JP7566916B2 - 基板搬送装置 - Google Patents

基板搬送装置 Download PDF

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Publication number
JP7566916B2
JP7566916B2 JP2022544860A JP2022544860A JP7566916B2 JP 7566916 B2 JP7566916 B2 JP 7566916B2 JP 2022544860 A JP2022544860 A JP 2022544860A JP 2022544860 A JP2022544860 A JP 2022544860A JP 7566916 B2 JP7566916 B2 JP 7566916B2
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JP
Japan
Prior art keywords
pulley
band
end effector
substrate transport
drive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022544860A
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English (en)
Japanese (ja)
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JP2023522528A5 (enExample
JP2023522528A (ja
Inventor
バブス、ダニエル
ダブリュー ツァン、ヴィンセント
シー メイ、ロバート
Original Assignee
ブルックス オートメーション ユーエス、エルエルシー
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Publication of JP2023522528A5 publication Critical patent/JP2023522528A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/104—Program-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H19/00—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion
    • F16H19/001—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion for conveying reciprocating or limited rotary motion
    • F16H19/003—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion for conveying reciprocating or limited rotary motion comprising a flexible member
    • F16H19/005—Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion for conveying reciprocating or limited rotary motion comprising a flexible member for conveying oscillating or limited rotary motion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2022544860A 2020-01-23 2021-01-25 基板搬送装置 Active JP7566916B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202062964817P 2020-01-23 2020-01-23
US62/964,817 2020-01-23
US17/156,007 2021-01-22
US17/156,007 US11235935B2 (en) 2020-01-23 2021-01-22 Substrate transport apparatus
PCT/US2021/014899 WO2021154640A1 (en) 2020-01-23 2021-01-25 Substrate transport apparatus

Publications (3)

Publication Number Publication Date
JP2023522528A JP2023522528A (ja) 2023-05-31
JP2023522528A5 JP2023522528A5 (enExample) 2024-02-02
JP7566916B2 true JP7566916B2 (ja) 2024-10-15

Family

ID=76969728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022544860A Active JP7566916B2 (ja) 2020-01-23 2021-01-25 基板搬送装置

Country Status (7)

Country Link
US (2) US11235935B2 (enExample)
EP (1) EP4094286A4 (enExample)
JP (1) JP7566916B2 (enExample)
KR (2) KR102763011B1 (enExample)
CN (2) CN115280481A (enExample)
TW (1) TWI851868B (enExample)
WO (1) WO2021154640A1 (enExample)

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* Cited by examiner, † Cited by third party
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US11235935B2 (en) * 2020-01-23 2022-02-01 Brooks Automation, Inc. Substrate transport apparatus
US11413744B2 (en) 2020-03-03 2022-08-16 Applied Materials, Inc. Multi-turn drive assembly and systems and methods of use thereof
US12163228B2 (en) * 2021-05-18 2024-12-10 Mellanox Technologies, Ltd. CVD system with substrate carrier and associated mechanisms for moving substrate therethrough
KR20250107873A (ko) * 2022-12-28 2025-07-14 가와사끼 쥬고교 가부시끼 가이샤 기판 반송 로봇
CN116750481A (zh) * 2023-06-09 2023-09-15 未来维度(深圳)科技有限公司 一种转运系统
US20250065509A1 (en) * 2023-08-21 2025-02-27 Applied Materials Israel Ltd. Robot blade and wafer breakage prevention system
CN116852339B (zh) * 2023-08-24 2024-10-29 上海广川科技有限公司 一种不等臂长的双臂机械手
JP2025099796A (ja) * 2023-12-22 2025-07-03 株式会社ダイヘン ベルト伝動機構およびこれを備えた搬送ロボット
CN120395789B (zh) * 2025-07-03 2025-09-02 中科芯微智能装备(沈阳)有限公司 一种真空机械手臂
CN121157004A (zh) * 2025-11-21 2025-12-19 沈阳新松半导体设备有限公司 一种基于从动端大角度旋转的传动机构

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JP2008223974A (ja) 2007-03-15 2008-09-25 Yaskawa Electric Corp ベルト伝動装置及びそれを備えたロボット
JP2014124741A (ja) 2012-12-27 2014-07-07 Seiko Epson Corp エンドエフェクター
JP2016532299A (ja) 2013-08-26 2016-10-13 ブルックス オートメーション インコーポレイテッド 基板搬送装置
US20160327138A1 (en) 2015-05-07 2016-11-10 Dongfang Jingyuan Electron Limited Drive Mechanism for OPTO-Mechanical Inspection System
US10155309B1 (en) 2017-11-16 2018-12-18 Lam Research Corporation Wafer handling robots with rotational joint encoders
JP2019526171A (ja) 2016-07-12 2019-09-12 ブルックス オートメーション インコーポレイテッド 基板処理装置

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US11235935B2 (en) * 2020-01-23 2022-02-01 Brooks Automation, Inc. Substrate transport apparatus
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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008223974A (ja) 2007-03-15 2008-09-25 Yaskawa Electric Corp ベルト伝動装置及びそれを備えたロボット
JP2014124741A (ja) 2012-12-27 2014-07-07 Seiko Epson Corp エンドエフェクター
JP2016532299A (ja) 2013-08-26 2016-10-13 ブルックス オートメーション インコーポレイテッド 基板搬送装置
US20160327138A1 (en) 2015-05-07 2016-11-10 Dongfang Jingyuan Electron Limited Drive Mechanism for OPTO-Mechanical Inspection System
JP2019526171A (ja) 2016-07-12 2019-09-12 ブルックス オートメーション インコーポレイテッド 基板処理装置
US10155309B1 (en) 2017-11-16 2018-12-18 Lam Research Corporation Wafer handling robots with rotational joint encoders

Also Published As

Publication number Publication date
CN115280481A (zh) 2022-11-01
WO2021154640A1 (en) 2021-08-05
US11235935B2 (en) 2022-02-01
TWI851868B (zh) 2024-08-11
KR20220131978A (ko) 2022-09-29
US12162698B2 (en) 2024-12-10
TW202138143A (zh) 2021-10-16
EP4094286A1 (en) 2022-11-30
JP2023522528A (ja) 2023-05-31
CN119650486A (zh) 2025-03-18
US20220153535A1 (en) 2022-05-19
KR102763011B1 (ko) 2025-02-05
US20210229934A1 (en) 2021-07-29
EP4094286A4 (en) 2024-03-06
KR20250022887A (ko) 2025-02-17
TW202508789A (zh) 2025-03-01

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