CN117581644A - 金属树脂复合电磁波屏蔽材料 - Google Patents

金属树脂复合电磁波屏蔽材料 Download PDF

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Publication number
CN117581644A
CN117581644A CN202280045848.9A CN202280045848A CN117581644A CN 117581644 A CN117581644 A CN 117581644A CN 202280045848 A CN202280045848 A CN 202280045848A CN 117581644 A CN117581644 A CN 117581644A
Authority
CN
China
Prior art keywords
metal
layer
electromagnetic wave
wave shielding
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280045848.9A
Other languages
English (en)
Chinese (zh)
Inventor
山本悠贵友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN117581644A publication Critical patent/CN117581644A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/42—Alternating layers, e.g. ABAB(C), AABBAABB(C)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/737—Dimensions, e.g. volume or area
    • B32B2307/7375—Linear, e.g. length, distance or width
    • B32B2307/7376—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
CN202280045848.9A 2021-11-15 2022-07-08 金属树脂复合电磁波屏蔽材料 Pending CN117581644A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-186021 2021-11-15
JP2021186021 2021-11-15
PCT/JP2022/027154 WO2023084844A1 (ja) 2021-11-15 2022-07-08 金属樹脂複合電磁波シールド材料

Publications (1)

Publication Number Publication Date
CN117581644A true CN117581644A (zh) 2024-02-20

Family

ID=86335472

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280045848.9A Pending CN117581644A (zh) 2021-11-15 2022-07-08 金属树脂复合电磁波屏蔽材料

Country Status (7)

Country Link
US (1) US20240341071A1 (https=)
EP (1) EP4436326A4 (https=)
JP (2) JP7833481B2 (https=)
KR (1) KR20240025628A (https=)
CN (1) CN117581644A (https=)
TW (1) TWI854260B (https=)
WO (1) WO2023084844A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024090069A1 (ja) * 2022-10-26 2024-05-02 Ｊｘ金属株式会社 金属樹脂複合電磁波シールド材料
WO2025115622A1 (ja) * 2023-11-30 2025-06-05 富士フイルム株式会社 電磁波シールド材、電子部品および電子機器

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07290449A (ja) * 1994-04-27 1995-11-07 Matsushita Electric Works Ltd シート状の電磁波シールド成形材料及びその製造方法
US20030164243A1 (en) * 2002-02-21 2003-09-04 Dai Nippon Printing Co., Ltd. Electromagnetic shielding sheet and method of producing the same
JP2003285002A (ja) * 2002-03-29 2003-10-07 Shinwa Kogyo Kk インバータカバー
JP2005191443A (ja) * 2003-12-26 2005-07-14 Hitachi Chem Co Ltd 電磁波シールド用積層体
JP2005268716A (ja) * 2004-03-22 2005-09-29 Ootsuka:Kk 電磁波シールド構造
JP2008021979A (ja) * 2006-07-14 2008-01-31 Samsung Corning Co Ltd 電磁波遮断用光学部材、これを含んだ光学フィルタおよび表示装置
JP2010080825A (ja) * 2008-09-29 2010-04-08 Dainippon Printing Co Ltd 電磁波遮蔽シート、及び電磁波遮蔽シートの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS462680Y1 (https=) 1968-11-05 1971-01-29
JPS60125125U (ja) * 1984-02-03 1985-08-23 藤森工業株式会社 電磁波シ−ルド用積層材
JPH01143197U (https=) * 1988-03-23 1989-10-02
TWI403761B (zh) * 2005-02-15 2013-08-01 Fujifilm Corp 透光性導電性膜之製法
WO2006098335A1 (ja) * 2005-03-15 2006-09-21 Fujifilm Corporation 積層材料、透光性電磁波シールド膜および光学フィルター
JP6379071B2 (ja) * 2015-06-15 2018-08-22 Ｊｘ金属株式会社 電磁波シールド材
JP6883449B2 (ja) * 2017-03-13 2021-06-09 Ｊｘ金属株式会社 電磁波シールド材

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07290449A (ja) * 1994-04-27 1995-11-07 Matsushita Electric Works Ltd シート状の電磁波シールド成形材料及びその製造方法
US20030164243A1 (en) * 2002-02-21 2003-09-04 Dai Nippon Printing Co., Ltd. Electromagnetic shielding sheet and method of producing the same
JP2003285002A (ja) * 2002-03-29 2003-10-07 Shinwa Kogyo Kk インバータカバー
JP2005191443A (ja) * 2003-12-26 2005-07-14 Hitachi Chem Co Ltd 電磁波シールド用積層体
JP2005268716A (ja) * 2004-03-22 2005-09-29 Ootsuka:Kk 電磁波シールド構造
JP2008021979A (ja) * 2006-07-14 2008-01-31 Samsung Corning Co Ltd 電磁波遮断用光学部材、これを含んだ光学フィルタおよび表示装置
JP2010080825A (ja) * 2008-09-29 2010-04-08 Dainippon Printing Co Ltd 電磁波遮蔽シート、及び電磁波遮蔽シートの製造方法

Also Published As

Publication number Publication date
EP4436326A1 (en) 2024-09-25
KR20240025628A (ko) 2024-02-27
TWI854260B (zh) 2024-09-01
EP4436326A4 (en) 2025-03-19
JPWO2023084844A1 (https=) 2023-05-19
JP2025065241A (ja) 2025-04-17
US20240341071A1 (en) 2024-10-10
WO2023084844A1 (ja) 2023-05-19
JP7833481B2 (ja) 2026-03-19
TW202322685A (zh) 2023-06-01

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