JP7692147B2 - 基板を化学的に処理するためのプラズマ処理システム及び方法 - Google Patents

基板を化学的に処理するためのプラズマ処理システム及び方法 Download PDF

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JP7692147B2
JP7692147B2 JP2023513304A JP2023513304A JP7692147B2 JP 7692147 B2 JP7692147 B2 JP 7692147B2 JP 2023513304 A JP2023513304 A JP 2023513304A JP 2023513304 A JP2023513304 A JP 2023513304A JP 7692147 B2 JP7692147 B2 JP 7692147B2
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plenum
radical source
source chamber
radical
plasma
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Japanese (ja)
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JP2023540213A (ja
JP2023540213A5 (https=
Inventor
ヴェンツェク，ピーター
ランジャン，アロック
充敬 大秦
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
JP2023513304A 2020-08-26 2021-08-17 基板を化学的に処理するためのプラズマ処理システム及び方法 Active JP7692147B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/003,734 US11521834B2 (en) 2020-08-26 2020-08-26 Plasma processing systems and methods for chemical processing a substrate
US17/003,734 2020-08-26
PCT/US2021/046224 WO2022046461A1 (en) 2020-08-26 2021-08-17 Plasma processing systems and methods for chemical processing a substrate

Publications (3)

Publication Number Publication Date
JP2023540213A JP2023540213A (ja) 2023-09-22
JP2023540213A5 JP2023540213A5 (https=) 2024-06-20
JP7692147B2 true JP7692147B2 (ja) 2025-06-13

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JP2023513304A Active JP7692147B2 (ja) 2020-08-26 2021-08-17 基板を化学的に処理するためのプラズマ処理システム及び方法

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Country Link
US (1) US11521834B2 (https=)
JP (1) JP7692147B2 (https=)
KR (1) KR102941913B1 (https=)
TW (1) TWI912349B (https=)
WO (1) WO2022046461A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102816359B1 (ko) * 2022-04-28 2025-06-02 아주대학교산학협력단 지르코니아 표면 처리방법
US12394600B2 (en) * 2023-04-28 2025-08-19 Tokyo Electron Limited Balanced RF resonant antenna system
JP7422448B1 (ja) 2023-10-20 2024-01-26 株式会社Dr.Visea プラズマ照射装置
US12580153B2 (en) 2024-01-12 2026-03-17 Tokyo Electron Limited Balanced resonator source for plasma processing

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289583A (ja) 2001-03-26 2002-10-04 Ebara Corp ビーム処理装置
JP2004281231A (ja) 2003-03-14 2004-10-07 Ebara Corp ビーム源及びビーム処理装置
JP2007266006A (ja) 2007-06-20 2007-10-11 Hitachi Kokusai Electric Inc プラズマリアクター
JP2013251546A (ja) 2012-06-04 2013-12-12 Psk Inc 基板処理装置及び方法
JP2014132570A (ja) 2013-01-04 2014-07-17 Psk Inc プラズマチャンバー及び基板処理装置
US20150136325A1 (en) 2013-11-19 2015-05-21 Applied Materials, Inc. Plasma processing using multiple radio frequency power feeds for improved uniformity
JP2018037546A (ja) 2016-08-31 2018-03-08 株式会社ディスコ プラズマエッチング装置
JP2019503077A (ja) 2016-01-07 2019-01-31 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 遠隔プラズマ源及びｄｃ電極を伴う原子層エッチングシステム
US20210050213A1 (en) 2019-08-12 2021-02-18 Mattson Technology, Inc. Enhanced Ignition in Inductively Coupled Plasmas For Workpiece Processing

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Publication number Priority date Publication date Assignee Title
JPH0791655B2 (ja) * 1990-08-01 1995-10-04 日電アネルバ株式会社 表面処理方法および装置
US20040221959A1 (en) * 2003-05-09 2004-11-11 Applied Materials, Inc. Anodized substrate support
JP4674512B2 (ja) * 2005-09-12 2011-04-20 パナソニック株式会社 プラズマ処理装置
US7942969B2 (en) * 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US8382939B2 (en) 2009-07-13 2013-02-26 Applied Materials, Inc. Plasma processing chamber with enhanced gas delivery
JP4855506B2 (ja) 2009-09-15 2012-01-18 住友精密工業株式会社 プラズマエッチング装置
JP6172660B2 (ja) * 2012-08-23 2017-08-02 東京エレクトロン株式会社 成膜装置、及び、低誘電率膜を形成する方法
TW201435138A (zh) 2012-12-21 2014-09-16 Applied Materials Inc 具高清洗效率的對稱氣體分配設備及方法
US11001926B2 (en) * 2014-01-15 2021-05-11 Gallium Enterprises Pty Ltd Apparatus and method for the reduction of impurities in films
US11694911B2 (en) 2016-12-20 2023-07-04 Lam Research Corporation Systems and methods for metastable activated radical selective strip and etch using dual plenum showerhead
US20190198301A1 (en) * 2017-12-27 2019-06-27 Mattson Technology, Inc. Plasma Processing Apparatus and Methods
KR102952863B1 (ko) 2018-09-10 2026-04-14 램 리써치 코포레이션 준안정 (metastable) 활성화된 라디칼 종을 사용한 원자 층 처리 프로세스
WO2021162932A1 (en) * 2020-02-10 2021-08-19 Applied Materials, Inc. Methods and apparatus for improving flow uniformity in a process chamber

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289583A (ja) 2001-03-26 2002-10-04 Ebara Corp ビーム処理装置
JP2004281231A (ja) 2003-03-14 2004-10-07 Ebara Corp ビーム源及びビーム処理装置
JP2007266006A (ja) 2007-06-20 2007-10-11 Hitachi Kokusai Electric Inc プラズマリアクター
JP2013251546A (ja) 2012-06-04 2013-12-12 Psk Inc 基板処理装置及び方法
JP2014132570A (ja) 2013-01-04 2014-07-17 Psk Inc プラズマチャンバー及び基板処理装置
US20150136325A1 (en) 2013-11-19 2015-05-21 Applied Materials, Inc. Plasma processing using multiple radio frequency power feeds for improved uniformity
JP2019503077A (ja) 2016-01-07 2019-01-31 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 遠隔プラズマ源及びｄｃ電極を伴う原子層エッチングシステム
JP2018037546A (ja) 2016-08-31 2018-03-08 株式会社ディスコ プラズマエッチング装置
US20210050213A1 (en) 2019-08-12 2021-02-18 Mattson Technology, Inc. Enhanced Ignition in Inductively Coupled Plasmas For Workpiece Processing

Also Published As

Publication number Publication date
US20220068601A1 (en) 2022-03-03
KR20230051219A (ko) 2023-04-17
WO2022046461A1 (en) 2022-03-03
TW202226321A (zh) 2022-07-01
US11521834B2 (en) 2022-12-06
JP2023540213A (ja) 2023-09-22
KR102941913B1 (ko) 2026-03-19
TWI912349B (zh) 2026-01-21

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