JPH01104723U - - Google Patents

Info

Publication number
JPH01104723U
JPH01104723U JP1987201374U JP20137487U JPH01104723U JP H01104723 U JPH01104723 U JP H01104723U JP 1987201374 U JP1987201374 U JP 1987201374U JP 20137487 U JP20137487 U JP 20137487U JP H01104723 U JPH01104723 U JP H01104723U
Authority
JP
Japan
Prior art keywords
rotary holder
thermocompression
rotary
semiconductor pellet
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987201374U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987201374U priority Critical patent/JPH01104723U/ja
Publication of JPH01104723U publication Critical patent/JPH01104723U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79Apparatus for Tape Automated Bonding [TAB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1987201374U 1987-12-28 1987-12-28 Pending JPH01104723U (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987201374U JPH01104723U (OSRAM) 1987-12-28 1987-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987201374U JPH01104723U (OSRAM) 1987-12-28 1987-12-28

Publications (1)

Publication Number Publication Date
JPH01104723U true JPH01104723U (OSRAM) 1989-07-14

Family

ID=31491738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987201374U Pending JPH01104723U (OSRAM) 1987-12-28 1987-12-28

Country Status (1)

Country Link
JP (1) JPH01104723U (OSRAM)

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