JP7827164B2 - 半導体装置、電力変換装置および移動体 - Google Patents

半導体装置、電力変換装置および移動体

Info

Publication number
JP7827164B2
JP7827164B2 JP2024555591A JP2024555591A JP7827164B2 JP 7827164 B2 JP7827164 B2 JP 7827164B2 JP 2024555591 A JP2024555591 A JP 2024555591A JP 2024555591 A JP2024555591 A JP 2024555591A JP 7827164 B2 JP7827164 B2 JP 7827164B2
Authority
JP
Japan
Prior art keywords
case
semiconductor device
nut
base plate
screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024555591A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024075283A1 (cg-RX-API-DMAC7.html
JPWO2024075283A5 (cg-RX-API-DMAC7.html
Inventor
龍太郎 伊達
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2024075283A1 publication Critical patent/JPWO2024075283A1/ja
Publication of JPWO2024075283A5 publication Critical patent/JPWO2024075283A5/ja
Application granted granted Critical
Publication of JP7827164B2 publication Critical patent/JP7827164B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00Arrangements for protection of devices
    • H10W42/80Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Inverter Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2024555591A 2022-10-07 2022-10-07 半導体装置、電力変換装置および移動体 Active JP7827164B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/037643 WO2024075283A1 (ja) 2022-10-07 2022-10-07 半導体装置、電力変換装置および移動体

Publications (3)

Publication Number Publication Date
JPWO2024075283A1 JPWO2024075283A1 (cg-RX-API-DMAC7.html) 2024-04-11
JPWO2024075283A5 JPWO2024075283A5 (cg-RX-API-DMAC7.html) 2025-02-17
JP7827164B2 true JP7827164B2 (ja) 2026-03-10

Family

ID=90607925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024555591A Active JP7827164B2 (ja) 2022-10-07 2022-10-07 半導体装置、電力変換装置および移動体

Country Status (4)

Country Link
JP (1) JP7827164B2 (cg-RX-API-DMAC7.html)
CN (1) CN120019728A (cg-RX-API-DMAC7.html)
DE (1) DE112022007876T5 (cg-RX-API-DMAC7.html)
WO (1) WO2024075283A1 (cg-RX-API-DMAC7.html)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214536A (ja) 2003-01-08 2004-07-29 Mitsubishi Electric Corp 電力用半導体装置
JP2006032392A (ja) 2004-07-12 2006-02-02 Mitsubishi Electric Corp 半導体装置
JP2010086977A (ja) 2008-09-29 2010-04-15 Toshiba Corp パワーモジュール
JP2011233814A (ja) 2010-04-30 2011-11-17 Nissan Motor Co Ltd 電子モジュール及び電子モジュール取付け構造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214536A (ja) 2003-01-08 2004-07-29 Mitsubishi Electric Corp 電力用半導体装置
JP2006032392A (ja) 2004-07-12 2006-02-02 Mitsubishi Electric Corp 半導体装置
JP2010086977A (ja) 2008-09-29 2010-04-15 Toshiba Corp パワーモジュール
JP2011233814A (ja) 2010-04-30 2011-11-17 Nissan Motor Co Ltd 電子モジュール及び電子モジュール取付け構造

Also Published As

Publication number Publication date
CN120019728A (zh) 2025-05-16
JPWO2024075283A1 (cg-RX-API-DMAC7.html) 2024-04-11
DE112022007876T5 (de) 2025-07-17
WO2024075283A1 (ja) 2024-04-11

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