JP7756316B2 - 段取り支援装置及び段取り支援方法 - Google Patents

段取り支援装置及び段取り支援方法

Info

Publication number
JP7756316B2
JP7756316B2 JP2023566385A JP2023566385A JP7756316B2 JP 7756316 B2 JP7756316 B2 JP 7756316B2 JP 2023566385 A JP2023566385 A JP 2023566385A JP 2023566385 A JP2023566385 A JP 2023566385A JP 7756316 B2 JP7756316 B2 JP 7756316B2
Authority
JP
Japan
Prior art keywords
cassette
unit
tape
component
carrier tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023566385A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023106401A5 (https=
JPWO2023106401A1 (https=
Inventor
寛昭 加藤
美伯 礒端
輝明 西中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of JPWO2023106401A1 publication Critical patent/JPWO2023106401A1/ja
Publication of JPWO2023106401A5 publication Critical patent/JPWO2023106401A5/ja
Application granted granted Critical
Publication of JP7756316B2 publication Critical patent/JP7756316B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/084—Product tracking, e.g. of substrates during the manufacturing process; Component traceability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2023566385A 2021-12-10 2022-12-09 段取り支援装置及び段取り支援方法 Active JP7756316B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021200905 2021-12-10
JP2021200905 2021-12-10
PCT/JP2022/045462 WO2023106401A1 (ja) 2021-12-10 2022-12-09 段取り支援装置及び段取り支援方法

Publications (3)

Publication Number Publication Date
JPWO2023106401A1 JPWO2023106401A1 (https=) 2023-06-15
JPWO2023106401A5 JPWO2023106401A5 (https=) 2024-05-16
JP7756316B2 true JP7756316B2 (ja) 2025-10-20

Family

ID=86730527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023566385A Active JP7756316B2 (ja) 2021-12-10 2022-12-09 段取り支援装置及び段取り支援方法

Country Status (5)

Country Link
US (1) US20250056779A1 (https=)
JP (1) JP7756316B2 (https=)
CN (1) CN117917202A (https=)
DE (1) DE112022005906T5 (https=)
WO (1) WO2023106401A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022158064A1 (https=) * 2021-01-21 2022-07-28

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6920599B2 (ja) 2016-06-01 2021-08-18 パナソニックＩｐマネジメント株式会社 部品実装システム
WO2021181759A1 (ja) 2020-03-12 2021-09-16 パナソニックＩｐマネジメント株式会社 保持装置および部品装着システム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12006175B2 (en) 2019-03-29 2024-06-11 Panasonic Intellectual Property Management Co., Ltd. Carrier tape holding device, holder, and carrier tape package body

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6920599B2 (ja) 2016-06-01 2021-08-18 パナソニックＩｐマネジメント株式会社 部品実装システム
WO2021181759A1 (ja) 2020-03-12 2021-09-16 パナソニックＩｐマネジメント株式会社 保持装置および部品装着システム

Also Published As

Publication number Publication date
WO2023106401A1 (ja) 2023-06-15
CN117917202A (zh) 2024-04-19
DE112022005906T5 (de) 2024-09-19
US20250056779A1 (en) 2025-02-13
JPWO2023106401A1 (https=) 2023-06-15

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