JP7879673B2 - 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法 - Google Patents

離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Info

Publication number
JP7879673B2
JP7879673B2 JP2021133708A JP2021133708A JP7879673B2 JP 7879673 B2 JP7879673 B2 JP 7879673B2 JP 2021133708 A JP2021133708 A JP 2021133708A JP 2021133708 A JP2021133708 A JP 2021133708A JP 7879673 B2 JP7879673 B2 JP 7879673B2
Authority
JP
Japan
Prior art keywords
resin layer
release film
resin
face
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021133708A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022042971A (ja
Inventor
宏明 小屋原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JP2022042971A publication Critical patent/JP2022042971A/ja
Priority to JP2025093544A priority Critical patent/JP2025116223A/ja
Application granted granted Critical
Publication of JP7879673B2 publication Critical patent/JP7879673B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2021133708A 2020-09-03 2021-08-18 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法 Active JP7879673B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025093544A JP2025116223A (ja) 2020-09-03 2025-06-04 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020148457 2020-09-03
JP2020148457 2020-09-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025093544A Division JP2025116223A (ja) 2020-09-03 2025-06-04 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Publications (2)

Publication Number Publication Date
JP2022042971A JP2022042971A (ja) 2022-03-15
JP7879673B2 true JP7879673B2 (ja) 2026-06-24

Family

ID=80394484

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021133708A Active JP7879673B2 (ja) 2020-09-03 2021-08-18 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法
JP2025093544A Pending JP2025116223A (ja) 2020-09-03 2025-06-04 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025093544A Pending JP2025116223A (ja) 2020-09-03 2025-06-04 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Country Status (3)

Country Link
JP (2) JP7879673B2 (cg-RX-API-DMAC7.html)
CN (2) CN114132027A (cg-RX-API-DMAC7.html)
TW (1) TW202214066A (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7879673B2 (ja) * 2020-09-03 2026-06-24 積水化学工業株式会社 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3052662U (ja) 1998-03-26 1998-09-29 ソマール株式会社 プリント基板カバーレイフィルム押圧用シート
JP2000263724A (ja) 1999-03-19 2000-09-26 Mitsui Chemicals Inc プリント基板製造用離型フィルム及びその製造方法
JP2003165194A (ja) 2001-12-03 2003-06-10 Toyo Seikan Kaisha Ltd 多層体の切断方法および多層体切断成形品
JP2004058181A (ja) 2002-07-25 2004-02-26 Toyo Seikan Kaisha Ltd 多層体の切断方法および多層容器の成形方法並びに多層成型品
JP2005101189A (ja) 2003-09-24 2005-04-14 Bunichi Yamada プリント回路基板製造用離型フイルム
WO2006120983A1 (ja) 2005-05-13 2006-11-16 Mitsui Chemicals, Inc. ４－メチル－１－ペンテン系重合体を含む積層体およびこれからなる離型フィルム
JP2020019264A (ja) 2018-08-03 2020-02-06 三井化学東セロ株式会社 樹脂モールド成形品の製造方法、樹脂モールド成形品、及びその用途。

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739614Y2 (ja) * 1993-04-12 1995-09-13 日本ピラー工業株式会社 クッション材
JPH07214716A (ja) * 1994-01-31 1995-08-15 Nagaoka Sangyo Kk 複合成形体およびその製造方法
JP2006148081A (ja) * 2004-10-19 2006-06-08 Sumitomo Bakelite Co Ltd 離型フィルムおよび回路基板の製造方法
JP7879673B2 (ja) * 2020-09-03 2026-06-24 積水化学工業株式会社 離型フィルム、離型フィルムの製造方法、及び回路基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3052662U (ja) 1998-03-26 1998-09-29 ソマール株式会社 プリント基板カバーレイフィルム押圧用シート
JP2000263724A (ja) 1999-03-19 2000-09-26 Mitsui Chemicals Inc プリント基板製造用離型フィルム及びその製造方法
JP2003165194A (ja) 2001-12-03 2003-06-10 Toyo Seikan Kaisha Ltd 多層体の切断方法および多層体切断成形品
JP2004058181A (ja) 2002-07-25 2004-02-26 Toyo Seikan Kaisha Ltd 多層体の切断方法および多層容器の成形方法並びに多層成型品
JP2005101189A (ja) 2003-09-24 2005-04-14 Bunichi Yamada プリント回路基板製造用離型フイルム
WO2006120983A1 (ja) 2005-05-13 2006-11-16 Mitsui Chemicals, Inc. ４－メチル－１－ペンテン系重合体を含む積層体およびこれからなる離型フィルム
JP2020019264A (ja) 2018-08-03 2020-02-06 三井化学東セロ株式会社 樹脂モールド成形品の製造方法、樹脂モールド成形品、及びその用途。

Also Published As

Publication number Publication date
TW202214066A (zh) 2022-04-01
JP2022042971A (ja) 2022-03-15
CN114132027A (zh) 2022-03-04
JP2025116223A (ja) 2025-08-07
CN216267995U (zh) 2022-04-12

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240516

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20241227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250204

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20250401

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250604

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250729

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20250922

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20251216

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20260205

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260409

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260519

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260612

R150 Certificate of patent or registration of utility model

Ref document number: 7879673

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150