JPH01103272U - - Google Patents
Info
- Publication number
- JPH01103272U JPH01103272U JP20067087U JP20067087U JPH01103272U JP H01103272 U JPH01103272 U JP H01103272U JP 20067087 U JP20067087 U JP 20067087U JP 20067087 U JP20067087 U JP 20067087U JP H01103272 U JPH01103272 U JP H01103272U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- molten solder
- land
- solder
- mounted component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20067087U JPH01103272U (de) | 1987-12-28 | 1987-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20067087U JPH01103272U (de) | 1987-12-28 | 1987-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01103272U true JPH01103272U (de) | 1989-07-12 |
Family
ID=31491066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20067087U Pending JPH01103272U (de) | 1987-12-28 | 1987-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01103272U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007059095A (ja) * | 2005-08-22 | 2007-03-08 | Sumitomo Wiring Syst Ltd | 基板用コネクタ |
| JP2018506860A (ja) * | 2015-02-15 | 2018-03-08 | 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． | パワーアンプに係る電力管の接続構造およびパワーアンプ |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596865B2 (ja) * | 1975-05-22 | 1984-02-15 | オオツカセイヤク カブシキガイシヤ | ５−（（２− ハロゲノ −１− ヒドロキシ ） アルキル ） カルボスチリルユウドウタイノセイゾウホウ |
-
1987
- 1987-12-28 JP JP20067087U patent/JPH01103272U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596865B2 (ja) * | 1975-05-22 | 1984-02-15 | オオツカセイヤク カブシキガイシヤ | ５−（（２− ハロゲノ −１− ヒドロキシ ） アルキル ） カルボスチリルユウドウタイノセイゾウホウ |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007059095A (ja) * | 2005-08-22 | 2007-03-08 | Sumitomo Wiring Syst Ltd | 基板用コネクタ |
| JP4556135B2 (ja) * | 2005-08-22 | 2010-10-06 | 住友電装株式会社 | 基板用コネクタ |
| JP2018506860A (ja) * | 2015-02-15 | 2018-03-08 | 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． | パワーアンプに係る電力管の接続構造およびパワーアンプ |
| US10165687B2 (en) | 2015-02-15 | 2018-12-25 | Huawei Technologies Co., Ltd. | Power tube connection structure of power amplifier and power amplifier |
| US10426036B2 (en) | 2015-02-15 | 2019-09-24 | Huawei Technologies Co., Ltd. | Power tube connection structure of power amplifier and power amplifier |