JP7534084B2 - 基板保持装置および基板処理装置 - Google Patents

基板保持装置および基板処理装置 Download PDF

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Publication number
JP7534084B2
JP7534084B2 JP2019226437A JP2019226437A JP7534084B2 JP 7534084 B2 JP7534084 B2 JP 7534084B2 JP 2019226437 A JP2019226437 A JP 2019226437A JP 2019226437 A JP2019226437 A JP 2019226437A JP 7534084 B2 JP7534084 B2 JP 7534084B2
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JP
Japan
Prior art keywords
movable
shaft portions
substrate
shafts
holding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019226437A
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English (en)
Japanese (ja)
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JP2021002639A (ja
JP2021002639A5 (cg-RX-API-DMAC7.html
Inventor
誠 柏木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US16/898,771 priority Critical patent/US11335588B2/en
Priority to KR1020200071405A priority patent/KR102847016B1/ko
Priority to TW109119778A priority patent/TWI884961B/zh
Priority to CN202010546521.2A priority patent/CN112103237B/zh
Priority to EP20180334.3A priority patent/EP3753674B1/en
Publication of JP2021002639A publication Critical patent/JP2021002639A/ja
Publication of JP2021002639A5 publication Critical patent/JP2021002639A5/ja
Priority to JP2024060178A priority patent/JP7638417B2/ja
Application granted granted Critical
Publication of JP7534084B2 publication Critical patent/JP7534084B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2019226437A 2019-06-18 2019-12-16 基板保持装置および基板処理装置 Active JP7534084B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US16/898,771 US11335588B2 (en) 2019-06-18 2020-06-11 Substrate holding apparatus and substrate processing apparatus
TW109119778A TWI884961B (zh) 2019-06-18 2020-06-12 基板保持裝置及基板處理裝置
KR1020200071405A KR102847016B1 (ko) 2019-06-18 2020-06-12 기판 보유 지지 장치 및 기판 처리 장치
EP20180334.3A EP3753674B1 (en) 2019-06-18 2020-06-16 Substrate holding apparatus and substrate processing apparatus
CN202010546521.2A CN112103237B (zh) 2019-06-18 2020-06-16 基板保持装置及基板处理装置
JP2024060178A JP7638417B2 (ja) 2019-06-18 2024-04-03 基板保持装置および基板処理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019112675 2019-06-18
JP2019112675 2019-06-18

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024060178A Division JP7638417B2 (ja) 2019-06-18 2024-04-03 基板保持装置および基板処理装置

Publications (3)

Publication Number Publication Date
JP2021002639A JP2021002639A (ja) 2021-01-07
JP2021002639A5 JP2021002639A5 (cg-RX-API-DMAC7.html) 2022-10-13
JP7534084B2 true JP7534084B2 (ja) 2024-08-14

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JP2019226437A Active JP7534084B2 (ja) 2019-06-18 2019-12-16 基板保持装置および基板処理装置

Country Status (3)

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JP (1) JP7534084B2 (cg-RX-API-DMAC7.html)
KR (1) KR102847016B1 (cg-RX-API-DMAC7.html)
TW (1) TWI884961B (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7897010B2 (ja) 2021-12-24 2026-07-29 株式会社荏原製作所 基板処理方法および基板処理装置
CN114619308B (zh) * 2022-03-29 2023-05-16 杭州众硅电子科技有限公司 一种晶圆抛光系统、装载方法及其使用方法
EP4628255A1 (en) 2022-12-02 2025-10-08 Ebara Corporation Substrate processing method, processing head, and substrate processing device
JP2024151796A (ja) * 2023-04-13 2024-10-25 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置、基板処理装置およびチャックピンの位置判定方法
JP2024172145A (ja) * 2023-05-31 2024-12-12 株式会社荏原製作所 基板保持装置、および基板保持装置における摩耗検出方法
CN117260515B (zh) * 2023-11-22 2024-02-13 北京特思迪半导体设备有限公司 抛光机的动态联动控制方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250783A (ja) 2006-03-15 2007-09-27 Dainippon Screen Mfg Co Ltd 基板保持回転装置
JP2014216391A (ja) 2013-04-23 2014-11-17 株式会社荏原製作所 基板処理装置及び処理基板の製造方法
JP2019083224A (ja) 2017-10-27 2019-05-30 株式会社荏原製作所 基板保持装置並びに基板保持装置を備えた基板処理装置および基板処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621459A (en) * 1984-04-23 1986-11-11 Timesavers, Inc. Segmented platen with diaphragm cylinder control
JP3990567B2 (ja) * 2001-12-18 2007-10-17 大日本スクリーン製造株式会社 ダイヤフラムバルブ、基板処理ユニットおよび基板処理装置
KR102233392B1 (ko) * 2013-03-15 2021-03-30 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 폴리싱을 위한 웨이퍼 및 웨이퍼 에지/사면 클리닝 모듈을 이용하는 디스크/패드 클리닝의 설계
JP6672207B2 (ja) * 2016-07-14 2020-03-25 株式会社荏原製作所 基板の表面を研磨する装置および方法
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250783A (ja) 2006-03-15 2007-09-27 Dainippon Screen Mfg Co Ltd 基板保持回転装置
JP2014216391A (ja) 2013-04-23 2014-11-17 株式会社荏原製作所 基板処理装置及び処理基板の製造方法
JP2019083224A (ja) 2017-10-27 2019-05-30 株式会社荏原製作所 基板保持装置並びに基板保持装置を備えた基板処理装置および基板処理方法

Also Published As

Publication number Publication date
TWI884961B (zh) 2025-06-01
KR102847016B1 (ko) 2025-08-20
KR20200144486A (ko) 2020-12-29
JP2021002639A (ja) 2021-01-07
TW202104045A (zh) 2021-02-01

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