JPH01104028U - - Google Patents

Info

Publication number
JPH01104028U
JPH01104028U JP19819087U JP19819087U JPH01104028U JP H01104028 U JPH01104028 U JP H01104028U JP 19819087 U JP19819087 U JP 19819087U JP 19819087 U JP19819087 U JP 19819087U JP H01104028 U JPH01104028 U JP H01104028U
Authority
JP
Japan
Prior art keywords
block
runner
resin
cavity
sealing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19819087U
Other languages
English (en)
Other versions
JPH058677Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987198190U priority Critical patent/JPH058677Y2/ja
Publication of JPH01104028U publication Critical patent/JPH01104028U/ja
Application granted granted Critical
Publication of JPH058677Y2 publication Critical patent/JPH058677Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す要部斜視図、
第２図はプツシヤブロツクの縦断面図、第３図は
従来例を示すものである。 １：定盤、２：キヤビテイブロツク、２ａ：キ
ヤビテイ、３：ランナブロツク、３ａ：カル、３
ｂ：ランナ、３ｃ：ノツクピン、５：プツシヤブ
ロツク、６：補助プレート、７：チヤンバ、７ａ
：ヘツド、７ｂ：スプリング、７ｃ：スクリユー
、Ａ：弾性機構。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂が流れるランナを形成したランナブロツク
    及び前記ランナからの樹脂を受けて製品として成
    形するキヤビテイブロツクをそれぞれ上型及び下
    型に備えた樹脂封止装置であつて、前記キヤビテ
    イブロツクを前記ランナブロツクに接合する方向
    へ押圧するプツシヤブロツクを、前記キヤビテイ
    ブロツクに連接配置したことを特徴とする半導体
    装置の樹脂封止装置。
JP1987198190U 1987-12-25 1987-12-25 Expired - Lifetime JPH058677Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987198190U JPH058677Y2 (ja) 1987-12-25 1987-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987198190U JPH058677Y2 (ja) 1987-12-25 1987-12-25

Publications (2)

Publication Number Publication Date
JPH01104028U true JPH01104028U (ja) 1989-07-13
JPH058677Y2 JPH058677Y2 (ja) 1993-03-04

Family

ID=31488711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987198190U Expired - Lifetime JPH058677Y2 (ja) 1987-12-25 1987-12-25

Country Status (1)

Country Link
JP (1) JPH058677Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5866639U (ja) * 1981-10-27 1983-05-06 日本電気株式会社 半導体集積回路用樹脂モ−ルド金型

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5866639U (ja) * 1981-10-27 1983-05-06 日本電気株式会社 半導体集積回路用樹脂モ−ルド金型

Also Published As

Publication number Publication date
JPH058677Y2 (ja) 1993-03-04

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