JP7486554B2 - 耐候性および耐衝撃性に優れた消光性高分子組成物およびこれを含む無光沢シート - Google Patents
耐候性および耐衝撃性に優れた消光性高分子組成物およびこれを含む無光沢シート Download PDFInfo
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- JP7486554B2 JP7486554B2 JP2022136443A JP2022136443A JP7486554B2 JP 7486554 B2 JP7486554 B2 JP 7486554B2 JP 2022136443 A JP2022136443 A JP 2022136443A JP 2022136443 A JP2022136443 A JP 2022136443A JP 7486554 B2 JP7486554 B2 JP 7486554B2
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- styrene
- acrylonitrile
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- polymer composition
- copolymer
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- 239000000203 mixture Substances 0.000 title claims description 90
- 229920000642 polymer Polymers 0.000 title claims description 58
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 claims description 79
- 238000001125 extrusion Methods 0.000 claims description 41
- 150000001875 compounds Chemical class 0.000 claims description 40
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 28
- 229920002877 acrylic styrene acrylonitrile Polymers 0.000 claims description 24
- 239000002253 acid Substances 0.000 claims description 21
- 239000004593 Epoxy Substances 0.000 claims description 19
- 125000002723 alicyclic group Chemical group 0.000 claims description 19
- 229920001577 copolymer Polymers 0.000 claims description 19
- -1 salt compounds Chemical class 0.000 claims description 18
- 239000004417 polycarbonate Substances 0.000 claims description 15
- 229920000515 polycarbonate Polymers 0.000 claims description 15
- ACYXOHNDKRVKLH-UHFFFAOYSA-N 5-phenylpenta-2,4-dienenitrile prop-2-enoic acid Chemical compound OC(=O)C=C.N#CC=CC=CC1=CC=CC=C1 ACYXOHNDKRVKLH-UHFFFAOYSA-N 0.000 claims description 14
- 229920000578 graft copolymer Polymers 0.000 claims description 14
- 230000009477 glass transition Effects 0.000 claims description 12
- 239000004793 Polystyrene Substances 0.000 claims description 11
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- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 9
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 9
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- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 229920002223 polystyrene Polymers 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
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- GRVDASGSTFJQFJ-UHFFFAOYSA-N 2-(3-methyl-7-oxabicyclo[4.1.0]heptane-4-carbonyl)oxyethyl 3-methyl-7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCCOC(=O)C1CC2OC2CC1C GRVDASGSTFJQFJ-UHFFFAOYSA-N 0.000 claims description 3
- GHTVHGGJFHMYBA-UHFFFAOYSA-N 2-(7-oxabicyclo[4.1.0]heptane-4-carbonyloxy)ethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCCOC(=O)C1CC2OC2CC1 GHTVHGGJFHMYBA-UHFFFAOYSA-N 0.000 claims description 3
- YTLHXFVJMRDAMC-UHFFFAOYSA-N 2-[2-(3-methyl-7-oxabicyclo[4.1.0]heptane-4-carbonyl)oxyethoxy]ethyl 3-methyl-7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCCOCCOC(=O)C1CC2OC2CC1C YTLHXFVJMRDAMC-UHFFFAOYSA-N 0.000 claims description 3
- DKHNRHWAVBIOGY-UHFFFAOYSA-N 2-[2-(7-oxabicyclo[4.1.0]heptane-4-carbonyloxy)ethoxy]ethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCCOCCOC(=O)C1CC2OC2CC1 DKHNRHWAVBIOGY-UHFFFAOYSA-N 0.000 claims description 3
- HALQUGNDXXNCJR-UHFFFAOYSA-N 5-(7-oxabicyclo[4.1.0]heptane-4-carbonyloxy)pentyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCCCCCOC(=O)C1CC2OC2CC1 HALQUGNDXXNCJR-UHFFFAOYSA-N 0.000 claims description 3
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 claims description 3
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 claims description 3
- YAAQEISEHDUIFO-UHFFFAOYSA-N C=CC#N.OC(=O)C=CC=CC1=CC=CC=C1 Chemical compound C=CC#N.OC(=O)C=CC=CC1=CC=CC=C1 YAAQEISEHDUIFO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- YOPARWYYTRRJKH-UHFFFAOYSA-N [2-ethyl-3-(7-oxabicyclo[4.1.0]heptane-4-carbonyloxy)hexyl] 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC(CC)C(CCC)OC(=O)C1CC2OC2CC1 YOPARWYYTRRJKH-UHFFFAOYSA-N 0.000 claims description 3
- XUCIKCNNUGINIO-UHFFFAOYSA-N [3-methyl-5-(7-oxabicyclo[4.1.0]heptane-4-carbonyloxy)pentyl] 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCCC(C)CCOC(=O)C1CC2OC2CC1 XUCIKCNNUGINIO-UHFFFAOYSA-N 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- GTZJMIWDRJQUHG-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) butanedioate Chemical compound C1CC2OC2CC1COC(=O)CCC(=O)OCC1CC2OC2CC1 GTZJMIWDRJQUHG-UHFFFAOYSA-N 0.000 claims description 3
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 claims description 3
- LHQZPSHKKVHDTB-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) oxalate Chemical compound C1CC2OC2CC1COC(=O)C(=O)OCC1CC2OC2CC1 LHQZPSHKKVHDTB-UHFFFAOYSA-N 0.000 claims description 3
- 125000000896 monocarboxylic acid group Chemical group 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 239000006224 matting agent Substances 0.000 claims 4
- 238000010791 quenching Methods 0.000 description 38
- 239000000047 product Substances 0.000 description 26
- 239000010410 layer Substances 0.000 description 23
- 230000000171 quenching effect Effects 0.000 description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 13
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- 238000012545 processing Methods 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
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- 238000002347 injection Methods 0.000 description 8
- 239000012963 UV stabilizer Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 230000003746 surface roughness Effects 0.000 description 7
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 6
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 6
- 239000006096 absorbing agent Substances 0.000 description 5
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 5
- 239000002585 base Substances 0.000 description 5
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- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 3
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 3
- 229920000638 styrene acrylonitrile Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- 239000007859 condensation product Substances 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
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- FPDOHAABWLBAKE-UHFFFAOYSA-N 1-bromo-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(Br)C(=O)C=C1C1=CC=CC=C1 FPDOHAABWLBAKE-UHFFFAOYSA-N 0.000 description 1
- SXTILEHINBCKSS-UHFFFAOYSA-N 1-chloro-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(Cl)C(=O)C=C1C1=CC=CC=C1 SXTILEHINBCKSS-UHFFFAOYSA-N 0.000 description 1
- OEVVKKAVYQFQNV-UHFFFAOYSA-N 1-ethenyl-2,4-dimethylbenzene Chemical class CC1=CC=C(C=C)C(C)=C1 OEVVKKAVYQFQNV-UHFFFAOYSA-N 0.000 description 1
- HHVCCCZZVQMAMT-UHFFFAOYSA-N 1-hydroxy-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(O)C(=O)C=C1C1=CC=CC=C1 HHVCCCZZVQMAMT-UHFFFAOYSA-N 0.000 description 1
- QCOLXFOZKYRROA-UHFFFAOYSA-N 1-methoxy-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(OC)C(=O)C=C1C1=CC=CC=C1 QCOLXFOZKYRROA-UHFFFAOYSA-N 0.000 description 1
- IYBPIDAYDPNCTP-UHFFFAOYSA-N 1-methyl-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(C)C(=O)C=C1C1=CC=CC=C1 IYBPIDAYDPNCTP-UHFFFAOYSA-N 0.000 description 1
- PSKLSRMDQQEEGQ-UHFFFAOYSA-N 1-nitro-3-phenylpyrrole-2,5-dione Chemical compound O=C1N([N+](=O)[O-])C(=O)C=C1C1=CC=CC=C1 PSKLSRMDQQEEGQ-UHFFFAOYSA-N 0.000 description 1
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- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 1
- WXHVQMGINBSVAY-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 WXHVQMGINBSVAY-UHFFFAOYSA-N 0.000 description 1
- FJGQBLRYBUAASW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)phenol Chemical compound OC1=CC=CC=C1N1N=C2C=CC=CC2=N1 FJGQBLRYBUAASW-UHFFFAOYSA-N 0.000 description 1
- QFNSAOSWJSCHID-UHFFFAOYSA-N 2-butylbenzenesulfonic acid Chemical compound CCCCC1=CC=CC=C1S(O)(=O)=O QFNSAOSWJSCHID-UHFFFAOYSA-N 0.000 description 1
- QWHHBVWZZLQUIH-UHFFFAOYSA-N 2-octylbenzenesulfonic acid Chemical compound CCCCCCCCC1=CC=CC=C1S(O)(=O)=O QWHHBVWZZLQUIH-UHFFFAOYSA-N 0.000 description 1
- QQBZFCFCMKHPPC-UHFFFAOYSA-N 2-pentadecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O QQBZFCFCMKHPPC-UHFFFAOYSA-N 0.000 description 1
- JMTMSDXUXJISAY-UHFFFAOYSA-N 2H-benzotriazol-4-ol Chemical compound OC1=CC=CC2=C1N=NN2 JMTMSDXUXJISAY-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- HPFWYRKGZUGGPB-UHFFFAOYSA-N 4,6-dichloro-n-(2,4,4-trimethylpentan-2-yl)-1,3,5-triazin-2-amine Chemical compound CC(C)(C)CC(C)(C)NC1=NC(Cl)=NC(Cl)=N1 HPFWYRKGZUGGPB-UHFFFAOYSA-N 0.000 description 1
- STEYNUVPFMIUOY-UHFFFAOYSA-N 4-Hydroxy-1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CC(O)CC(C)(C)N1CCO STEYNUVPFMIUOY-UHFFFAOYSA-N 0.000 description 1
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- APMOEFCWQRJOPS-UHFFFAOYSA-N 5-ethenyl-1,5-dimethylcyclohexa-1,3-diene Chemical class CC1=CC=CC(C)(C=C)C1 APMOEFCWQRJOPS-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- MHBSMCDKOVKGJD-UHFFFAOYSA-N C=C(C1=CC=CC=C1)C=CC#N Chemical compound C=C(C1=CC=CC=C1)C=CC#N MHBSMCDKOVKGJD-UHFFFAOYSA-N 0.000 description 1
- XTJYYRKHFBFRJV-UHFFFAOYSA-N CC1(NC(CC(C1)C(C(=O)O)N(C(C(=O)O)C1CC(NC(C1)(C)C)(C)C)C(C(=O)O)C1CC(NC(C1)(C)C)(C)C)(C)C)C Chemical compound CC1(NC(CC(C1)C(C(=O)O)N(C(C(=O)O)C1CC(NC(C1)(C)C)(C)C)C(C(=O)O)C1CC(NC(C1)(C)C)(C)C)(C)C)C XTJYYRKHFBFRJV-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 241000985630 Lota lota Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 1
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
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- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000003831 antifriction material Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- RSOILICUEWXSLA-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 RSOILICUEWXSLA-UHFFFAOYSA-N 0.000 description 1
- OSIVCXJNIBEGCL-UHFFFAOYSA-N bis(2,2,6,6-tetramethyl-1-octoxypiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(OCCCCCCCC)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(OCCCCCCCC)C(C)(C)C1 OSIVCXJNIBEGCL-UHFFFAOYSA-N 0.000 description 1
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- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
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- NPZTUJOABDZTLV-UHFFFAOYSA-N hydroxybenzotriazole Substances O=C1C=CC=C2NNN=C12 NPZTUJOABDZTLV-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- UKJARPDLRWBRAX-UHFFFAOYSA-N n,n'-bis(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine Chemical compound C1C(C)(C)NC(C)(C)CC1NCCCCCCNC1CC(C)(C)NC(C)(C)C1 UKJARPDLRWBRAX-UHFFFAOYSA-N 0.000 description 1
- 239000003348 petrochemical agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- NZNAAUDJKMURFU-UHFFFAOYSA-N tetrakis(2,2,6,6-tetramethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)NC(C)(C)C1)C(C(=O)OC1CC(C)(C)NC(C)(C)C1)CC(=O)OC1CC(C)(C)NC(C)(C)C1 NZNAAUDJKMURFU-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
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Description
1)表面光沢度(GLOSS):ASTM D523に準じて20゜、60゜および85゜で測定した。
-良好:表面粗さが均一であり、単位面積(100mm×100mm)当たりピンホールが5個未満である。
-普通:表面粗さが均一ではなく、単位面積(100mm×100mm)当たりピンホールが5個以上10個未満である。
-不良:表面粗さが均一ではなく、単位面積(100mm×100mm)当たりピンホールが10個以上である。
ポリスチレン(KUMHO GP-125)17.5wt%、スチレン-アクリロニトリル共重合体(LG化学92HR)70wt%およびN-フェニルマレイミド系共重合体(DENKA IP)12.5wt%で構成された高分子組成物を二軸押出機に投入した。次いで前記高分子組成物100重量部に対して3,4-エポキシシクロヘキシルメチル-3,4-エポキシシクロヘキシルカルボキシレート3.5重量部およびドデシルベンゼンスルホン酸0.1重量部を投入した後、265℃の温度で溶融押出し、ゲルが約65wt%含まれた反応押出型消光剤を取得した。
ポリカーボネート(ロッテケミカルSC-1220R)25wt%およびスチレン-アクリロニトリル共重合体(LG化学92HR)で構成された高分子組成物を二軸押出機に投入した。次いで、前記高分子組成物100重量部に対して3,4-エポキシシクロヘキシルメチル-3,4-エポキシシクロヘキシルカルボキシレート2重量部およびドデシルベンゼンスルホン酸0.15重量部を投入した後、270℃の温度で溶融押出し、ゲルが約58wt%含まれた反応押出型消光剤を取得した。
下記表1によって構成された消光性高分子組成物とともにASA100重量部に対してベンゾトリアゾール系紫外線安定剤(Tinuvin P)1重量部およびHALS系紫外線安定剤(Sanol LS-770)1重量部とASAおよびSANの総和である100重量部に対して、TiO2を3重量部およびフェノール系酸化防止剤0.3重量部を投入してミックスした後、二軸押出機により消光性高分子組成物ペレットを得て、前記ペレットを乾燥し、射出機で、横、縦および厚さが100mm×100mm×3.0mmである射出成形品試験片と単一シート押出機で、横、縦および厚さが50mm×500mm×2.0mmであるシート形態の押出シート試験片を製造した。製造した射出成形品および押出シートの物性を測定し、下記表2に示した。
-SAN-1:LG化学、95HC
(Mw100,000g/mol、アクリロニトリルの含量32wt%、ガラス転移温度106℃)
-SAN-2:LG化学、92HR
(Mw125,000g/mol、アクリロニトリルの含量26wt%、ガラス転移温度105℃)
-α-SAN-2:LG化学、200UH
(Mw85,000g/mol、アクリロニトリルの含量29wt%、ガラス転移温度124℃)
-SAN-3:Galata Chemical、Blendex 869
(Mw約5,000,000g/mol、アクリロニトリルの含量25wt%、ガラス転移温度107℃)
-Blendex B-MAT(Galata Chemical):スチレン-アクリロニトリル共重合体
-XPHERE-NGR(Pocera):スチレン-アクリロニトリル共重合体
Claims (14)
- (A)アクリレート-スチレン-アクリロニトリルグラフト共重合体と、
(B-1)第1スチレン-アクリロニトリル共重合体と、
(B-2)第2スチレン-アクリロニトリル共重合体と、
(C)艶消し剤とを含み、
前記第1スチレン-アクリロニトリル共重合体および第2スチレン-アクリロニトリル共重合体は、互いに異なるアクリロニトリルの含量を有し、
前記第1スチレン-アクリロニトリル共重合体は、アクリロニトリルの含量が31~40wt%であり、かつ第2スチレン-アクリロニトリル共重合体は、アクリロニトリルの含量が22~30wt%であって、
前記艶消し剤は、ポリスチレン(PS)、スチレン-アクリロニトリル共重合体(SAN)、N-フェニルマレイミド系共重合体(PMI)、脂環族エポキシ化合物および酸化合物を含む第1の反応押出用組成物、または、ポリカーボネート(PC)、スチレン-アクリロニトリル共重合体(SAN)、脂環族エポキシ化合物および酸化合物を含む第2の反応押出用組成物から製造される、
艶消し高分子組成物。 - 前記脂環族エポキシ化合物は、3,4-エポキシシクロヘキシルメチル3,4-エポキシシクロヘキサン-カルボキシレート、ジエチレングリコールビス(3,4-エポキシシクロヘキサン-カルボキシレート)、2-エチル-1,3-ヘキサンジオールビス(3,4-エポキシシクロヘキサン-カルボキシレート)、ジエチレングリコールビス(3,4-エポキシ-6-メチルシクロヘキサン-カルボキシレート)、3-メチル-1,5-ペンタンジオールビス(3,4-エポキシシクロヘキサン-カルボキシレート)、1,5-ペンタンジオールビス(3,4-エポキシシクロヘキサン-カルボキシレート)、エチレングリコールビス(3,4-エポキシシクロヘキサン-カルボキシレート)、エチレングリコールビス(3,4-エポキシ-6-メチルシクロヘキサン-カルボキシレート)、ビス(3,4-エポキシシクロヘキシルメチル)オキサレート、ビス(3,4-エポキシシクロヘキシルメチル)スクシネート、ビス(3,4-エポキシシクロヘキシルメチル)アジペートおよび1,2,8,9-ジエポキシリモネンからなる群から選択される一つ以上である、請求項1に記載の艶消し高分子組成物。
- 前記酸化合物は、R1COOHまたはR2SO3Hおよびその塩化合物からなる群から選択されるいずれか一つまたは二つ以上の組み合わせであり、前記R1およびR2は、独立して、C6-30アルキル、C6-30アリールまたはC6-30アルC6-30アルキルである、請求項1に記載の艶消し高分子組成物。
- 前記第1の反応押出用組成物は、ポリスチレン10~20wt%、スチレン-アクリロニトリル共重合体60~80wt%、N-フェニルマレイミド系共重合体5~20wt%、脂環族エポキシ化合物1~6wt%および酸化合物0.01~1.5wt%を含む、請求項1に記載の艶消し高分子組成物。
- 前記第2の反応押出用組成物は、ポリカーボネート15~35wt%、スチレン-アクリロニトリル共重合体60~80wt%、脂環族エポキシ化合物1~6wt%および酸化合物0.01~1.65wt%を含む、請求項1に記載の艶消し高分子組成物。
- 前記艶消し高分子組成物は、アクリレート-スチレン-アクリロニトリルグラフト共重合体100重量部に対して、第1スチレン-アクリロニトリル共重合体50~90重量部、第2スチレン-アクリロニトリル共重合体15~35重量部および艶消し剤2~24重量部を含む、請求項1に記載の艶消し高分子組成物。
- 前記第1スチレン-アクリロニトリル共重合体と第2スチレン-アクリロニトリル共重合体の重量比は1:0.1~0.5である、請求項6に記載の艶消し高分子組成物。
- 前記第2スチレン-アクリロニトリル共重合体のガラス転移温度は110~130℃である、請求項1に記載の艶消し高分子組成物。
- 前記艶消し高分子組成物は、アクリレート-スチレン-アクリロニトリルグラフト共重合体100重量部に対して、第1スチレン-アクリロニトリル共重合体5~50重量部、第2スチレン-アクリロニトリル共重合体30~100重量部および艶消し剤2~24重量部を含む、請求項8に記載の艶消し高分子組成物。
- 前記艶消し高分子組成物は、重量平均分子量が4,000,000g/mol以上である第3スチレン-アクリロニトリル共重合体をさらに含む、請求項1に記載の艶消し高分子組成物。
- 前記第3スチレン-アクリロニトリル共重合体は、アクリレート-スチレン-アクリロニトリルグラフト共重合体100重量部に対して1~6重量部含まれる、請求項10に記載の艶消し高分子組成物。
- 請求項1に記載の艶消し高分子組成物を押出または射出して製造される、成形品。
- 基材層および前記基材層上に請求項1に記載の艶消し高分子組成物が共押出されて積層されたスキン層を含む、シート。
- 前記基材層は、ポリ塩化ビニル(PVC)、ポリプロピレン(PP)、ポリアクリレート(polyacrylate)、ポリエチレンテレフタレート(PET)、ポリブチレンテレフタレート(PBT)、ポリメチルメタクリレート(PMMA)、ポリカーボネート(PC)、ポリアミド(polyamide)、スチレン-アクリロニトリル共重合体(SAN)、アクリロニトリル-ブタジエン-スチレン(ABS)、アクリロニトリル-スチレン-アクリレート(ASA)およびこれらの混合物からなる群から選択される一つ以上である、請求項13に記載のシート。
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US5530062A (en) * | 1995-06-05 | 1996-06-25 | General Electric Company | Production of low gloss additives for thermoplastic resins |
KR100478437B1 (ko) * | 2002-12-18 | 2005-03-23 | 제일모직주식회사 | 광택도가 낮고 유동성이 우수한 열가소성 수지 조성물 |
KR101816428B1 (ko) * | 2016-08-04 | 2018-01-08 | 현대자동차주식회사 | 내후성 및 내열성이 우수한 저광택 asa계 수지 조성물 |
KR102298295B1 (ko) * | 2018-10-31 | 2021-09-07 | 주식회사 엘지화학 | 열가소성 수지 조성물 |
KR102382945B1 (ko) * | 2021-09-03 | 2022-04-08 | 주식회사 한나노텍 | 내후성 및 내충격성이 우수한 소광성 고분자 조성물 및 이를 포함하는 무광택 시트 |
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- 2022-08-31 US US17/823,900 patent/US20230081156A1/en active Pending
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JP2007522273A (ja) | 2004-01-08 | 2007-08-09 | ディーエスエム アイピー アセッツ ビー.ブイ. | 高分子重縮合物の調製法 |
US20190185655A1 (en) | 2016-08-26 | 2019-06-20 | Lotte Advanced Materials Co., Ltd. | Thermoplastic Resin Composition and Molded Article Formed Therefrom |
JP2021503032A (ja) | 2017-12-11 | 2021-02-04 | エルジー・ケム・リミテッド | 耐熱樹脂組成物およびこれを用いた自動車用のスポイラー |
JP2023036048A (ja) | 2021-09-01 | 2023-03-13 | ハンナノテク カンパニー,リミテッド | 重合体粒子を含む消光剤、これを含む消光性高分子組成物及びこの製造方法 |
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US20230081156A1 (en) | 2023-03-16 |
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