
膜を形成することができる。As is clear from the above explanation, 1.According to the present invention, since the arc discharge evaporation source is located inside the rotating body, there are no obstacles between the evaporated metal and the material to be processed that would hinder film formation; The arc discharge evaporation source can be adjusted diagonally or downward depending on the specifications of the material to be treated and various conditions, increasing film formation efficiency (allowing a large amount of material to be processed to be coated with a uniform and highly adhesive film). can be formed.
第１図から第３図は本発明の実施例で、第１図回転体の
側面図、第４図は従来のバレル式薄膜形成装置の断面図
。
１・・・・・・真空槽、
２・・・・・・回転体、
３・・・・・・モーター、
４・・・・・・アーク放電蒸発源、
４ａ・・・・・・電極、
４ｂ・・・・・・蒸発金属、
６・・・・・・水冷鋼管、
７・・・・・・処理物、
８・・・・・・軸受、
９・・・・・・支持台、
１０・・・・・・ローラ。
１１・・・・・・回転軸。
特許出願人 シチズン時計株式会社
第 ２ 図1 to 3 show embodiments of the present invention; FIG. 1 is a side view of a rotating body, and FIG. 4 is a sectional view of a conventional barrel-type thin film forming apparatus. 1... Vacuum chamber, 2... Rotating body, 3... Motor, 4... Arc discharge evaporation source, 4a... Electrode, 4b... Evaporated metal, 6... Water-cooled steel pipe, 7... Treated object, 8... Bearing, 9... Support stand, 10 ······roller. 11...Rotation axis. Patent applicant Citizen Watch Co., Ltd. Figure 2
Claims (1)
るアーク放電蒸発源と、処理物入れで摺動接点により負
のバイアスが印加される回転体とよりなり、該回転体の
内部に前記アーク放電蒸発源を配設し、該アーク放電蒸
発源を略中心に前記回転体が回転又は揺動することを特
徴とするバレル式イオンプレーティング装置。It consists of an arc discharge evaporation source in which the electrode and the evaporated metal are integrally cooled and a negative potential is applied, and a rotating body to which a negative bias is applied by a sliding contact in the processing object container. 1. A barrel-type ion plating apparatus, characterized in that an arc discharge evaporation source is provided, and the rotating body rotates or oscillates approximately around the arc discharge evaporation source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26631287A JPH01111869A (en) | 1987-10-23 | 1987-10-23 | Barrel type ion plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26631287A JPH01111869A (en) | 1987-10-23 | 1987-10-23 | Barrel type ion plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01111869A true JPH01111869A (en) | 1989-04-28 |
Family
ID=17429177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26631287A Pending JPH01111869A (en) | 1987-10-23 | 1987-10-23 | Barrel type ion plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01111869A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012211395A (en) * | 2005-03-18 | 2012-11-01 | Ulvac Japan Ltd | Deposition apparatus |
| ITRM20110237A1 (en) * | 2011-05-13 | 2012-11-14 | Romana Film Sottili S R L | ROTOBARILE WITH INTERNAL SOURCE FOR VACUUM DEPOSITION OF THIN FILMS WITH ION PLATING |
-
1987
- 1987-10-23 JP JP26631287A patent/JPH01111869A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012211395A (en) * | 2005-03-18 | 2012-11-01 | Ulvac Japan Ltd | Deposition apparatus |
| US8771422B2 (en) | 2005-03-18 | 2014-07-08 | Ulvac, Inc. | Coating method and apparatus, a permanent magnet, and manufacturing method thereof |
| ITRM20110237A1 (en) * | 2011-05-13 | 2012-11-14 | Romana Film Sottili S R L | ROTOBARILE WITH INTERNAL SOURCE FOR VACUUM DEPOSITION OF THIN FILMS WITH ION PLATING |
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