JP7506735B2 - 感光性樹脂組成物、パターンの製造方法、感光膜、硬化物、積層体、及び、デバイス - Google Patents

感光性樹脂組成物、パターンの製造方法、感光膜、硬化物、積層体、及び、デバイス Download PDF

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JP7506735B2
JP7506735B2 JP2022504373A JP2022504373A JP7506735B2 JP 7506735 B2 JP7506735 B2 JP 7506735B2 JP 2022504373 A JP2022504373 A JP 2022504373A JP 2022504373 A JP2022504373 A JP 2022504373A JP 7506735 B2 JP7506735 B2 JP 7506735B2
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JPWO2021177263A1 (enExample
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晃 山内
健太 山▲ざき▼
雄一郎 榎本
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2022504373A 2020-03-02 2021-03-02 感光性樹脂組成物、パターンの製造方法、感光膜、硬化物、積層体、及び、デバイス Active JP7506735B2 (ja)

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JP2024096388A JP2024129038A (ja) 2020-03-02 2024-06-14 感光性樹脂組成物、パターンの製造方法、感光膜、硬化物、積層体、及び、デバイス

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JP2020034872 2020-03-02
JP2020034872 2020-03-02
PCT/JP2021/007806 WO2021177263A1 (ja) 2020-03-02 2021-03-02 感光性樹脂組成物、パターンの製造方法、感光膜、硬化物、積層体、及び、デバイス

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JP2024096388A Pending JP2024129038A (ja) 2020-03-02 2024-06-14 感光性樹脂組成物、パターンの製造方法、感光膜、硬化物、積層体、及び、デバイス

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000131838A (ja) 1998-10-26 2000-05-12 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、レリーフパターンの製造法及び半導体装置
JP2000356853A (ja) 1999-06-15 2000-12-26 Hitachi Chemical Dupont Microsystems Ltd 塩基性水溶液現像用ネガ型感光性ポリイミド前駆体組成物及びそれを用いたパターン製造方法
JP2008122889A (ja) 2006-10-18 2008-05-29 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、この感光性樹脂組成物を用いたパターン形成方法及び電子部品
JP2010224319A (ja) 2009-03-24 2010-10-07 Fujifilm Corp 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
WO2018025738A1 (ja) 2016-08-01 2018-02-08 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5571990B2 (ja) * 2009-06-04 2014-08-13 旭化成イーマテリアルズ株式会社 ネガ型感光性樹脂組成物、硬化レリーフパターン形成・製造方法、並びに半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000131838A (ja) 1998-10-26 2000-05-12 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、レリーフパターンの製造法及び半導体装置
JP2000356853A (ja) 1999-06-15 2000-12-26 Hitachi Chemical Dupont Microsystems Ltd 塩基性水溶液現像用ネガ型感光性ポリイミド前駆体組成物及びそれを用いたパターン製造方法
JP2008122889A (ja) 2006-10-18 2008-05-29 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、この感光性樹脂組成物を用いたパターン形成方法及び電子部品
JP2010224319A (ja) 2009-03-24 2010-10-07 Fujifilm Corp 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
WO2018025738A1 (ja) 2016-08-01 2018-02-08 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス

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WO2021177263A1 (ja) 2021-09-10
TW202146527A (zh) 2021-12-16
JP2024129038A (ja) 2024-09-26

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