JPWO2023106401A1 - - Google Patents

Info

Publication number
JPWO2023106401A1
JPWO2023106401A1 JP2023566385A JP2023566385A JPWO2023106401A1 JP WO2023106401 A1 JPWO2023106401 A1 JP WO2023106401A1 JP 2023566385 A JP2023566385 A JP 2023566385A JP 2023566385 A JP2023566385 A JP 2023566385A JP WO2023106401 A1 JPWO2023106401 A1 JP WO2023106401A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023566385A
Other languages
Japanese (ja)
Other versions
JPWO2023106401A5 (https=
JP7756316B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023106401A1 publication Critical patent/JPWO2023106401A1/ja
Publication of JPWO2023106401A5 publication Critical patent/JPWO2023106401A5/ja
Application granted granted Critical
Publication of JP7756316B2 publication Critical patent/JP7756316B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/084—Product tracking, e.g. of substrates during the manufacturing process; Component traceability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2023566385A 2021-12-10 2022-12-09 段取り支援装置及び段取り支援方法 Active JP7756316B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021200905 2021-12-10
JP2021200905 2021-12-10
PCT/JP2022/045462 WO2023106401A1 (ja) 2021-12-10 2022-12-09 段取り支援装置及び段取り支援方法

Publications (3)

Publication Number Publication Date
JPWO2023106401A1 true JPWO2023106401A1 (https=) 2023-06-15
JPWO2023106401A5 JPWO2023106401A5 (https=) 2024-05-16
JP7756316B2 JP7756316B2 (ja) 2025-10-20

Family

ID=86730527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023566385A Active JP7756316B2 (ja) 2021-12-10 2022-12-09 段取り支援装置及び段取り支援方法

Country Status (5)

Country Link
US (1) US20250056779A1 (https=)
JP (1) JP7756316B2 (https=)
CN (1) CN117917202A (https=)
DE (1) DE112022005906T5 (https=)
WO (1) WO2023106401A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022158064A1 (https=) * 2021-01-21 2022-07-28

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6920599B2 (ja) * 2016-06-01 2021-08-18 パナソニックＩｐマネジメント株式会社 部品実装システム
WO2021181759A1 (ja) * 2020-03-12 2021-09-16 パナソニックＩｐマネジメント株式会社 保持装置および部品装着システム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12006175B2 (en) 2019-03-29 2024-06-11 Panasonic Intellectual Property Management Co., Ltd. Carrier tape holding device, holder, and carrier tape package body

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6920599B2 (ja) * 2016-06-01 2021-08-18 パナソニックＩｐマネジメント株式会社 部品実装システム
WO2021181759A1 (ja) * 2020-03-12 2021-09-16 パナソニックＩｐマネジメント株式会社 保持装置および部品装着システム

Also Published As

Publication number Publication date
WO2023106401A1 (ja) 2023-06-15
CN117917202A (zh) 2024-04-19
DE112022005906T5 (de) 2024-09-19
US20250056779A1 (en) 2025-02-13
JP7756316B2 (ja) 2025-10-20

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