JP7506152B2 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- JP7506152B2 JP7506152B2 JP2022526687A JP2022526687A JP7506152B2 JP 7506152 B2 JP7506152 B2 JP 7506152B2 JP 2022526687 A JP2022526687 A JP 2022526687A JP 2022526687 A JP2022526687 A JP 2022526687A JP 7506152 B2 JP7506152 B2 JP 7506152B2
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- 239000011342 resin composition Substances 0.000 title claims description 213
- 229920001721 polyimide Polymers 0.000 claims description 423
- 125000004432 carbon atom Chemical group C* 0.000 claims description 254
- 239000004642 Polyimide Substances 0.000 claims description 246
- 125000000962 organic group Chemical group 0.000 claims description 240
- 239000002210 silicon-based material Substances 0.000 claims description 208
- 150000001875 compounds Chemical class 0.000 claims description 164
- 150000004985 diamines Chemical class 0.000 claims description 157
- 239000002253 acid Substances 0.000 claims description 141
- 239000002243 precursor Substances 0.000 claims description 136
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 122
- 125000000524 functional group Chemical group 0.000 claims description 106
- 239000009719 polyimide resin Substances 0.000 claims description 93
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims description 77
- 238000000034 method Methods 0.000 claims description 73
- 125000003277 amino group Chemical group 0.000 claims description 65
- 239000011347 resin Substances 0.000 claims description 60
- 229920005989 resin Polymers 0.000 claims description 60
- 125000001931 aliphatic group Chemical group 0.000 claims description 58
- 239000000758 substrate Substances 0.000 claims description 58
- 238000010438 heat treatment Methods 0.000 claims description 57
- 238000004519 manufacturing process Methods 0.000 claims description 57
- 238000000576 coating method Methods 0.000 claims description 55
- 239000011248 coating agent Substances 0.000 claims description 50
- 125000004018 acid anhydride group Chemical group 0.000 claims description 44
- 125000003118 aryl group Chemical group 0.000 claims description 44
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims description 35
- 238000006068 polycondensation reaction Methods 0.000 claims description 33
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 25
- 125000003700 epoxy group Chemical group 0.000 claims description 25
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 24
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 24
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 23
- 102100031503 Barrier-to-autointegration factor-like protein Human genes 0.000 claims description 22
- 101000729827 Homo sapiens Barrier-to-autointegration factor-like protein Proteins 0.000 claims description 22
- 125000004185 ester group Chemical group 0.000 claims description 19
- 150000004820 halides Chemical group 0.000 claims description 19
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 claims description 18
- NKYXYJFTTIPZDE-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenoxy]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1OC1=CC=C(N)C=C1C(F)(F)F NKYXYJFTTIPZDE-UHFFFAOYSA-N 0.000 claims description 17
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 16
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 claims description 15
- 241000699700 Ondatra zibethicus Species 0.000 claims description 13
- IXLCLXDFIPWZOF-UHFFFAOYSA-N 4-[9-(3,4-dicarboxyphenyl)fluoren-9-yl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1(C=2C=C(C(C(O)=O)=CC=2)C(O)=O)C2=CC=CC=C2C2=CC=CC=C21 IXLCLXDFIPWZOF-UHFFFAOYSA-N 0.000 claims description 5
- 150000008064 anhydrides Chemical class 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- MXPYJVUYLVNEBB-UHFFFAOYSA-N 2-[2-(2-carboxybenzoyl)oxycarbonylbenzoyl]oxycarbonylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(O)=O MXPYJVUYLVNEBB-UHFFFAOYSA-N 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 156
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 156
- 239000010408 film Substances 0.000 description 105
- 238000003756 stirring Methods 0.000 description 81
- 238000006243 chemical reaction Methods 0.000 description 68
- 239000002904 solvent Substances 0.000 description 68
- -1 diamine compounds Chemical class 0.000 description 62
- 125000005462 imide group Chemical group 0.000 description 59
- 239000000243 solution Substances 0.000 description 54
- 239000000203 mixture Substances 0.000 description 53
- 239000002966 varnish Substances 0.000 description 48
- SXGMVGOVILIERA-UHFFFAOYSA-N (2R,3S)-2,3-diaminobutanoic acid Natural products CC(N)C(N)C(O)=O SXGMVGOVILIERA-UHFFFAOYSA-N 0.000 description 47
- 238000010992 reflux Methods 0.000 description 47
- 239000000178 monomer Substances 0.000 description 42
- OVASAEXSPYGGES-UHFFFAOYSA-N C1C2C(C(OC3=O)=O)C3C1CC2(C1=O)CCC21CC1CC2C2C(=O)OC(=O)C12 Chemical compound C1C2C(C(OC3=O)=O)C3C1CC2(C1=O)CCC21CC1CC2C2C(=O)OC(=O)C12 OVASAEXSPYGGES-UHFFFAOYSA-N 0.000 description 37
- 125000003368 amide group Chemical group 0.000 description 31
- 230000035882 stress Effects 0.000 description 28
- 230000015572 biosynthetic process Effects 0.000 description 27
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 27
- 230000000052 comparative effect Effects 0.000 description 26
- 239000010410 layer Substances 0.000 description 24
- 239000003921 oil Substances 0.000 description 24
- 235000019198 oils Nutrition 0.000 description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 23
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 22
- 239000011521 glass Substances 0.000 description 17
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 17
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010703 silicon Substances 0.000 description 17
- 125000004122 cyclic group Chemical group 0.000 description 16
- 230000008569 process Effects 0.000 description 16
- 238000003786 synthesis reaction Methods 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 150000001408 amides Chemical class 0.000 description 14
- 125000006159 dianhydride group Chemical group 0.000 description 14
- 239000012299 nitrogen atmosphere Substances 0.000 description 14
- 238000003860 storage Methods 0.000 description 14
- 239000004094 surface-active agent Substances 0.000 description 14
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 13
- 238000001723 curing Methods 0.000 description 12
- 229910001873 dinitrogen Inorganic materials 0.000 description 12
- 238000001035 drying Methods 0.000 description 12
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- 239000012298 atmosphere Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 238000001914 filtration Methods 0.000 description 10
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 10
- 125000003944 tolyl group Chemical group 0.000 description 10
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 10
- 125000005023 xylyl group Chemical group 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 229920001296 polysiloxane Polymers 0.000 description 9
- 229920002545 silicone oil Polymers 0.000 description 9
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 description 8
- 125000000217 alkyl group Chemical group 0.000 description 8
- 150000001412 amines Chemical group 0.000 description 8
- 125000000753 cycloalkyl group Chemical group 0.000 description 8
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 8
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 8
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 8
- 229910052731 fluorine Inorganic materials 0.000 description 8
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 8
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 8
- 229920006395 saturated elastomer Polymers 0.000 description 8
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 8
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 8
- FMACFWAQBPYRFO-UHFFFAOYSA-N 5-[9-(1,3-dioxo-2-benzofuran-5-yl)fluoren-9-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 FMACFWAQBPYRFO-UHFFFAOYSA-N 0.000 description 7
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 6
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 6
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 6
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 6
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 6
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 125000005843 halogen group Chemical group 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
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- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- KWOIWTRRPFHBSI-UHFFFAOYSA-N 4-[2-[3-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=CC(C(C)(C)C=2C=CC(N)=CC=2)=CC=1C(C)(C)C1=CC=C(N)C=C1 KWOIWTRRPFHBSI-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000009435 amidation Effects 0.000 description 5
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- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 5
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- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 4
- GEWWCWZGHNIUBW-UHFFFAOYSA-N 1-(4-nitrophenyl)propan-2-one Chemical compound CC(=O)CC1=CC=C([N+]([O-])=O)C=C1 GEWWCWZGHNIUBW-UHFFFAOYSA-N 0.000 description 4
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- UENRXLSRMCSUSN-UHFFFAOYSA-N 3,5-diaminobenzoic acid Chemical compound NC1=CC(N)=CC(C(O)=O)=C1 UENRXLSRMCSUSN-UHFFFAOYSA-N 0.000 description 4
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 4
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- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
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- 125000003545 alkoxy group Chemical group 0.000 description 4
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- MQAHXEQUBNDFGI-UHFFFAOYSA-N 5-[4-[2-[4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]phenyl]propan-2-yl]phenoxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC2=CC=C(C=C2)C(C)(C=2C=CC(OC=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)C)=C1 MQAHXEQUBNDFGI-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
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- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 3
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- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical group CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
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- 125000006017 1-propenyl group Chemical group 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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| JP2020093735 | 2020-05-28 | ||
| JP2020093735 | 2020-05-28 | ||
| JP2020093706 | 2020-05-28 | ||
| JP2020093706 | 2020-05-28 | ||
| PCT/JP2021/020567 WO2021241763A1 (fr) | 2020-05-28 | 2021-05-28 | Composition de résine |
Publications (2)
| Publication Number | Publication Date |
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| JPWO2021241763A1 JPWO2021241763A1 (fr) | 2021-12-02 |
| JP7506152B2 true JP7506152B2 (ja) | 2024-06-25 |
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| JP (1) | JP7506152B2 (fr) |
| KR (1) | KR20220158818A (fr) |
| CN (1) | CN115667368A (fr) |
| TW (2) | TWI836943B (fr) |
| WO (1) | WO2021241763A1 (fr) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014098235A1 (fr) | 2012-12-21 | 2014-06-26 | 旭化成イーマテリアルズ株式会社 | Précurseur de polyimide et composition de résine le contenant |
| WO2014148441A1 (fr) | 2013-03-18 | 2014-09-25 | 旭化成イーマテリアルズ株式会社 | Précurseur de résine, composition de résine contenant ledit précurseur de résine, film de résine, procédé de production dudit film de résine, stratifié, et procédé de production dudit stratifié |
| JP2016162403A (ja) | 2015-03-05 | 2016-09-05 | 旭化成株式会社 | ポリイミドを貼り合わせ接着層とする光学部材 |
| WO2019065164A1 (fr) | 2017-09-26 | 2019-04-04 | 東レ株式会社 | Composition de résine de précurseur de polyimide, composition de résine de polyimide, film de résine de polyimide, procédé de production d'un produit stratifié, procédé de production d'un filtre couleur, procédé de production d'un élément cristal liquide, et procédé de production d'un élément el organique |
| WO2019188305A1 (fr) | 2018-03-28 | 2019-10-03 | 三菱瓦斯化学株式会社 | Résine polyimide, vernis polyimide, et film polyimide |
| WO2019208590A1 (fr) | 2018-04-23 | 2019-10-31 | 信越化学工業株式会社 | Composé contenant du silicium |
| WO2019211972A1 (fr) | 2018-05-01 | 2019-11-07 | 三菱瓦斯化学株式会社 | Résine polyimide, vernis polyimide et film polyimide |
| JP2019203120A (ja) | 2018-05-16 | 2019-11-28 | 旭化成株式会社 | ポリイミド前駆体樹脂組成物 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04108879A (ja) * | 1990-08-30 | 1992-04-09 | Nippon Steel Chem Co Ltd | ポリイミド樹脂コーテイング剤組成物 |
| JP6551640B1 (ja) | 2018-02-05 | 2019-07-31 | 三菱瓦斯化学株式会社 | 非対称膜 |
| WO2019208587A1 (fr) * | 2018-04-23 | 2019-10-31 | 旭化成株式会社 | Composition de résine précurseur de polyimide |
| KR20210109525A (ko) * | 2018-12-28 | 2021-09-06 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 이미드-아미드산 공중합체 및 그의 제조방법, 바니시, 그리고 폴리이미드 필름 |
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- 2021-05-28 CN CN202180038523.3A patent/CN115667368A/zh active Pending
- 2021-05-28 TW TW112111278A patent/TWI836943B/zh active
- 2021-05-28 KR KR1020227037482A patent/KR20220158818A/ko unknown
- 2021-05-28 WO PCT/JP2021/020567 patent/WO2021241763A1/fr active Application Filing
- 2021-05-28 TW TW110119436A patent/TWI836221B/zh active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014098235A1 (fr) | 2012-12-21 | 2014-06-26 | 旭化成イーマテリアルズ株式会社 | Précurseur de polyimide et composition de résine le contenant |
| WO2014148441A1 (fr) | 2013-03-18 | 2014-09-25 | 旭化成イーマテリアルズ株式会社 | Précurseur de résine, composition de résine contenant ledit précurseur de résine, film de résine, procédé de production dudit film de résine, stratifié, et procédé de production dudit stratifié |
| JP2016162403A (ja) | 2015-03-05 | 2016-09-05 | 旭化成株式会社 | ポリイミドを貼り合わせ接着層とする光学部材 |
| WO2019065164A1 (fr) | 2017-09-26 | 2019-04-04 | 東レ株式会社 | Composition de résine de précurseur de polyimide, composition de résine de polyimide, film de résine de polyimide, procédé de production d'un produit stratifié, procédé de production d'un filtre couleur, procédé de production d'un élément cristal liquide, et procédé de production d'un élément el organique |
| WO2019188305A1 (fr) | 2018-03-28 | 2019-10-03 | 三菱瓦斯化学株式会社 | Résine polyimide, vernis polyimide, et film polyimide |
| WO2019208590A1 (fr) | 2018-04-23 | 2019-10-31 | 信越化学工業株式会社 | Composé contenant du silicium |
| WO2019211972A1 (fr) | 2018-05-01 | 2019-11-07 | 三菱瓦斯化学株式会社 | Résine polyimide, vernis polyimide et film polyimide |
| JP2019203120A (ja) | 2018-05-16 | 2019-11-28 | 旭化成株式会社 | ポリイミド前駆体樹脂組成物 |
Also Published As
| Publication number | Publication date |
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| TW202204474A (zh) | 2022-02-01 |
| JPWO2021241763A1 (fr) | 2021-12-02 |
| TWI836943B (zh) | 2024-03-21 |
| WO2021241763A1 (fr) | 2021-12-02 |
| CN115667368A (zh) | 2023-01-31 |
| TWI836221B (zh) | 2024-03-21 |
| KR20220158818A (ko) | 2022-12-01 |
| TW202330733A (zh) | 2023-08-01 |
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