JP7897768B2 - 基板吸着部材、弾性シール組立体、トップリング、および基板処理装置 - Google Patents

基板吸着部材、弾性シール組立体、トップリング、および基板処理装置

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Publication number
JP7897768B2
JP7897768B2 JP2022160497A JP2022160497A JP7897768B2 JP 7897768 B2 JP7897768 B2 JP 7897768B2 JP 2022160497 A JP2022160497 A JP 2022160497A JP 2022160497 A JP2022160497 A JP 2022160497A JP 7897768 B2 JP7897768 B2 JP 7897768B2
Authority
JP
Japan
Prior art keywords
substrate
elastic sealing
shielding member
top ring
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022160497A
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English (en)
Japanese (ja)
Other versions
JP2023057047A (ja
JP2023057047A5 (cg-RX-API-DMAC7.html
Inventor
一博 田嶋
誠 柏木
磨奈人 古澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US18/698,305 priority Critical patent/US20240416480A1/en
Priority to TW111138207A priority patent/TW202320156A/zh
Priority to CN202280067725.5A priority patent/CN118176088A/zh
Priority to KR1020247009890A priority patent/KR20240087743A/ko
Priority to EP22878618.2A priority patent/EP4414127A4/en
Priority to PCT/JP2022/037612 priority patent/WO2023058751A1/ja
Publication of JP2023057047A publication Critical patent/JP2023057047A/ja
Publication of JP2023057047A5 publication Critical patent/JP2023057047A5/ja
Application granted granted Critical
Publication of JP7897768B2 publication Critical patent/JP7897768B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2022160497A 2021-10-08 2022-10-04 基板吸着部材、弾性シール組立体、トップリング、および基板処理装置 Active JP7897768B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW111138207A TW202320156A (zh) 2021-10-08 2022-10-07 基板吸附構件、彈性密封組合體、頂環、及基板處理裝置
CN202280067725.5A CN118176088A (zh) 2021-10-08 2022-10-07 基板吸附构件、弹性密封组装体、顶环及基板处理装置
KR1020247009890A KR20240087743A (ko) 2021-10-08 2022-10-07 기판 흡착 부재, 탄성 시일 조립체, 톱링 및 기판 처리 장치
EP22878618.2A EP4414127A4 (en) 2021-10-08 2022-10-07 SUBSTRATE SUCTION ELEMENT, ELASTIC SEAL ASSEMBLY, UPPER RING AND SUBSTRATE TREATMENT DEVICE
US18/698,305 US20240416480A1 (en) 2021-10-08 2022-10-07 Substrate suction member, elastic seal assembly, top ring, and substrate processing apparatus
PCT/JP2022/037612 WO2023058751A1 (ja) 2021-10-08 2022-10-07 基板吸着部材、弾性シール組立体、トップリング、および基板処理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021166120 2021-10-08
JP2021166120 2021-10-08

Publications (3)

Publication Number Publication Date
JP2023057047A JP2023057047A (ja) 2023-04-20
JP2023057047A5 JP2023057047A5 (cg-RX-API-DMAC7.html) 2025-06-27
JP7897768B2 true JP7897768B2 (ja) 2026-07-30

Family

ID=86004786

Family Applications (1)

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JP2022160497A Active JP7897768B2 (ja) 2021-10-08 2022-10-04 基板吸着部材、弾性シール組立体、トップリング、および基板処理装置

Country Status (1)

Country Link
JP (1) JP7897768B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7830186B2 (ja) * 2022-03-23 2026-03-16 株式会社ディスコ 保持パッド及び搬送装置
JP2025088032A (ja) 2023-11-30 2025-06-11 株式会社荏原製作所 トップリング、および、基板研磨装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020168675A (ja) 2019-04-02 2020-10-15 株式会社荏原製作所 積層メンブレン、積層メンブレンを備える基板保持装置および基板処理装置
JP2021079488A (ja) 2019-11-19 2021-05-27 株式会社荏原製作所 基板を保持するためのトップリングおよび基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020168675A (ja) 2019-04-02 2020-10-15 株式会社荏原製作所 積層メンブレン、積層メンブレンを備える基板保持装置および基板処理装置
JP2021079488A (ja) 2019-11-19 2021-05-27 株式会社荏原製作所 基板を保持するためのトップリングおよび基板処理装置

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