JP7503708B1 - 半導体製造装置用部材 - Google Patents

半導体製造装置用部材 Download PDF

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Publication number
JP7503708B1
JP7503708B1 JP2023517749A JP2023517749A JP7503708B1 JP 7503708 B1 JP7503708 B1 JP 7503708B1 JP 2023517749 A JP2023517749 A JP 2023517749A JP 2023517749 A JP2023517749 A JP 2023517749A JP 7503708 B1 JP7503708 B1 JP 7503708B1
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Japan
Prior art keywords
plug
thread
gas
female thread
ceramic plate
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JP2023517749A
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Japanese (ja)
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JPWO2024116412A5 (https=
JPWO2024116412A1 (https=
Inventor
靖也 井上
達也 久野
征樹 石川
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NGK Insulators Ltd
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NGK Insulators Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023517749A 2022-12-02 2022-12-02 半導体製造装置用部材 Active JP7503708B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/044618 WO2024116412A1 (ja) 2022-12-02 2022-12-02 半導体製造装置用部材

Publications (3)

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JPWO2024116412A1 JPWO2024116412A1 (https=) 2024-06-06
JP7503708B1 true JP7503708B1 (ja) 2024-06-20
JPWO2024116412A5 JPWO2024116412A5 (https=) 2024-10-30

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ID=91323173

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JP2023517749A Active JP7503708B1 (ja) 2022-12-02 2022-12-02 半導体製造装置用部材

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JP (1) JP7503708B1 (https=)
WO (1) WO2024116412A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026026650A (ja) * 2024-08-05 2026-02-18 Toto株式会社 静電チャック

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100650290B1 (ko) * 2005-11-23 2006-11-27 (주)넥스트인스트루먼트 비접촉 반송플레이트
JP2009224526A (ja) * 2008-03-17 2009-10-01 Hitachi High-Technologies Corp プラズマ処理装置用試料載置電極
WO2011043063A1 (ja) * 2009-10-05 2011-04-14 キヤノンアネルバ株式会社 基板冷却装置、スパッタリング装置および電子デバイスの製造方法
KR20120067117A (ko) * 2010-12-15 2012-06-25 주식회사 토러스기술연구소 비접촉 반송플레이트
JP2020150071A (ja) * 2019-03-12 2020-09-17 新光電気工業株式会社 基板固定装置
US20200411355A1 (en) * 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100650290B1 (ko) * 2005-11-23 2006-11-27 (주)넥스트인스트루먼트 비접촉 반송플레이트
JP2009224526A (ja) * 2008-03-17 2009-10-01 Hitachi High-Technologies Corp プラズマ処理装置用試料載置電極
WO2011043063A1 (ja) * 2009-10-05 2011-04-14 キヤノンアネルバ株式会社 基板冷却装置、スパッタリング装置および電子デバイスの製造方法
KR20120067117A (ko) * 2010-12-15 2012-06-25 주식회사 토러스기술연구소 비접촉 반송플레이트
JP2020150071A (ja) * 2019-03-12 2020-09-17 新光電気工業株式会社 基板固定装置
US20200411355A1 (en) * 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support

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Publication number Publication date
WO2024116412A1 (ja) 2024-06-06
JPWO2024116412A1 (https=) 2024-06-06

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