JP7818793B2 - レーザ照射装置、レーザ照射方法、及び、レーザ照射処理表面 - Google Patents

レーザ照射装置、レーザ照射方法、及び、レーザ照射処理表面

Info

Publication number
JP7818793B2
JP7818793B2 JP2021093955A JP2021093955A JP7818793B2 JP 7818793 B2 JP7818793 B2 JP 7818793B2 JP 2021093955 A JP2021093955 A JP 2021093955A JP 2021093955 A JP2021093955 A JP 2021093955A JP 7818793 B2 JP7818793 B2 JP 7818793B2
Authority
JP
Japan
Prior art keywords
irradiation
laser light
laser
circle
scanning pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021093955A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022185982A (ja
Inventor
憲治郎 茂見
学 原口
桃 東末
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyokoh Inc
Original Assignee
Toyokoh Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyokoh Inc filed Critical Toyokoh Inc
Priority to JP2021093955A priority Critical patent/JP7818793B2/ja
Priority to EP22815994.3A priority patent/EP4349522A4/en
Priority to PCT/JP2022/021722 priority patent/WO2022255244A1/ja
Publication of JP2022185982A publication Critical patent/JP2022185982A/ja
Priority to US18/522,873 priority patent/US20240091880A1/en
Priority to JP2025277550A priority patent/JP2026040592A/ja
Application granted granted Critical
Publication of JP7818793B2 publication Critical patent/JP7818793B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
JP2021093955A 2021-06-03 2021-06-03 レーザ照射装置、レーザ照射方法、及び、レーザ照射処理表面 Active JP7818793B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021093955A JP7818793B2 (ja) 2021-06-03 2021-06-03 レーザ照射装置、レーザ照射方法、及び、レーザ照射処理表面
EP22815994.3A EP4349522A4 (en) 2021-06-03 2022-05-27 LASER RADIATION DEVICE AND METHOD AND SURFACE TREATED BY LASER RADIATION
PCT/JP2022/021722 WO2022255244A1 (ja) 2021-06-03 2022-05-27 レーザ照射装置、レーザ照射方法、及び、レーザ照射処理表面
US18/522,873 US20240091880A1 (en) 2021-06-03 2023-11-29 Laser irradiation apparatus, laser irradiation method and laser irradiation processed surface
JP2025277550A JP2026040592A (ja) 2021-06-03 2025-12-23 レーザ照射装置、レーザ照射方法、及び、レーザ照射処理表面

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021093955A JP7818793B2 (ja) 2021-06-03 2021-06-03 レーザ照射装置、レーザ照射方法、及び、レーザ照射処理表面

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025277550A Division JP2026040592A (ja) 2021-06-03 2025-12-23 レーザ照射装置、レーザ照射方法、及び、レーザ照射処理表面

Publications (2)

Publication Number Publication Date
JP2022185982A JP2022185982A (ja) 2022-12-15
JP7818793B2 true JP7818793B2 (ja) 2026-02-24

Family

ID=84324082

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021093955A Active JP7818793B2 (ja) 2021-06-03 2021-06-03 レーザ照射装置、レーザ照射方法、及び、レーザ照射処理表面
JP2025277550A Pending JP2026040592A (ja) 2021-06-03 2025-12-23 レーザ照射装置、レーザ照射方法、及び、レーザ照射処理表面

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JP2025277550A Pending JP2026040592A (ja) 2021-06-03 2025-12-23 レーザ照射装置、レーザ照射方法、及び、レーザ照射処理表面

Country Status (4)

Country Link
US (1) US20240091880A1 (https=)
EP (1) EP4349522A4 (https=)
JP (2) JP7818793B2 (https=)
WO (1) WO2022255244A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250072439A (ko) * 2023-11-16 2025-05-23 삼성에스디아이 주식회사 수평 조사형 레이저 용접 장치 및 방법

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141070A (ja) 1998-11-05 2000-05-23 Amada Eng Center Co Ltd レーザ加工ヘッド
JP2002273585A (ja) 2001-03-16 2002-09-25 Ricoh Microelectronics Co Ltd ビーム加工方法及びその装置、並びにタッチパネル基板の製造方法
JP2003048088A (ja) 2001-07-31 2003-02-18 Mitsubishi Electric Corp レーザ加工方法及びレーザ加工機
DE10217200A1 (de) 2002-04-18 2003-10-30 Winter Pipeline Gmbh Verfahren und Vorrichtung zur Materialbearbeitung mit Laserstrahlen
JP2008170579A (ja) 2007-01-10 2008-07-24 Yaskawa Electric Corp ガルバノスキャナシステムおよび制御方法
WO2015129248A1 (ja) 2014-02-25 2015-09-03 パナソニックＩｐマネジメント株式会社 レーザ溶接方法
JP2015196166A (ja) 2014-03-31 2015-11-09 ブラザー工業株式会社 レーザ加工装置、レーザ加工方法及びプログラム
JP2016521208A (ja) 2013-03-29 2016-07-21 フォトン・オートメイション・インコーポレイテッド レーザ溶接システムおよび方法
JP2019042758A (ja) 2017-08-31 2019-03-22 株式会社神戸製鋼所 接合体の製造方法及び接合体の製造装置
JP2019141868A (ja) 2018-02-19 2019-08-29 ファナック株式会社 レーザ加工装置
JP2020019037A (ja) 2018-07-31 2020-02-06 株式会社アマダホールディングス レーザ加工機及びレーザ加工方法
CN111001940A (zh) 2019-12-24 2020-04-14 武汉翔明激光科技有限公司 一种基于激光与振镜联动控制的激光均匀清洗方法
JP2021049535A (ja) 2019-09-24 2021-04-01 株式会社フジクラ レーザ照射装置及び樹脂成形体の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4200632C2 (de) * 1992-01-13 1995-09-21 Maho Ag Verfahren und Vorrichtung zum Bearbeiten von Werkstücken mittels der von einem Laser emittierten Laserstrahlung
US8160113B2 (en) * 2009-07-21 2012-04-17 Mobius Photonics, Inc. Tailored pulse burst
JP5574354B2 (ja) 2012-03-09 2014-08-20 株式会社トヨコー 塗膜除去方法及びレーザー塗膜除去装置
JP7473124B2 (ja) * 2020-03-31 2024-04-23 前田建設工業株式会社 レーザ処理済みコンクリート表面

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141070A (ja) 1998-11-05 2000-05-23 Amada Eng Center Co Ltd レーザ加工ヘッド
JP2002273585A (ja) 2001-03-16 2002-09-25 Ricoh Microelectronics Co Ltd ビーム加工方法及びその装置、並びにタッチパネル基板の製造方法
JP2003048088A (ja) 2001-07-31 2003-02-18 Mitsubishi Electric Corp レーザ加工方法及びレーザ加工機
DE10217200A1 (de) 2002-04-18 2003-10-30 Winter Pipeline Gmbh Verfahren und Vorrichtung zur Materialbearbeitung mit Laserstrahlen
JP2008170579A (ja) 2007-01-10 2008-07-24 Yaskawa Electric Corp ガルバノスキャナシステムおよび制御方法
JP2016521208A (ja) 2013-03-29 2016-07-21 フォトン・オートメイション・インコーポレイテッド レーザ溶接システムおよび方法
WO2015129248A1 (ja) 2014-02-25 2015-09-03 パナソニックＩｐマネジメント株式会社 レーザ溶接方法
JP2015196166A (ja) 2014-03-31 2015-11-09 ブラザー工業株式会社 レーザ加工装置、レーザ加工方法及びプログラム
JP2019042758A (ja) 2017-08-31 2019-03-22 株式会社神戸製鋼所 接合体の製造方法及び接合体の製造装置
JP2019141868A (ja) 2018-02-19 2019-08-29 ファナック株式会社 レーザ加工装置
JP2020019037A (ja) 2018-07-31 2020-02-06 株式会社アマダホールディングス レーザ加工機及びレーザ加工方法
JP2021049535A (ja) 2019-09-24 2021-04-01 株式会社フジクラ レーザ照射装置及び樹脂成形体の製造方法
CN111001940A (zh) 2019-12-24 2020-04-14 武汉翔明激光科技有限公司 一种基于激光与振镜联动控制的激光均匀清洗方法

Also Published As

Publication number Publication date
EP4349522A1 (en) 2024-04-10
JP2026040592A (ja) 2026-03-09
WO2022255244A1 (ja) 2022-12-08
JP2022185982A (ja) 2022-12-15
US20240091880A1 (en) 2024-03-21
EP4349522A4 (en) 2025-07-09

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