JP7555396B2 - 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び感光性転写材料用仮支持体 - Google Patents

感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び感光性転写材料用仮支持体 Download PDF

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JP7555396B2
JP7555396B2 JP2022511746A JP2022511746A JP7555396B2 JP 7555396 B2 JP7555396 B2 JP 7555396B2 JP 2022511746 A JP2022511746 A JP 2022511746A JP 2022511746 A JP2022511746 A JP 2022511746A JP 7555396 B2 JP7555396 B2 JP 7555396B2
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resin layer
mass
photosensitive resin
meth
temporary support
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JPWO2021199996A1 (https=
Inventor
隆志 有冨
一真 両角
洋行 海鉾
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Fujifilm Corp
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Fujifilm Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Human Computer Interaction (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2022511746A 2020-03-30 2021-03-10 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び感光性転写材料用仮支持体 Active JP7555396B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2020061101 2020-03-30
JP2020061101 2020-03-30
JP2020172155 2020-10-12
JP2020172155 2020-10-12
JP2020207812 2020-12-15
JP2020207812 2020-12-15
PCT/JP2021/009634 WO2021199996A1 (ja) 2020-03-30 2021-03-10 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び感光性転写材料用仮支持体

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JPWO2021199996A1 JPWO2021199996A1 (https=) 2021-10-07
JP7555396B2 true JP7555396B2 (ja) 2024-09-24

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JP (1) JP7555396B2 (https=)
CN (1) CN115398341A (https=)
WO (1) WO2021199996A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023120077A1 (ja) * 2021-12-24 2023-06-29 東京応化工業株式会社 組成物、及び感光性組成物
CN118488975A (zh) * 2021-12-24 2024-08-13 东京应化工业株式会社 感光性组合物
WO2024135082A1 (ja) * 2022-12-20 2024-06-27 東レ株式会社 配線基板、遮光層形成用ポジ型感光性樹脂組成物、遮光層転写フィルムおよび配線基板の製造方法
KR20250133404A (ko) * 2023-08-28 2025-09-05 가부시끼가이샤 레조낙 감광성 엘리먼트의 제조 방법, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004012610A (ja) 2002-06-04 2004-01-15 Toray Ind Inc ドライフォトレジスト用二軸延伸ポリエステルフィルム
JP2008239743A (ja) 2007-03-27 2008-10-09 Toray Ind Inc ドライフィルムレジスト支持体用ポリエステルフィルム
WO2017208849A1 (ja) 2016-05-31 2017-12-07 富士フイルム株式会社 感光性樹脂組成物、転写フィルム、加飾パターン、タッチパネル、及びパターンの製造方法
WO2019065373A1 (ja) 2017-09-29 2019-04-04 富士フイルム株式会社 感光性転写材料、回路配線の製造方法及びタッチパネルの製造方法
JP2019191518A (ja) 2018-04-27 2019-10-31 富士フイルム株式会社 感光性転写材料、レジストパターンの製造方法、回路配線の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR8103183A (pt) * 1980-05-27 1982-02-09 Du Pont Camada foto-sensivel fina;elemento foto-resistor;substrato com uma camada foto-sensivel fina laminada;e processo para aparacao de camada foto-sensivel e de um material polimerico fino
CN111201488A (zh) * 2017-10-13 2020-05-26 富士胶片株式会社 电路布线的制造方法、触控面板的制造方法及带图案基材的制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004012610A (ja) 2002-06-04 2004-01-15 Toray Ind Inc ドライフォトレジスト用二軸延伸ポリエステルフィルム
JP2008239743A (ja) 2007-03-27 2008-10-09 Toray Ind Inc ドライフィルムレジスト支持体用ポリエステルフィルム
WO2017208849A1 (ja) 2016-05-31 2017-12-07 富士フイルム株式会社 感光性樹脂組成物、転写フィルム、加飾パターン、タッチパネル、及びパターンの製造方法
WO2019065373A1 (ja) 2017-09-29 2019-04-04 富士フイルム株式会社 感光性転写材料、回路配線の製造方法及びタッチパネルの製造方法
JP2019191518A (ja) 2018-04-27 2019-10-31 富士フイルム株式会社 感光性転写材料、レジストパターンの製造方法、回路配線の製造方法

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