JPWO2025115258A5 - - Google Patents
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- Publication number
- JPWO2025115258A5 JPWO2025115258A5 JP2024540705A JP2024540705A JPWO2025115258A5 JP WO2025115258 A5 JPWO2025115258 A5 JP WO2025115258A5 JP 2024540705 A JP2024540705 A JP 2024540705A JP 2024540705 A JP2024540705 A JP 2024540705A JP WO2025115258 A5 JPWO2025115258 A5 JP WO2025115258A5
- Authority
- JP
- Japan
- Prior art keywords
- less
- connecting material
- mass
- crystal orientation
- material according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022194009 | 2022-12-05 | ||
| PCT/JP2023/042369 WO2024122381A1 (ja) | 2022-12-05 | 2023-11-27 | Ａｌ接続材 |
| PCT/JP2023/042371 WO2024122382A1 (ja) | 2022-12-05 | 2023-11-27 | Ａｌ接続材 |
| PCT/JP2023/042366 WO2024122380A1 (ja) | 2022-12-05 | 2023-11-27 | Ａｌ接続材 |
| PCT/JP2023/042374 WO2024122384A1 (ja) | 2022-12-05 | 2023-11-27 | Ａｌ接続材 |
| PCT/JP2023/042373 WO2024122383A1 (ja) | 2022-12-05 | 2023-11-27 | Ａｌ接続材 |
| PCT/JP2024/020314 WO2025115258A1 (ja) | 2022-12-05 | 2024-06-04 | Ａｌ接続材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7600475B1 JP7600475B1 (ja) | 2024-12-16 |
| JPWO2025115258A1 JPWO2025115258A1 (https=) | 2025-06-05 |
| JPWO2025115258A5 true JPWO2025115258A5 (https=) | 2025-10-24 |
Family
ID=97384472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024540705A Active JP7600475B1 (ja) | 2022-12-05 | 2024-06-04 | Ａｌ接続材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7600475B1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019031498A1 (ja) * | 2017-08-09 | 2019-02-14 | 日鉄ケミカル＆マテリアル株式会社 | 半導体装置用Ｃｕ合金ボンディングワイヤ |
| US10790259B2 (en) * | 2017-08-09 | 2020-09-29 | Nippon Steel Chemical & Material Co., Ltd. | Cu alloy bonding wire for semiconductor device |
| KR102801396B1 (ko) * | 2019-03-13 | 2025-04-30 | 닛데쓰마이크로메탈가부시키가이샤 | Al 본딩 와이어 |
| JP7784390B2 (ja) * | 2021-02-05 | 2025-12-11 | 日鉄マイクロメタル株式会社 | 半導体装置用Ａｌボンディングワイヤ |
| DE112023005086T5 (de) * | 2022-12-05 | 2025-10-23 | Nippon Micrometal Corporation | Al-Legierungs-Bonddraht |
-
2024
- 2024-06-04 JP JP2024540705A patent/JP7600475B1/ja active Active
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