JPS63195778U - - Google Patents
Info
- Publication number
- JPS63195778U JPS63195778U JP8712487U JP8712487U JPS63195778U JP S63195778 U JPS63195778 U JP S63195778U JP 8712487 U JP8712487 U JP 8712487U JP 8712487 U JP8712487 U JP 8712487U JP S63195778 U JPS63195778 U JP S63195778U
- Authority
- JP
- Japan
- Prior art keywords
- circuit components
- printed wiring
- wiring board
- flat package
- dip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8712487U JPS63195778U (de) | 1987-06-03 | 1987-06-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8712487U JPS63195778U (de) | 1987-06-03 | 1987-06-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63195778U true JPS63195778U (de) | 1988-12-16 |
Family
ID=30944060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8712487U Pending JPS63195778U (de) | 1987-06-03 | 1987-06-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195778U (de) |
-
1987
- 1987-06-03 JP JP8712487U patent/JPS63195778U/ja active Pending