JPH01104735U - - Google Patents
Info
- Publication number
- JPH01104735U JPH01104735U JP20008287U JP20008287U JPH01104735U JP H01104735 U JPH01104735 U JP H01104735U JP 20008287 U JP20008287 U JP 20008287U JP 20008287 U JP20008287 U JP 20008287U JP H01104735 U JPH01104735 U JP H01104735U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- chip
- heat sink
- generation density
- heat generation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20008287U JPH01104735U (enExample) | 1987-12-30 | 1987-12-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20008287U JPH01104735U (enExample) | 1987-12-30 | 1987-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104735U true JPH01104735U (enExample) | 1989-07-14 |
Family
ID=31490508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20008287U Pending JPH01104735U (enExample) | 1987-12-30 | 1987-12-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104735U (enExample) |
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1987
- 1987-12-30 JP JP20008287U patent/JPH01104735U/ja active Pending