JPH01173946U - - Google Patents
Info
- Publication number
- JPH01173946U JPH01173946U JP1988067939U JP6793988U JPH01173946U JP H01173946 U JPH01173946 U JP H01173946U JP 1988067939 U JP1988067939 U JP 1988067939U JP 6793988 U JP6793988 U JP 6793988U JP H01173946 U JPH01173946 U JP H01173946U
- Authority
- JP
- Japan
- Prior art keywords
- chamfered
- electronic component
- carrier type
- chip carrier
- lower corner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988067939U JPH01173946U (enExample) | 1988-05-25 | 1988-05-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988067939U JPH01173946U (enExample) | 1988-05-25 | 1988-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01173946U true JPH01173946U (enExample) | 1989-12-11 |
Family
ID=31293276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988067939U Pending JPH01173946U (enExample) | 1988-05-25 | 1988-05-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01173946U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03184384A (ja) * | 1989-12-13 | 1991-08-12 | Nec Corp | 光モジュール用サブマウント及びその製造方法 |
| JP2000164755A (ja) * | 1998-11-25 | 2000-06-16 | Kyocera Corp | 高周波回路用パッケージ |
-
1988
- 1988-05-25 JP JP1988067939U patent/JPH01173946U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03184384A (ja) * | 1989-12-13 | 1991-08-12 | Nec Corp | 光モジュール用サブマウント及びその製造方法 |
| JP2000164755A (ja) * | 1998-11-25 | 2000-06-16 | Kyocera Corp | 高周波回路用パッケージ |