JP7600907B2 - 基板用コネクタ - Google Patents
基板用コネクタ Download PDFInfo
- Publication number
- JP7600907B2 JP7600907B2 JP2021110740A JP2021110740A JP7600907B2 JP 7600907 B2 JP7600907 B2 JP 7600907B2 JP 2021110740 A JP2021110740 A JP 2021110740A JP 2021110740 A JP2021110740 A JP 2021110740A JP 7600907 B2 JP7600907 B2 JP 7600907B2
- Authority
- JP
- Japan
- Prior art keywords
- inner conductor
- circuit board
- board
- connector
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004020 conductor Substances 0.000 claims description 205
- 238000005192 partition Methods 0.000 claims description 27
- 230000013011 mating Effects 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 description 9
- 238000004891 communication Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021110740A JP7600907B2 (ja) | 2021-07-02 | 2021-07-02 | 基板用コネクタ |
| CN202280044398.1A CN117546373A (zh) | 2021-07-02 | 2022-06-13 | 基板用连接器 |
| US18/572,700 US20240291209A1 (en) | 2021-07-02 | 2022-06-13 | Board connector |
| PCT/JP2022/023597 WO2023276630A1 (ja) | 2021-07-02 | 2022-06-13 | 基板用コネクタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021110740A JP7600907B2 (ja) | 2021-07-02 | 2021-07-02 | 基板用コネクタ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023007717A JP2023007717A (ja) | 2023-01-19 |
| JP2023007717A5 JP2023007717A5 (https=) | 2023-11-09 |
| JP7600907B2 true JP7600907B2 (ja) | 2024-12-17 |
Family
ID=84691733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021110740A Active JP7600907B2 (ja) | 2021-07-02 | 2021-07-02 | 基板用コネクタ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240291209A1 (https=) |
| JP (1) | JP7600907B2 (https=) |
| CN (1) | CN117546373A (https=) |
| WO (1) | WO2023276630A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025179379A (ja) * | 2024-05-28 | 2025-12-10 | 株式会社オートネットワーク技術研究所 | コネクタ |
| JP2025179329A (ja) * | 2024-05-28 | 2025-12-10 | 株式会社オートネットワーク技術研究所 | コネクタ |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002231391A (ja) | 2001-01-31 | 2002-08-16 | Tyco Electronics Amp Kk | シールドコネクタ組立体 |
| JP2017174515A (ja) | 2016-03-18 | 2017-09-28 | ヒロセ電機株式会社 | コネクタ |
| JP2020109738A (ja) | 2018-12-28 | 2020-07-16 | 株式会社オートネットワーク技術研究所 | 基板用コネクタ、及び機器 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL9300971A (nl) * | 1993-06-04 | 1995-01-02 | Framatome Connectors Belgium | Connectorsamenstel voor printkaarten. |
| US9389368B1 (en) * | 2015-04-07 | 2016-07-12 | Tyco Electronics Corporation | Receptacle assembly and set of receptacle assemblies for a communication system |
| JP2017022028A (ja) * | 2015-07-13 | 2017-01-26 | 日本航空電子工業株式会社 | コネクタ |
-
2021
- 2021-07-02 JP JP2021110740A patent/JP7600907B2/ja active Active
-
2022
- 2022-06-13 WO PCT/JP2022/023597 patent/WO2023276630A1/ja not_active Ceased
- 2022-06-13 US US18/572,700 patent/US20240291209A1/en active Pending
- 2022-06-13 CN CN202280044398.1A patent/CN117546373A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002231391A (ja) | 2001-01-31 | 2002-08-16 | Tyco Electronics Amp Kk | シールドコネクタ組立体 |
| JP2017174515A (ja) | 2016-03-18 | 2017-09-28 | ヒロセ電機株式会社 | コネクタ |
| JP2020109738A (ja) | 2018-12-28 | 2020-07-16 | 株式会社オートネットワーク技術研究所 | 基板用コネクタ、及び機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023007717A (ja) | 2023-01-19 |
| US20240291209A1 (en) | 2024-08-29 |
| CN117546373A (zh) | 2024-02-09 |
| WO2023276630A1 (ja) | 2023-01-05 |
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