JP7705310B2 - インプリント装置、インプリント方法、物品の製造方法、及び、プログラム - Google Patents

インプリント装置、インプリント方法、物品の製造方法、及び、プログラム Download PDF

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Publication number
JP7705310B2
JP7705310B2 JP2021141294A JP2021141294A JP7705310B2 JP 7705310 B2 JP7705310 B2 JP 7705310B2 JP 2021141294 A JP2021141294 A JP 2021141294A JP 2021141294 A JP2021141294 A JP 2021141294A JP 7705310 B2 JP7705310 B2 JP 7705310B2
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Japan
Prior art keywords
substrate
mold
foreign matter
imprinting
imprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2021141294A
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English (en)
Japanese (ja)
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JP2023034849A5 (enExample
JP2023034849A (ja
Inventor
直也 鶴見
悠樹 齊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021141294A priority Critical patent/JP7705310B2/ja
Priority to US17/874,785 priority patent/US20230060799A1/en
Priority to KR1020220105204A priority patent/KR20230032928A/ko
Publication of JP2023034849A publication Critical patent/JP2023034849A/ja
Publication of JP2023034849A5 publication Critical patent/JP2023034849A5/ja
Application granted granted Critical
Publication of JP7705310B2 publication Critical patent/JP7705310B2/ja
Priority to US19/285,510 priority patent/US20250353244A1/en
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002Component parts, details or accessories; Auxiliary operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90Measuring, controlling or regulating
    • B29C2037/903Measuring, controlling or regulating by means of a computer

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
JP2021141294A 2021-08-31 2021-08-31 インプリント装置、インプリント方法、物品の製造方法、及び、プログラム Active JP7705310B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021141294A JP7705310B2 (ja) 2021-08-31 2021-08-31 インプリント装置、インプリント方法、物品の製造方法、及び、プログラム
US17/874,785 US20230060799A1 (en) 2021-08-31 2022-07-27 Imprint apparatus, method of imprinting, method of manufacturing article, and program therefor
KR1020220105204A KR20230032928A (ko) 2021-08-31 2022-08-23 임프린트 장치, 임프린트 방법, 물품 제조 방법, 및 이를 위한 프로그램
US19/285,510 US20250353244A1 (en) 2021-08-31 2025-07-30 Imprint apparatus, method of imprinting, method of manufacturing article, and program therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021141294A JP7705310B2 (ja) 2021-08-31 2021-08-31 インプリント装置、インプリント方法、物品の製造方法、及び、プログラム

Publications (3)

Publication Number Publication Date
JP2023034849A JP2023034849A (ja) 2023-03-13
JP2023034849A5 JP2023034849A5 (enExample) 2024-07-31
JP7705310B2 true JP7705310B2 (ja) 2025-07-09

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Family Applications (1)

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JP2021141294A Active JP7705310B2 (ja) 2021-08-31 2021-08-31 インプリント装置、インプリント方法、物品の製造方法、及び、プログラム

Country Status (3)

Country Link
US (2) US20230060799A1 (enExample)
JP (1) JP7705310B2 (enExample)
KR (1) KR20230032928A (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010069762A (ja) 2008-09-19 2010-04-02 Toshiba Corp パターン形成方法
JP2013008815A (ja) 2011-06-24 2013-01-10 Toshiba Corp パターン形成装置、パターン形成方法及びパターン形成用プログラム
JP2016021544A (ja) 2014-07-11 2016-02-04 株式会社東芝 インプリント装置およびインプリント方法
US20190265586A1 (en) 2018-02-23 2019-08-29 SK Hynix Inc. Methods of forming imprinted patterns

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110021291A (ko) * 2009-08-26 2011-03-04 엘아이지에이디피 주식회사 미세패턴 형성장치
JP6823374B2 (ja) * 2016-03-10 2021-02-03 キヤノン株式会社 パターンの欠陥の分析を行う方法、インプリント装置、及び物品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010069762A (ja) 2008-09-19 2010-04-02 Toshiba Corp パターン形成方法
JP2013008815A (ja) 2011-06-24 2013-01-10 Toshiba Corp パターン形成装置、パターン形成方法及びパターン形成用プログラム
JP2016021544A (ja) 2014-07-11 2016-02-04 株式会社東芝 インプリント装置およびインプリント方法
US20190265586A1 (en) 2018-02-23 2019-08-29 SK Hynix Inc. Methods of forming imprinted patterns

Also Published As

Publication number Publication date
KR20230032928A (ko) 2023-03-07
US20230060799A1 (en) 2023-03-02
JP2023034849A (ja) 2023-03-13
US20250353244A1 (en) 2025-11-20

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