JP7475923B2 - 半導体装置製造用シート及び半導体装置製造用シートの製造方法。 - Google Patents

半導体装置製造用シート及び半導体装置製造用シートの製造方法。 Download PDF

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Publication number
JP7475923B2
JP7475923B2 JP2020058730A JP2020058730A JP7475923B2 JP 7475923 B2 JP7475923 B2 JP 7475923B2 JP 2020058730 A JP2020058730 A JP 2020058730A JP 2020058730 A JP2020058730 A JP 2020058730A JP 7475923 B2 JP7475923 B2 JP 7475923B2
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Japan
Prior art keywords
adhesive
film
sheet
semiconductor device
pressure
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JP2020058730A
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English (en)
Japanese (ja)
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JP2021158277A (ja
Inventor
渉 岩屋
陽輔 佐藤
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Lintec Corp
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Lintec Corp
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Publication date
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Priority to JP2020058730A priority Critical patent/JP7475923B2/ja
Priority to TW110110959A priority patent/TW202145323A/zh
Priority to CN202110325401.4A priority patent/CN113451195A/zh
Priority to KR1020210039285A priority patent/KR20210120895A/ko
Publication of JP2021158277A publication Critical patent/JP2021158277A/ja
Application granted granted Critical
Publication of JP7475923B2 publication Critical patent/JP7475923B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
JP2020058730A 2020-03-27 2020-03-27 半導体装置製造用シート及び半導体装置製造用シートの製造方法。 Active JP7475923B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020058730A JP7475923B2 (ja) 2020-03-27 2020-03-27 半導体装置製造用シート及び半導体装置製造用シートの製造方法。
TW110110959A TW202145323A (zh) 2020-03-27 2021-03-26 半導體裝置製造用片以及半導體裝置製造用片之製造方法
CN202110325401.4A CN113451195A (zh) 2020-03-27 2021-03-26 半导体装置制造用片及半导体装置制造用片的制造方法
KR1020210039285A KR20210120895A (ko) 2020-03-27 2021-03-26 반도체 장치 제조용 시트 및 반도체 장치 제조용 시트의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020058730A JP7475923B2 (ja) 2020-03-27 2020-03-27 半導体装置製造用シート及び半導体装置製造用シートの製造方法。

Publications (2)

Publication Number Publication Date
JP2021158277A JP2021158277A (ja) 2021-10-07
JP7475923B2 true JP7475923B2 (ja) 2024-04-30

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JP2020058730A Active JP7475923B2 (ja) 2020-03-27 2020-03-27 半導体装置製造用シート及び半導体装置製造用シートの製造方法。

Country Status (4)

Country Link
JP (1) JP7475923B2 (zh)
KR (1) KR20210120895A (zh)
CN (1) CN113451195A (zh)
TW (1) TW202145323A (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010126716A (ja) 2008-12-01 2010-06-10 Nitto Denko Corp 半導体装置製造用フィルムロール
JP2012033672A (ja) 2010-07-30 2012-02-16 Furukawa Electric Co Ltd:The ウエハ加工用テープ
WO2015059944A1 (ja) 2013-10-21 2015-04-30 リンテック株式会社 樹脂膜形成用シート
WO2016098697A1 (ja) 2014-12-19 2016-06-23 リンテック株式会社 樹脂膜形成用シート積層体
WO2018083982A1 (ja) 2016-11-01 2018-05-11 リンテック株式会社 ダイシングダイボンディングシート、及び半導体チップの製造方法
JP2018174220A (ja) 2017-03-31 2018-11-08 古河電気工業株式会社 剥離ライナー付マスク一体型表面保護テープ
JP2019046827A (ja) 2017-08-29 2019-03-22 リンテック株式会社 ダイボンディングシート

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946650B2 (ja) 1976-05-18 1984-11-14 株式会社サンノ− 家畜ふん尿固液分離装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010126716A (ja) 2008-12-01 2010-06-10 Nitto Denko Corp 半導体装置製造用フィルムロール
JP2012033672A (ja) 2010-07-30 2012-02-16 Furukawa Electric Co Ltd:The ウエハ加工用テープ
WO2015059944A1 (ja) 2013-10-21 2015-04-30 リンテック株式会社 樹脂膜形成用シート
WO2016098697A1 (ja) 2014-12-19 2016-06-23 リンテック株式会社 樹脂膜形成用シート積層体
WO2018083982A1 (ja) 2016-11-01 2018-05-11 リンテック株式会社 ダイシングダイボンディングシート、及び半導体チップの製造方法
JP2018174220A (ja) 2017-03-31 2018-11-08 古河電気工業株式会社 剥離ライナー付マスク一体型表面保護テープ
JP2019046827A (ja) 2017-08-29 2019-03-22 リンテック株式会社 ダイボンディングシート

Also Published As

Publication number Publication date
TW202145323A (zh) 2021-12-01
JP2021158277A (ja) 2021-10-07
KR20210120895A (ko) 2021-10-07
CN113451195A (zh) 2021-09-28

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