JP7616492B2 - コンデンサ素子 - Google Patents
コンデンサ素子 Download PDFInfo
- Publication number
- JP7616492B2 JP7616492B2 JP2024535154A JP2024535154A JP7616492B2 JP 7616492 B2 JP7616492 B2 JP 7616492B2 JP 2024535154 A JP2024535154 A JP 2024535154A JP 2024535154 A JP2024535154 A JP 2024535154A JP 7616492 B2 JP7616492 B2 JP 7616492B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- anode
- cathode
- center
- penetrating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 title claims description 229
- 239000004020 conductor Substances 0.000 claims description 1122
- 230000000149 penetrating effect Effects 0.000 claims description 294
- 238000007789 sealing Methods 0.000 claims description 118
- 239000010410 layer Substances 0.000 description 360
- 239000011347 resin Substances 0.000 description 44
- 229920005989 resin Polymers 0.000 description 44
- 239000000463 material Substances 0.000 description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 30
- 239000010949 copper Substances 0.000 description 30
- 229910052802 copper Inorganic materials 0.000 description 30
- 229910052751 metal Inorganic materials 0.000 description 25
- 239000002184 metal Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 23
- 239000000945 filler Substances 0.000 description 22
- 229910052799 carbon Inorganic materials 0.000 description 21
- 239000007784 solid electrolyte Substances 0.000 description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 14
- 239000007769 metal material Substances 0.000 description 14
- 238000012545 processing Methods 0.000 description 14
- 229910052709 silver Inorganic materials 0.000 description 14
- 239000004332 silver Substances 0.000 description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 238000007747 plating Methods 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000011810 insulating material Substances 0.000 description 11
- 239000002131 composite material Substances 0.000 description 9
- 150000002739 metals Chemical class 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000000470 constituent Substances 0.000 description 7
- -1 poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000011231 conductive filler Substances 0.000 description 5
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229960002796 polystyrene sulfonate Drugs 0.000 description 2
- 239000011970 polystyrene sulfonate Substances 0.000 description 2
- 229920000123 polythiophene Polymers 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- FLDCSPABIQBYKP-UHFFFAOYSA-N 5-chloro-1,2-dimethylbenzimidazole Chemical compound ClC1=CC=C2N(C)C(C)=NC2=C1 FLDCSPABIQBYKP-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000001741 Ammonium adipate Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229920000491 Polyphenylsulfone Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000019293 ammonium adipate Nutrition 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022117376 | 2022-07-22 | ||
| JP2022117376 | 2022-07-22 | ||
| PCT/JP2023/026760 WO2024019144A1 (ja) | 2022-07-22 | 2023-07-21 | コンデンサ素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024019144A1 JPWO2024019144A1 (https=) | 2024-01-25 |
| JPWO2024019144A5 JPWO2024019144A5 (https=) | 2024-12-19 |
| JP7616492B2 true JP7616492B2 (ja) | 2025-01-17 |
Family
ID=89617970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024535154A Active JP7616492B2 (ja) | 2022-07-22 | 2023-07-21 | コンデンサ素子 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250125098A1 (https=) |
| JP (1) | JP7616492B2 (https=) |
| CN (2) | CN118043919A (https=) |
| WO (1) | WO2024019144A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250140483A1 (en) * | 2023-10-30 | 2025-05-01 | Saras Micro Devices, Inc. | Integrated passive devices with enhanced form factor |
| WO2026048937A1 (ja) * | 2024-09-02 | 2026-03-05 | 株式会社村田製作所 | コンデンサ素子 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004055794A (ja) | 2002-07-19 | 2004-02-19 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ及びその製造方法 |
| JP2006165152A (ja) | 2004-12-06 | 2006-06-22 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ及び固体電解コンデンサ内蔵基板と、それらの製造方法 |
| JP2008098487A (ja) | 2006-10-13 | 2008-04-24 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサおよび固体電解コンデンサ内蔵基板と、それらの製造方法 |
| JP2020167361A (ja) | 2019-03-29 | 2020-10-08 | 株式会社村田製作所 | コンデンサアレイ、及び、複合電子部品 |
-
2022
- 2022-09-20 CN CN202280066442.9A patent/CN118043919A/zh active Pending
-
2023
- 2023-07-21 WO PCT/JP2023/026760 patent/WO2024019144A1/ja not_active Ceased
- 2023-07-21 CN CN202380050595.9A patent/CN119563220A/zh active Pending
- 2023-07-21 JP JP2024535154A patent/JP7616492B2/ja active Active
-
2024
- 2024-12-20 US US18/990,112 patent/US20250125098A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004055794A (ja) | 2002-07-19 | 2004-02-19 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ及びその製造方法 |
| JP2006165152A (ja) | 2004-12-06 | 2006-06-22 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ及び固体電解コンデンサ内蔵基板と、それらの製造方法 |
| JP2008098487A (ja) | 2006-10-13 | 2008-04-24 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサおよび固体電解コンデンサ内蔵基板と、それらの製造方法 |
| JP2020167361A (ja) | 2019-03-29 | 2020-10-08 | 株式会社村田製作所 | コンデンサアレイ、及び、複合電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024019144A1 (ja) | 2024-01-25 |
| JPWO2024019144A1 (https=) | 2024-01-25 |
| CN118043919A (zh) | 2024-05-14 |
| CN119563220A (zh) | 2025-03-04 |
| US20250125098A1 (en) | 2025-04-17 |
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