JPWO2024116412A1 - - Google Patents

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Publication number
JPWO2024116412A1
JPWO2024116412A1 JP2023517749A JP2023517749A JPWO2024116412A1 JP WO2024116412 A1 JPWO2024116412 A1 JP WO2024116412A1 JP 2023517749 A JP2023517749 A JP 2023517749A JP 2023517749 A JP2023517749 A JP 2023517749A JP WO2024116412 A1 JPWO2024116412 A1 JP WO2024116412A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023517749A
Other languages
Japanese (ja)
Other versions
JP7503708B1 (ja
JPWO2024116412A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed filed Critical
Publication of JPWO2024116412A1 publication Critical patent/JPWO2024116412A1/ja
Application granted granted Critical
Publication of JP7503708B1 publication Critical patent/JP7503708B1/ja
Publication of JPWO2024116412A5 publication Critical patent/JPWO2024116412A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023517749A 2022-12-02 2022-12-02 半導体製造装置用部材 Active JP7503708B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/044618 WO2024116412A1 (ja) 2022-12-02 2022-12-02 半導体製造装置用部材

Publications (3)

Publication Number Publication Date
JPWO2024116412A1 true JPWO2024116412A1 (https=) 2024-06-06
JP7503708B1 JP7503708B1 (ja) 2024-06-20
JPWO2024116412A5 JPWO2024116412A5 (https=) 2024-10-30

Family

ID=91323173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023517749A Active JP7503708B1 (ja) 2022-12-02 2022-12-02 半導体製造装置用部材

Country Status (2)

Country Link
JP (1) JP7503708B1 (https=)
WO (1) WO2024116412A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026026650A (ja) * 2024-08-05 2026-02-18 Toto株式会社 静電チャック

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100650290B1 (ko) * 2005-11-23 2006-11-27 (주)넥스트인스트루먼트 비접촉 반송플레이트
JP2009224526A (ja) * 2008-03-17 2009-10-01 Hitachi High-Technologies Corp プラズマ処理装置用試料載置電極
WO2011043063A1 (ja) * 2009-10-05 2011-04-14 キヤノンアネルバ株式会社 基板冷却装置、スパッタリング装置および電子デバイスの製造方法
KR20120067117A (ko) * 2010-12-15 2012-06-25 주식회사 토러스기술연구소 비접촉 반송플레이트
JP7269759B2 (ja) * 2019-03-12 2023-05-09 新光電気工業株式会社 基板固定装置
US20200411355A1 (en) * 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support

Also Published As

Publication number Publication date
JP7503708B1 (ja) 2024-06-20
WO2024116412A1 (ja) 2024-06-06

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