JPS61203564U - - Google Patents

Info

Publication number
JPS61203564U
JPS61203564U JP1985088034U JP8803485U JPS61203564U JP S61203564 U JPS61203564 U JP S61203564U JP 1985088034 U JP1985088034 U JP 1985088034U JP 8803485 U JP8803485 U JP 8803485U JP S61203564 U JPS61203564 U JP S61203564U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
islands
lead frame
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985088034U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985088034U priority Critical patent/JPS61203564U/ja
Publication of JPS61203564U publication Critical patent/JPS61203564U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP1985088034U 1985-06-11 1985-06-11 Pending JPS61203564U (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985088034U JPS61203564U (OSRAM) 1985-06-11 1985-06-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985088034U JPS61203564U (OSRAM) 1985-06-11 1985-06-11

Publications (1)

Publication Number Publication Date
JPS61203564U true JPS61203564U (OSRAM) 1986-12-22

Family

ID=30640795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985088034U Pending JPS61203564U (OSRAM) 1985-06-11 1985-06-11

Country Status (1)

Country Link
JP (1) JPS61203564U (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7229715B2 (en) 2003-06-17 2007-06-12 The Gillette Company Anode for battery
US7247407B2 (en) 1997-08-01 2007-07-24 The Gillette Company Electrode having modal distribution of zinc-based particles

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7247407B2 (en) 1997-08-01 2007-07-24 The Gillette Company Electrode having modal distribution of zinc-based particles
US7579113B2 (en) 1997-08-01 2009-08-25 The Gillette Company Electrode having modal distribution of zinc-based particles
US7229715B2 (en) 2003-06-17 2007-06-12 The Gillette Company Anode for battery

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