JP7600475B1 - Ａｌ接続材 - Google Patents

Ａｌ接続材 Download PDF

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Publication number
JP7600475B1
JP7600475B1 JP2024540705A JP2024540705A JP7600475B1 JP 7600475 B1 JP7600475 B1 JP 7600475B1 JP 2024540705 A JP2024540705 A JP 2024540705A JP 2024540705 A JP2024540705 A JP 2024540705A JP 7600475 B1 JP7600475 B1 JP 7600475B1
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Japan
Prior art keywords
less
mass
crystal orientation
connecting material
phase
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JP2024540705A
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English (en)
Japanese (ja)
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JPWO2025115258A5 (https=
JPWO2025115258A1 (https=
Inventor
智裕 宇野
哲哉 小山田
大造 小田
基稀 江藤
裕弥 須藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from PCT/JP2023/042369 external-priority patent/WO2024122381A1/ja
Application filed by Nippon Micrometal Corp, Nippon Steel Chemical and Materials Co Ltd filed Critical Nippon Micrometal Corp
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Publication of JP7600475B1 publication Critical patent/JP7600475B1/ja
Publication of JPWO2025115258A1 publication Critical patent/JPWO2025115258A1/ja
Publication of JPWO2025115258A5 publication Critical patent/JPWO2025115258A5/ja
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JP2024540705A 2022-12-05 2024-06-04 Ａｌ接続材 Active JP7600475B1 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2022194009 2022-12-05
PCT/JP2023/042369 WO2024122381A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
PCT/JP2023/042371 WO2024122382A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
PCT/JP2023/042366 WO2024122380A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
PCT/JP2023/042374 WO2024122384A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
PCT/JP2023/042373 WO2024122383A1 (ja) 2022-12-05 2023-11-27 Ａｌ接続材
PCT/JP2024/020314 WO2025115258A1 (ja) 2022-12-05 2024-06-04 Ａｌ接続材

Publications (3)

Publication Number Publication Date
JP7600475B1 true JP7600475B1 (ja) 2024-12-16
JPWO2025115258A1 JPWO2025115258A1 (https=) 2025-06-05
JPWO2025115258A5 JPWO2025115258A5 (https=) 2025-10-24

Family

ID=97384472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024540705A Active JP7600475B1 (ja) 2022-12-05 2024-06-04 Ａｌ接続材

Country Status (1)

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JP (1) JP7600475B1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019031498A1 (ja) * 2017-08-09 2019-02-14 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
WO2019031497A1 (ja) * 2017-08-09 2019-02-14 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
WO2020184655A1 (ja) * 2019-03-13 2020-09-17 日鉄マイクロメタル株式会社 Ａｌボンディングワイヤ
WO2022168787A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 半導体装置用Ａｌボンディングワイヤ
WO2024122384A1 (ja) * 2022-12-05 2024-06-13 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019031498A1 (ja) * 2017-08-09 2019-02-14 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
WO2019031497A1 (ja) * 2017-08-09 2019-02-14 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
WO2020184655A1 (ja) * 2019-03-13 2020-09-17 日鉄マイクロメタル株式会社 Ａｌボンディングワイヤ
WO2022168787A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 半導体装置用Ａｌボンディングワイヤ
WO2024122384A1 (ja) * 2022-12-05 2024-06-13 日鉄ケミカル＆マテリアル株式会社 Ａｌ接続材

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JPWO2025115258A1 (https=) 2025-06-05

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