JP7520867B2 - 光学式センサおよび光学式センサモジュール - Google Patents

光学式センサおよび光学式センサモジュール Download PDF

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Publication number
JP7520867B2
JP7520867B2 JP2021554286A JP2021554286A JP7520867B2 JP 7520867 B2 JP7520867 B2 JP 7520867B2 JP 2021554286 A JP2021554286 A JP 2021554286A JP 2021554286 A JP2021554286 A JP 2021554286A JP 7520867 B2 JP7520867 B2 JP 7520867B2
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JP
Japan
Prior art keywords
light
transmitting
emitting element
circuit board
optical
Prior art date
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JP2021554286A
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English (en)
Japanese (ja)
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JPWO2021085098A1 (https=
Inventor
智子 勝原
英 大鳥居
圭 塚本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Sony Semiconductor Solutions Corp
Sony Group Corp
Original Assignee
Sony Corp
Sony Semiconductor Solutions Corp
Sony Group Corp
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Application filed by Sony Corp, Sony Semiconductor Solutions Corp, Sony Group Corp filed Critical Sony Corp
Publication of JPWO2021085098A1 publication Critical patent/JPWO2021085098A1/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
    • G01L1/247—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet using distributed sensing elements, e.g. microcapsules
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
    • G01L1/241—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet by photoelastic stress analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/166—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using photoelectric means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
JP2021554286A 2019-10-30 2020-10-12 光学式センサおよび光学式センサモジュール Active JP7520867B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019197606 2019-10-30
JP2019197606 2019-10-30
PCT/JP2020/038452 WO2021085098A1 (ja) 2019-10-30 2020-10-12 光学式センサおよび光学式センサモジュール

Publications (2)

Publication Number Publication Date
JPWO2021085098A1 JPWO2021085098A1 (https=) 2021-05-06
JP7520867B2 true JP7520867B2 (ja) 2024-07-23

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JP2021554286A Active JP7520867B2 (ja) 2019-10-30 2020-10-12 光学式センサおよび光学式センサモジュール

Country Status (4)

Country Link
US (1) US12078561B2 (https=)
JP (1) JP7520867B2 (https=)
CN (1) CN114599938A (https=)
WO (1) WO2021085098A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220120945A1 (en) * 2020-10-16 2022-04-21 GM Global Technology Operations LLC Feedback sensor for mems mirror
US12439995B2 (en) * 2021-04-08 2025-10-14 University Of Oregon Shoes with integrated optical sensors and methods of making thereof
CN116265885A (zh) * 2021-12-17 2023-06-20 腾讯科技（深圳）有限公司 触觉传感器、触碰事件的检测方法、感知设备及机器人
CN118329246A (zh) * 2023-01-10 2024-07-12 肯塔泰尔私人有限公司 感测布置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349306A (ja) 1999-06-02 2000-12-15 Mitsubishi Electric Corp 集光レンズ付き半導体装置
JP2010539474A (ja) 2007-09-10 2010-12-16 ネーデルランデ オルガニサティー ヴール トゥーヘパストナツールウェテンスハペライク オンデルズーク テーエヌオー 力分布測定用光学センサ
WO2014045685A1 (ja) 2012-09-21 2014-03-27 株式会社安川電機 力センサおよび力センサを有するロボット
US20140326882A1 (en) 2011-11-17 2014-11-06 Optoforce Müszaki Fejlesztö És Innovációs Kft Electrically Insulated Screen and Method of Erecting an Electrically Insulated Screen
JP2015197357A (ja) 2014-04-01 2015-11-09 キヤノン株式会社 光学式力角センサおよびこれを用いた装置
JP2016143561A (ja) 2015-02-02 2016-08-08 内藤電誠工業株式会社 モジュールシステム
JP2017166850A (ja) 2016-03-14 2017-09-21 キヤノン株式会社 位置検出装置、力覚センサ、および、装置
JP2019074421A (ja) 2017-10-17 2019-05-16 キヤノン株式会社 力覚センサ及びロボット
JP2019525132A (ja) 2016-06-20 2019-09-05 エックス デベロップメント エルエルシー 再帰反射多軸力トルクセンサー

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JPS59153139A (ja) * 1983-02-22 1984-09-01 Oki Electric Ind Co Ltd 二次元感圧センサ
JPS60209128A (ja) * 1984-04-02 1985-10-21 Oki Electric Ind Co Ltd 感圧センサ
JPS6141938A (ja) * 1984-08-03 1986-02-28 Oki Electric Ind Co Ltd 二次元感圧センサ
JP3193838B2 (ja) * 1994-11-14 2001-07-30 シャープ株式会社 光半導体装置
JP4621827B2 (ja) * 2004-03-09 2011-01-26 財団法人名古屋産業科学研究所 光学式触覚センサ、光学式触覚センサを利用したセンシング方法、センシングシステム、物体操作力制御方法、物体操作力制御装置、物体把持力制御装置及びロボットハンド
EP2294375B8 (en) * 2008-06-19 2024-02-14 Massachusetts Institute of Technology Tactile sensor using elastomeric imaging
US20120240691A1 (en) * 2011-03-23 2012-09-27 University Of Southern California Elastomeric optical tactile sensor
US9625333B2 (en) * 2013-03-15 2017-04-18 President And Fellows Of Harvard College Tactile sensor
WO2015093442A1 (ja) * 2013-12-16 2015-06-25 京セラ株式会社 受発光素子モジュールおよびこれを用いたセンサ装置
US10483413B2 (en) * 2014-05-13 2019-11-19 Sony Corporation Photoelectric module and optical device
US10038854B1 (en) * 2015-08-14 2018-07-31 X Development Llc Imaging-based tactile sensor with multi-lens array
JP2019191018A (ja) * 2018-04-26 2019-10-31 ソニー株式会社 測距装置及び測距モジュール
CN112097675B (zh) * 2019-06-17 2025-07-25 香港科技大学 触觉传感器
US12557415B2 (en) * 2020-05-29 2026-02-17 Sony Semiconductor Solutions Corporation Imaging element and imaging device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349306A (ja) 1999-06-02 2000-12-15 Mitsubishi Electric Corp 集光レンズ付き半導体装置
JP2010539474A (ja) 2007-09-10 2010-12-16 ネーデルランデ オルガニサティー ヴール トゥーヘパストナツールウェテンスハペライク オンデルズーク テーエヌオー 力分布測定用光学センサ
US20140326882A1 (en) 2011-11-17 2014-11-06 Optoforce Müszaki Fejlesztö És Innovációs Kft Electrically Insulated Screen and Method of Erecting an Electrically Insulated Screen
WO2014045685A1 (ja) 2012-09-21 2014-03-27 株式会社安川電機 力センサおよび力センサを有するロボット
JP2015197357A (ja) 2014-04-01 2015-11-09 キヤノン株式会社 光学式力角センサおよびこれを用いた装置
JP2016143561A (ja) 2015-02-02 2016-08-08 内藤電誠工業株式会社 モジュールシステム
JP2017166850A (ja) 2016-03-14 2017-09-21 キヤノン株式会社 位置検出装置、力覚センサ、および、装置
JP2019525132A (ja) 2016-06-20 2019-09-05 エックス デベロップメント エルエルシー 再帰反射多軸力トルクセンサー
JP2019074421A (ja) 2017-10-17 2019-05-16 キヤノン株式会社 力覚センサ及びロボット

Also Published As

Publication number Publication date
US20220397469A1 (en) 2022-12-15
WO2021085098A1 (ja) 2021-05-06
US12078561B2 (en) 2024-09-03
CN114599938A (zh) 2022-06-07
JPWO2021085098A1 (https=) 2021-05-06

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