JPH01111605A - Packing apparatus - Google Patents

Abstract

PURPOSE:To permit an accurate reception of contents by attracting a part of the content by a magnet provided in the opposing position, upon insertion of the content in a packing material receiving portion by retaining means. CONSTITUTION:Carrier tape 4 is fed at a pitch from a reel 11 by a plurality of sprockets 13. A MPAK transistor 1 to be packed is adhered to a suction head 16 by the sucking force and an electromagnet 15 is sent to directly above an opposing receiving hole 6. Upon releasing of the sucking force, the transistor 1 is dropped and a lead 3 of the transistor 1 is attracted by the energized electromagnet 15, so that the transistor is located in a proper position of the receiving hole 6. At the back of the received 1 position of the transistor 1, cover tape 7 is placed over the carrier tape 4 by a feeding device 20 in such manner as to close the receiving hole 6 and a heat bonding head 23 is then closed and heated for heat adhesion between the two tapes 4 and 7. After completion of the heat adhesion, the heat bonding head 23 is opened to restart the pitch feeding of the carrier tape 4.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to packaging technology, particularly technology for packaging small items such as electronic components. Type package (MPAK
) (hereinafter referred to as MPAKI-transistor or transistor).

[Conventional technology]

In the manufacturing process of semiconductor devices, the packaging equipment for packaging MPAK transistors is used to hold the transistors to be packed using a vacuum suction head, transport them to a predetermined location on the carrier tape, and then insert them into the receiving holes formed in the carrier tape. Some are configured to be packaged by dropping the transistor into the carrier tape and then gluing the transistor containing the cover tape onto the carrier tape so that the transistor is covered.

In this way, by storing transistors one by one into the storage hole of the carrier tape and packing them regularly, the transistors can be easily placed in the carrier tape when the transistor user is assembling the transistor to mount it on a printed wiring board, etc. Since they are regularly arranged, parts insertion work can be easily automated.

An example of the technology for supplying components using the tape carrier method is "Introduction to Automatic Assembly of Electronic Components" published by Nikkan Kogyo Shimbun, published on July 30, 1980, pages 45 to 47.
There is.

[Problem that the invention seeks to solve]

In such a packaging device, MP as an object to be packed is
Because insufficient consideration was given to whether the AK transistor was accurately dropped into the housing formed in the carrier tape, the leads of the transistor could get caught on the edge of the housing hole or on the side wall of the housing hole. The present inventors have discovered that there is a problem in that the cover tape is left unadhered, resulting in failure to take out the transistor when trying to take out the housed transistor from the housing part with a suction head during the transistor assembly process. revealed by.

SUMMARY OF THE INVENTION An object of the present invention is to provide a packaging device that can accurately accommodate items to be packed in a storage section.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

An overview of typical inventions disclosed in this application is as follows.

That is, a feeding means for feeding the itgI packaging material in which a storage part for storing the object to be packed is formed, a holder for holding the object to be packed and inserting it into the storage part of the first packaging material, and a first packaging material. a feeding means for feeding a second packing material to be deposited on top of the packing material to cover the object to be packaged in the storage section;
A magnet is provided so as to face each other across the packaging material accommodating part and to attract a part of the item to be packed.

[Effect]

According to the above-mentioned means, when the object to be packed is inserted into the storage section of the first packing material by the holder, the magnet attracts a part of the object to be packed and guides it accurately into the storage section. The packaged items will be accurately accommodated without getting caught in the accommodating section.

〔Example〕

Fig. 1 is an enlarged partial side sectional view showing a packaging device for MF'AK transistors which is an embodiment of the present invention, Fig. 2 is a schematic partially cutaway front view showing its overall view, and Fig. 3 is an enlarged view thereof. FIG. 4 is a partial plan view, FIG. 4 is an enlarged partial perspective view, and FIG. 5 is an enlarged partial sectional view for explaining its operation.

In this embodiment, this packaging device is configured to pack the MPAK transistor 1 using a carrier tape as a first packaging material and a cover tape as a second packaging material. The MPAK transistor 1 as an object to be packaged includes a resin-sealed package 2 made of resin and formed into a substantially rectangular parallelepiped. The leads 3 formed into a gull wing shape are divided into three parts, two parts, and one part, which are respectively protruded and recessed.

The carrier tape 4, which serves as a packaging material, is made of a resin material such as vinyl chloride and is formed into a long tape shape with a constant width, and feed holes 5 are arranged in a row at equal intervals along one end of the carrier tape 4. It has been established. Further, the carrier tape 4 is integrally formed with an accommodating hole 6 as an accommodating portion that bulges toward the rear surface, and the accommodating hole 6 has a convex planar shape so as to accommodate the transistor 1. It is formed into a rectangular parallelepiped hole.

The cover tape 7, which serves as the other packaging material, is made of a resin material such as vinyl chloride, and is formed into a tape shape with a width that can cover the accommodation hole 6, and is bonded to the carrier tape 4 by thermocompression. I'm starting to get it.

The carrier tape 4 configured in this manner is intermittently fed in one direction by a carrier tape feeding device IO. That is, the carrier tape feeding device 10
The carrier tape 4 is provided with an empty tape reel 11 for feeding out an empty tape and a real tape reel 12 for winding a real tape, and the carrier tape 4 is stretched between both reels 11 and 12 by a plurality of sprockets 13. It has become. A plurality of sprockets 13 are engaged with feed holes 5 formed in the carrier tape 4, and are configured to pitch the carrier tape 4 in one direction by rotating a suitable sprocket. Sprocket in proper position 13.1
A tape guide 14 formed in a substantially channel shape is disposed between the carrier tapes 3 and 3 in a longitudinal direction so as to be in sliding contact with the carrier tape 4, and the tape guide 14 avoids interference with the accommodation hole 6. It is configured to be able to guide the travel of the carrier tape 4. In this tape guide I4, an electromagnet 15 is disposed at the bottom of the groove so as to face a predetermined accommodation hole 6 in the carrier tape 4 that is intermittently stopped, and this electromagnet 15 cooperates with the feeding operation of the carrier tape 4. The magnet is configured to perform excitation and demagnetization operations as described later.

Directly above where the electromagnet 15 is installed, a suction head 16 as a holder is attached to a suitable transfer device i! (not shown), the suction head 16 holds and transfers the upper surface of the pan cage 2 of the transistor 1 by vacuum suction, and then releases the vacuum suction. , is configured to be able to release its hold.

On the other hand, the cover tape 7 is fed in one direction by a cover tape feeding device 20 along the carrier tape 4 in which the transistor 1 is accommodated. That is,
The cover tape feeding device 20 is equipped with a cover tape reel 21 that feeds out a new tape, and the cover tape 7 fed out from this reel 21 passes through a plurality of guide rollers 2.
2, the tape guide 14 is placed on the carrier tape 4.
They are stretched so that they overlap from the position of . A thermocompression bonding head 23 for attaching the cover tape 7 to the carrier tape 4 is disposed downstream of the position where the cover tape 7 overlaps the carrier tape 4.
3 is constructed so that both tapes 4 and 7 are bonded together by thermocompression bonding by heating the overlapped tapes 4 and 7 while sandwiching them from above and below.

Next, the effect will be explained.

The cow middle rear tape 4 is unwound from an empty tape reel 11 and is pitch-fed along the conveyance line by a group of sprockets 13.

On the other hand, after the MPAK transistors l as objects to be packaged are subjected to an electrical characteristic test using a predetermined measuring device (not shown), non-defective products are vacuum-sucked and held by the suction head 16. The suction head I6 holding the transistor 1 is transferred by a transfer device (not shown) directly above the accommodation hole 6 where the electromagnet 15 is opposed. When facing the accommodation hole 6, the vacuum suction holding of the head 16 is released, and the transistor l is dropped into the accommodation hole 6.

When the transistor 1 as an object to be packed is dropped,
Electromagnet 15 is excited. Due to the magnetic force caused by this excitation,
Since the lead 3 of the fallen transistor l is attracted, the transistor l is guided and housed in the proper position of the housing hole 6, as shown in FIG.

When the transistor 1 is dropped into the receiving hole 6, the suction head 16 is transferred to the receiving position for the next transistor 1. On the other hand, when the transistor 1 is accurately accommodated in the accommodation hole 6, the electromagnet 15 is demagnetized, and then the carrier tape feeding event r! The carrier tape 4 is pinch-fed again by 11o. At this time, since the electromagnet 15 is demagnetized, the transistor 1 in the accommodation hole 6 is not moved loosely by the magnetic force when the carrier tape 4 is pitch-fed.

Behind the position where the transistor 1 is accommodated in the accommodation hole 6 of the carrier tape 4, the cover tape 7 is superimposed on the carrier tape 4 by the feeding device 20 so as to close the accommodation hole 6 in which the transistor l has been accommodated. Go.

At the rear of the overlapping position, a thermocompression bonding head 23
is closed and heated, thereby bonding both tapes 4 and 7 together by thermocompression. After thermocompression bonding, the thermocompression bonding head 23 is opened and the carrier tape 4 is pitch-fed again. Therefore, the thermocompression bonded portions of both tapes 4 and 7 are formed in a state where they are lined up like perforations.

In this way, the MPAK transistor 1 is housed in the housing hole 6 of the carrier tape 4, and the opening of the housing hole 6 is closed and covered with the cover tape 7 attached to the carrier tape 4. It will be packaged in a completely enclosed state. Then, according to the pitch feed of the carrier tape feed device 10, the tape is gradually wound onto the actual tape reel 12.

Incidentally, in the state of this real tape reel, the first group of MPAK transistors is supplied to a user who uses the transistors, and the user automatically assembles the transistors by unwinding the real tape from this reel.

By the way, in the case of the conventional example in which the electromagnet 15 is not installed directly under the accommodation hole 6, the transistor l simply falls freely, so if the position of the suction head or the carrier tape shifts, etc., as shown in FIG. As shown in the figure, the transistor 1 is accommodated in the accommodating hole 6 with the lead 3 hooked to the side wall of the accommodating hole 6. If the cover tape 7 is applied in such a state, the walls of the housing holes 6 of the carrier tape 4 may be damaged by the leads 3.

In addition, when the user automatically assembles the transistor 1, the transistor 1 is inserted into the housing hole 6 of the carrier tape 4.
Since the transistor 1 is tilted in the accommodation hole 6 when being automatically taken out from the storage hole 6, a situation arises in which the transistor 1 cannot be picked up by the suction head for automatic taking out.

However, in this embodiment, since the electromagnet 15 is installed directly below the accommodation hole 6 into which the transistor 1 is inserted, the transistor 1 is placed in the proper position within the accommodation hole 6 by the magnetic force of the electromagnet 15. Above all, accommodation hole 6
It will be properly housed inside. As a result, the occurrence of the above-mentioned disadvantages due to poor accommodation can be avoided.

Furthermore, by accurately accommodating the transistor 1 in the accommodating hole 6, the shape of the accommodating hole 6 can be set to correspond to the external shape of the MPAK l-transistor 1. It is possible to suppress the movement in the area. As a result, the user can perform automatic assembly work more reliably.

According to the embodiment described above, the following effects can be obtained.

(1) By providing a magnet at a position facing the first packing material storage section where the object to be packed is carried out, the object to be packed can be attracted and guided by the magnetic force of the magnet. Objects can be accurately positioned within the storage section.

(2) Accurately positioning the item to be packed in the storage section prevents the adhesion of the second packaging material to the first packaging material and the resulting damage, as well as the possibility of damage during removal of the item to be packed. Since defects and the like can be prevented, the reliability of the packing operation can be increased, and an adverse effect on the unpacking operation can be avoided.

(3) By using an electromagnet as a magnet, it can be demagnetized when the carrier tape is moved, so it is possible to prevent the objects to be packaged from shifting due to magnetic force when the carrier tape is moved.

(4) By making the shape of the accommodation hole correspond to the external shape of the object to be packed, movement after accommodation can be suppressed to a minimum, so that the user can more reliably carry out automatic assembly work.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the magnet is not limited to an electromagnet; a permanent magnet may be used, or the magnet may be configured to be movable.

The first packaging material is not limited to a carrier tape, but may also be a housing hole or a carrier board having a housing hole.

The second packaging material may be used not only on one side but also on both sides.

A feeding device for the first and second packing materials, a holder for the object to be packed,
The specific configuration of the means for bonding the first packaging material and the second packaging material is not limited to the configuration according to the embodiments described above, but it is preferable to select the most suitable one according to various conditions.

In the above explanation, the invention made by the present inventor was mainly applied to the packaging technology of MPAK) transistors, which is the field of application that formed the background of the invention. It can be applied to all packaging techniques for small electronic components such as.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

By providing a magnet at a position facing the storage section of the first packaging material into which the object to be packed is inserted, the object to be packed can be attracted and guided by the magnetic force of the magnet. can be positioned accurately.

[Brief explanation of the drawing]

Fig. 1 is an enlarged partial side sectional view showing a packaging device for MPAK transistors which is an embodiment of the present invention, Fig. 2 is a schematic partially cutaway front view showing the overall view thereof, and Fig. 3 is an enlarged partial plan view thereof. FIG. 4 is an enlarged perspective view of a portion thereof, and FIG. 5 is an enlarged partial sectional view for explaining its operation. 1...MPAK) transistor (packaged item), 2...
・Package, 3...Lead, 4...Carrier tape (first packaging material), 5...Feed hole, 6...Accommodation hole (accommodation part), 7...Cover tape (first packaging material) 2 Packing materials), 1
0...Carrier tape feeding device, 11...Empty tape reel,! 2... Actual tape reel, 13... Sprocket, 14... Tape guide, 15... Electromagnet (
magnet), 16... adsorption head (holder), 20...
Cover tape feeding device, 21...Cover tape reel, 22...Sprocket, 23...Thermocompression bonding head.

Claims (3)

[Claims] 1. a feeding means for feeding a first packaging material in which a storage section for storing an object to be packed is formed; a holder for holding the object to be packed and inserting it into the storage section of the first packaging material; A feeding means for sending a second packing material that is adhered to cover the object to be packaged in the storage section, and a feeding means that faces the holder across the storage section of the first packing material at its insertion position and carries a part of the object to be packed. A packaging device characterized by comprising: a magnet arranged to be attracted. 2. 2. The packaging apparatus according to claim 1, wherein an electromagnet is used as the magnet, and is configured to be energized only when an object to be packed is inserted. 3. 2. The packaging device according to claim 1, wherein a carrier tape is used as the first packaging material, and a cover tape is used as the second packaging material.