JP7833481B2 - 金属樹脂複合電磁波シールド材料 - Google Patents

金属樹脂複合電磁波シールド材料

Info

Publication number
JP7833481B2
JP7833481B2 JP2023559421A JP2023559421A JP7833481B2 JP 7833481 B2 JP7833481 B2 JP 7833481B2 JP 2023559421 A JP2023559421 A JP 2023559421A JP 2023559421 A JP2023559421 A JP 2023559421A JP 7833481 B2 JP7833481 B2 JP 7833481B2
Authority
JP
Japan
Prior art keywords
metal
layer
resin
shielding material
resin composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023559421A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023084844A1 (https=
JPWO2023084844A5 (https=
Inventor
悠貴友 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of JPWO2023084844A1 publication Critical patent/JPWO2023084844A1/ja
Publication of JPWO2023084844A5 publication Critical patent/JPWO2023084844A5/ja
Priority to JP2025016359A priority Critical patent/JP2025065241A/ja
Application granted granted Critical
Publication of JP7833481B2 publication Critical patent/JP7833481B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/42—Alternating layers, e.g. ABAB(C), AABBAABB(C)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/737—Dimensions, e.g. volume or area
    • B32B2307/7375—Linear, e.g. length, distance or width
    • B32B2307/7376—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
JP2023559421A 2021-11-15 2022-07-08 金属樹脂複合電磁波シールド材料 Active JP7833481B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025016359A JP2025065241A (ja) 2021-11-15 2025-02-03 金属樹脂複合電磁波シールド材料

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021186021 2021-11-15
JP2021186021 2021-11-15
PCT/JP2022/027154 WO2023084844A1 (ja) 2021-11-15 2022-07-08 金属樹脂複合電磁波シールド材料

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025016359A Division JP2025065241A (ja) 2021-11-15 2025-02-03 金属樹脂複合電磁波シールド材料

Publications (3)

Publication Number Publication Date
JPWO2023084844A1 JPWO2023084844A1 (https=) 2023-05-19
JPWO2023084844A5 JPWO2023084844A5 (https=) 2024-03-13
JP7833481B2 true JP7833481B2 (ja) 2026-03-19

Family

ID=86335472

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023559421A Active JP7833481B2 (ja) 2021-11-15 2022-07-08 金属樹脂複合電磁波シールド材料
JP2025016359A Abandoned JP2025065241A (ja) 2021-11-15 2025-02-03 金属樹脂複合電磁波シールド材料

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025016359A Abandoned JP2025065241A (ja) 2021-11-15 2025-02-03 金属樹脂複合電磁波シールド材料

Country Status (7)

Country Link
US (1) US20240341071A1 (https=)
EP (1) EP4436326A4 (https=)
JP (2) JP7833481B2 (https=)
KR (1) KR20240025628A (https=)
CN (1) CN117581644A (https=)
TW (1) TWI854260B (https=)
WO (1) WO2023084844A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024090069A1 (ja) * 2022-10-26 2024-05-02 Ｊｘ金属株式会社 金属樹脂複合電磁波シールド材料
WO2025115622A1 (ja) * 2023-11-30 2025-06-05 富士フイルム株式会社 電磁波シールド材、電子部品および電子機器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191443A (ja) 2003-12-26 2005-07-14 Hitachi Chem Co Ltd 電磁波シールド用積層体

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS462680Y1 (https=) 1968-11-05 1971-01-29
JPS60125125U (ja) * 1984-02-03 1985-08-23 藤森工業株式会社 電磁波シ−ルド用積層材
JPH01143197U (https=) * 1988-03-23 1989-10-02
JPH07290449A (ja) 1994-04-27 1995-11-07 Matsushita Electric Works Ltd シート状の電磁波シールド成形材料及びその製造方法
TW583688B (en) * 2002-02-21 2004-04-11 Dainippon Printing Co Ltd Electromagnetic shielding sheet and method of producing the same
JP4235396B2 (ja) 2002-03-29 2009-03-11 真和工業株式会社 インバータカバー
JP4602680B2 (ja) 2004-03-22 2010-12-22 株式会社オーツカ 電磁波シールド構造
TWI403761B (zh) * 2005-02-15 2013-08-01 Fujifilm Corp 透光性導電性膜之製法
WO2006098335A1 (ja) * 2005-03-15 2006-09-21 Fujifilm Corporation 積層材料、透光性電磁波シールド膜および光学フィルター
KR100962924B1 (ko) 2006-07-14 2010-06-10 삼성코닝정밀소재 주식회사 전자파 차폐용 광학 부재, 이를 포함하는 광학 필터 및디스플레이 장치
JP2010080825A (ja) * 2008-09-29 2010-04-08 Dainippon Printing Co Ltd 電磁波遮蔽シート、及び電磁波遮蔽シートの製造方法
JP6379071B2 (ja) * 2015-06-15 2018-08-22 Ｊｘ金属株式会社 電磁波シールド材
JP6883449B2 (ja) * 2017-03-13 2021-06-09 Ｊｘ金属株式会社 電磁波シールド材

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191443A (ja) 2003-12-26 2005-07-14 Hitachi Chem Co Ltd 電磁波シールド用積層体

Also Published As

Publication number Publication date
EP4436326A1 (en) 2024-09-25
KR20240025628A (ko) 2024-02-27
TWI854260B (zh) 2024-09-01
EP4436326A4 (en) 2025-03-19
JPWO2023084844A1 (https=) 2023-05-19
CN117581644A (zh) 2024-02-20
JP2025065241A (ja) 2025-04-17
US20240341071A1 (en) 2024-10-10
WO2023084844A1 (ja) 2023-05-19
TW202322685A (zh) 2023-06-01

Similar Documents

Publication Publication Date Title
JP6379071B2 (ja) 電磁波シールド材
KR102245327B1 (ko) 전자파 실드재
TWI790797B (zh) 電磁波屏蔽材料、電氣設備或電子設備用的覆蓋材料或外包裝材料及電氣設備或電子設備
JP2025065241A (ja) 金属樹脂複合電磁波シールド材料
KR102135649B1 (ko) 전자파 실드재
US10272646B2 (en) Electromagnetic shielding material
JP2016076664A (ja) 電磁波シールド材
JP7692385B2 (ja) 電磁波シールド積層体、被覆材又は外装材、電気・電子機器及び電磁波シールド積層体の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231201

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231206

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240618

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240808

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20241119

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251212

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260309

R150 Certificate of patent or registration of utility model

Ref document number: 7833481

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150