JP7825538B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置

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Publication number
JP7825538B2
JP7825538B2 JP2022163154A JP2022163154A JP7825538B2 JP 7825538 B2 JP7825538 B2 JP 7825538B2 JP 2022163154 A JP2022163154 A JP 2022163154A JP 2022163154 A JP2022163154 A JP 2022163154A JP 7825538 B2 JP7825538 B2 JP 7825538B2
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JP
Japan
Prior art keywords
ring
plasma processing
width
support portion
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022163154A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023098599A5 (https=
JP2023098599A (ja
Inventor
秀征 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to TW111148421A priority Critical patent/TW202341228A/zh
Priority to KR1020220176455A priority patent/KR20230100629A/ko
Priority to CN202211639069.XA priority patent/CN116364516A/zh
Priority to US18/085,583 priority patent/US12412735B2/en
Publication of JP2023098599A publication Critical patent/JP2023098599A/ja
Publication of JP2023098599A5 publication Critical patent/JP2023098599A5/ja
Priority to US19/295,726 priority patent/US20250364226A1/en
Application granted granted Critical
Publication of JP7825538B2 publication Critical patent/JP7825538B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Landscapes

  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022163154A 2021-12-28 2022-10-11 プラズマ処理装置 Active JP7825538B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW111148421A TW202341228A (zh) 2021-12-28 2022-12-16 電漿處理裝置
KR1020220176455A KR20230100629A (ko) 2021-12-28 2022-12-16 플라즈마 처리 장치
CN202211639069.XA CN116364516A (zh) 2021-12-28 2022-12-20 等离子体处理装置
US18/085,583 US12412735B2 (en) 2021-12-28 2022-12-21 Plasma processing apparatus
US19/295,726 US20250364226A1 (en) 2021-12-28 2025-08-11 Plasma processing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021215091 2021-12-28
JP2021215091 2021-12-28

Publications (3)

Publication Number Publication Date
JP2023098599A JP2023098599A (ja) 2023-07-10
JP2023098599A5 JP2023098599A5 (https=) 2025-03-04
JP7825538B2 true JP7825538B2 (ja) 2026-03-06

Family

ID=87072356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022163154A Active JP7825538B2 (ja) 2021-12-28 2022-10-11 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JP7825538B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202601866A (zh) * 2024-02-29 2026-01-01 日商東京威力科創股份有限公司 基板處理系統及搬運機械臂之教導方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019505088A (ja) 2016-01-26 2019-02-21 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェハエッジリングの持ち上げに関する解決
JP2020113603A (ja) 2019-01-09 2020-07-27 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理装置の載置台
JP2020532852A (ja) 2018-08-13 2020-11-12 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ エッジリングの位置決めおよびセンタリング機構を組み込んだプラズマシース調整のための交換可能および／または折りたたみ式エッジリングアセンブリ
JP2021141313A (ja) 2020-03-03 2021-09-16 東京エレクトロン株式会社 基板支持台、プラズマ処理システム及び環状部材の取り付け方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019505088A (ja) 2016-01-26 2019-02-21 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェハエッジリングの持ち上げに関する解決
JP2020532852A (ja) 2018-08-13 2020-11-12 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ エッジリングの位置決めおよびセンタリング機構を組み込んだプラズマシース調整のための交換可能および／または折りたたみ式エッジリングアセンブリ
JP2020113603A (ja) 2019-01-09 2020-07-27 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理装置の載置台
JP2021141313A (ja) 2020-03-03 2021-09-16 東京エレクトロン株式会社 基板支持台、プラズマ処理システム及び環状部材の取り付け方法

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