JP7786648B2 - 感光性樹脂組成物、硬化物および半導体装置 - Google Patents

感光性樹脂組成物、硬化物および半導体装置

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Publication number
JP7786648B2
JP7786648B2 JP2025529781A JP2025529781A JP7786648B2 JP 7786648 B2 JP7786648 B2 JP 7786648B2 JP 2025529781 A JP2025529781 A JP 2025529781A JP 2025529781 A JP2025529781 A JP 2025529781A JP 7786648 B2 JP7786648 B2 JP 7786648B2
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JP
Japan
Prior art keywords
mass
parts
resin composition
photosensitive resin
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025529781A
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English (en)
Japanese (ja)
Other versions
JPWO2025142647A1 (https=
JPWO2025142647A5 (https=
Inventor
律也 川崎
誠 堀井
一史 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of JPWO2025142647A1 publication Critical patent/JPWO2025142647A1/ja
Publication of JPWO2025142647A5 publication Critical patent/JPWO2025142647A5/ja
Application granted granted Critical
Publication of JP7786648B2 publication Critical patent/JP7786648B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2025529781A 2023-12-26 2024-12-17 感光性樹脂組成物、硬化物および半導体装置 Active JP7786648B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023219175 2023-12-26
JP2023219175 2023-12-26
PCT/JP2024/044654 WO2025142647A1 (ja) 2023-12-26 2024-12-17 感光性樹脂組成物、硬化物および半導体装置

Publications (3)

Publication Number Publication Date
JPWO2025142647A1 JPWO2025142647A1 (https=) 2025-07-03
JPWO2025142647A5 JPWO2025142647A5 (https=) 2025-11-26
JP7786648B2 true JP7786648B2 (ja) 2025-12-16

Family

ID=96217730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025529781A Active JP7786648B2 (ja) 2023-12-26 2024-12-17 感光性樹脂組成物、硬化物および半導体装置

Country Status (3)

Country Link
JP (1) JP7786648B2 (https=)
TW (1) TW202542647A (https=)
WO (1) WO2025142647A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018070829A (ja) 2016-11-02 2018-05-10 東レ株式会社 樹脂組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102371148B1 (ko) * 2016-09-09 2022-03-08 도레이 카부시키가이샤 수지 조성물
JPWO2022270541A1 (https=) * 2021-06-25 2022-12-29
JPWO2024095884A1 (https=) * 2022-10-31 2024-05-10
TWI909442B (zh) * 2023-05-10 2025-12-21 日商旭化成股份有限公司 負型感光性樹脂組合物及硬化浮凸圖案之製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018070829A (ja) 2016-11-02 2018-05-10 東レ株式会社 樹脂組成物

Also Published As

Publication number Publication date
TW202542647A (zh) 2025-11-01
WO2025142647A1 (ja) 2025-07-03
JPWO2025142647A1 (https=) 2025-07-03

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