JP7467990B2 - RF tagged cardboard and method for manufacturing RF tagged cardboard - Google Patents

RF tagged cardboard and method for manufacturing RF tagged cardboard Download PDF

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JP7467990B2
JP7467990B2 JP2020037306A JP2020037306A JP7467990B2 JP 7467990 B2 JP7467990 B2 JP 7467990B2 JP 2020037306 A JP2020037306 A JP 2020037306A JP 2020037306 A JP2020037306 A JP 2020037306A JP 7467990 B2 JP7467990 B2 JP 7467990B2
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cardboard
tag
flute
liner
chip
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功 田島
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Dai Nippon Printing Co Ltd
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Description

本発明は，自動認識の技術分野で用いられるＲＦタグ（RF: Radio Frequency）に関し，更に詳しくは，ＲＦタグを段ボールに内蔵させる技術に関する。 The present invention relates to RF tags (RF: Radio Frequency) used in the field of automatic identification technology, and more specifically to technology for embedding RF tags in cardboard.

ＩＣタグまたは無線タグとも称されるＲＦタグを段ボールの表面に貼付して物流管理を行う試みが以前より検討または実施されている（例えば，特許文献１の図１）。ＲＦタグを表面に貼付した段ボールはブロック積みされることが多く，ブロック積みされた段ボールに流通過程で衝撃が加わると，ＲＦタグが他の段ボールの表面と強く擦れＲＦタグが破損してしまう危険性がある。よって，ＲＦタグを用いて物流管理を行う際は，段ボールに貼り付けるＲＦタグが流通過程で破損しない工夫が必要となる。 Attempts have been made in the past to manage logistics by attaching RF tags, also known as IC tags or wireless tags, to the surface of cardboard (for example, Figure 1 of Patent Document 1). Cardboard with RF tags attached to its surface is often stacked in blocks, and if the stacked cardboard blocks are subjected to impact during distribution, there is a risk that the RF tag will rub strongly against the surface of the other cardboard and be damaged. Therefore, when managing logistics using RF tags, it is necessary to devise a way to prevent the RF tags attached to the cardboard from being damaged during distribution.

段ボールに貼り付けるＲＦタグが流通過程で破損しない工夫として，段ボールを構成するライナとフルート（中芯）の間にＲＦタグを挿入することがすでに発案されている（例えば，特許文献２）。２枚のライナの間に挟まれるフルートは波形に加工されるため，ライナとフルート間には隙間が発生し，特許文献２では，この隙間にＲＦタグを挿入している。 As a way to prevent RF tags affixed to cardboard from being damaged during distribution, it has already been proposed to insert an RF tag between the liner and flute (core) that make up the cardboard (for example, Patent Document 2). Because the flutes sandwiched between the two liners are corrugated, a gap occurs between the liner and the flute, and in Patent Document 2, the RF tag is inserted into this gap.

ＷＯ２０１８／０６１６３７号公報Patent Publication No. WO2018/061637 特開２００６－１５１４０２号公報JP 2006-151402 A

ソースタギングを考慮すると，段ボールの製造工程においてＲＦタグを段ボールに内蔵させることが望ましいが，ライナとフルートの隙間にＲＦタグを挿入する従来の方式は，ライナとフルートの隙間にＲＦタグを挿入する都合上，段ボールの製造工程において，段ボールにＲＦタグを内蔵させることは困難である。 Considering source tagging, it is desirable to embed an RF tag in the cardboard during the manufacturing process, but the conventional method of inserting an RF tag into the gap between the liner and the flute makes it difficult to embed an RF tag in the cardboard during the manufacturing process because the RF tag must be inserted into the gap between the liner and the flute.

そこで，本発明は，段ボールの製造工程でＲＦタグを段ボールにソースタギングできる構造のＲＦタグ付き段ボールおよびＲＦタグ付き段ボールの製造方法を提供する。 Therefore, the present invention provides RF tagged cardboard that is structured so that RF tags can be source tagged onto cardboard during the cardboard manufacturing process, and a method for manufacturing RF tagged cardboard.

上述した課題を解決する物のカテゴリーに係る第１発明は，波形に加工したフルートの少なくとも片面にライナを貼り合わせた構造の段ボールであって，アンテナとこれに接続するＩＣチップを紙素材の基材シートに実装したＲＦタグを，前記ＩＣチップを実装した面と前記フルートの片面を対向させた状態で前記ライナと前記フルートの間に挟み込み，紙と紙を貼り合わせる接着剤により前記ライナと前記フルートを貼り合わせていることを特徴とするＲＦタグ付き段ボールである。段ボールの製造工程では，前記フルートの段頂に接着剤を塗布した後，前記フルートと前記ライナを貼り合わせるため，前記ＩＣチップを実装した面と前記フルートの片面を対向させた状態で前記ライナと前記フルートの間に挟み込んだ構造にすることで，段ボールの製造工程で前記ＲＦタグを段ボールにソースタギングできる。なお，第１発明では，前記ＩＣチップの破損を防止するために，前記フルートの段頂と段頂の間にある空間に前記ＲＦタグの前記ＩＣチップを収めること望ましい。 The first invention, which relates to a category of items that solve the above-mentioned problems, is a corrugated board with a liner attached to at least one side of a corrugated flute, and an RF tag , which is a base sheet made of paper material and has an antenna and an IC chip connected thereto , is sandwiched between the liner and the flute with the surface with the IC chip facing one side of the flute, and the liner and the flute are bonded together with an adhesive that bonds paper to paper . In the manufacturing process of the corrugated board, adhesive is applied to the flute's step top, and then the flute and the liner are bonded together, so that the flute and the liner are sandwiched between the liner and the flute with the surface with the IC chip facing one side of the flute, thereby enabling source tagging of the RF tag to the corrugated board during the manufacturing process of the corrugated board. In the first invention, it is preferable to store the IC chip of the RF tag in the space between the step tops of the flutes to prevent damage to the IC chip.

更に，上述した課題を解決する製造方法のカテゴリーに係る第２発明は，波形に加工したフルートの片面に紙と紙を貼り合わせる接着剤を塗布する工程ａと，アンテナとこれに接続するＩＣチップを紙素材の基材シートに実装したＲＦタグを，前記ＩＣチップを実装した面と前記接着剤を塗布した前記フルートの面を対向させた状態で，前記接着剤を塗布した前記フルートの面に貼り付ける工程ｂと，接着剤を塗布した前記フルートの面にライナを貼り付ける工程ｃを含むことを特徴とするＲＦタグ付き段ボールの製造方法である。前記工程ａ前記と工程ｃの間で前記工程ｂを実行することで，段ボールの製造工程で前記ＲＦタグを段ボールにソースタギングできる。なお，第２発明では，前記ＩＣチップの破損を防止するために，前記工程ｂにおいて，前記フルートの段頂と段頂の間にある空間に前記ＲＦタグの前記ＩＣチップを収める状態で，前記接着剤を塗布した前記フルートの面に前記ＲＦタグを貼り付けることが望ましい。 Further, the second invention, which is related to the category of manufacturing methods that solve the above-mentioned problems, is a manufacturing method of RF-tagged cardboard, which includes a step a of applying an adhesive for bonding paper to one side of a corrugated flute, a step b of attaching an RF tag, which is a paper base sheet having an antenna and an IC chip connected thereto, to the surface of the flute to which the adhesive has been applied, in a state in which the surface on which the IC chip is mounted faces the surface of the flute to which the adhesive has been applied, and a step c of attaching a liner to the surface of the flute to which the adhesive has been applied. By carrying out the step b between the steps a and c, the RF tag can be source tagged to the cardboard during the cardboard manufacturing process. In addition, in the second invention, in order to prevent damage to the IC chip, it is preferable to attach the RF tag to the surface of the flute to which the adhesive has been applied, in a state in which the IC chip of the RF tag is placed in the space between the step tops of the flute, in the step b.

このように，本発明によれば，段ボールの製造工程でＲＦタグを段ボールにソースタギングできる構造のＲＦタグ付き段ボールおよびＲＦタグ付き段ボールの製造方法を提供できる。 In this way, the present invention can provide RF tagged cardboard that is structured so that RF tags can be source tagged onto cardboard during the cardboard manufacturing process, and a method for manufacturing RF tagged cardboard.

ＲＦタグ付き段ボールの構造を説明する図。FIG. 2 is a diagram illustrating the structure of a cardboard box with an RF tag. ＲＦタグの構造を説明する図Diagram explaining the structure of an RF tag ＲＦタグ付き段ボールの断面を説明する図。FIG. 2 is a diagram illustrating a cross section of a cardboard box with an RF tag. ＲＦタグ付き段ボールの製造工程を説明する図。1A to 1C are diagrams illustrating the manufacturing process of cardboard with an RF tag. ＲＦタグ付き段ボールを利用した段ボール箱を説明する図。FIG. 1 is a diagram illustrating a cardboard box using cardboard with an RF tag.

ここから，本発明に係る実施形態について記載する。本実施形態は，本発明の理解を容易にするためのものであり，本発明は，本実施形態に限定されるものではない。また，特に断りのない限り，図面は，本発明の理解を容易にするために描かれた模式的な図である。 From here, an embodiment of the present invention will be described. This embodiment is intended to facilitate understanding of the present invention, and the present invention is not limited to this embodiment. Furthermore, unless otherwise specified, the drawings are schematic diagrams drawn to facilitate understanding of the present invention.

図１は，本実施形態に係るＲＦタグ付き段ボール１の構造を説明する図である。図２は，ＲＦタグ付き段ボール１に内蔵させるＲＦタグ１２を説明する図である。図３は，ＲＦタグ付き段ボール１の断面を説明する図である。 Figure 1 is a diagram explaining the structure of the RF tagged cardboard 1 according to this embodiment. Figure 2 is a diagram explaining the RF tag 12 embedded in the RF tagged cardboard 1. Figure 3 is a diagram explaining the cross section of the RF tagged cardboard 1.

本実施形態に係るＲＦタグ付き段ボール１は，段ボールの製造段階でＲＦタグ１２を段ボールにソースタギングできる構造になっている。図１で図示したように，本実施形態に係るＲＦタグ付き段ボール１は，波形に加工したフルート１１（中芯）の少なくとも片面にライナ１０を貼った構造の段ボールにおいて，アンテナ１２０とこれと接続するＩＣチップ１２１を基材シート１２２に実装したＲＦタグ１２を，ＩＣチップ１２１を実装したＲＦタグ１２の面とフルート１１の片面を対向させた状態でライナ１０とフルート１１の間に挟み込んだ構造になっている。 The RF tagged cardboard 1 according to this embodiment has a structure that allows the RF tag 12 to be source tagged onto the cardboard during the cardboard manufacturing stage. As shown in FIG. 1, the RF tagged cardboard 1 according to this embodiment has a structure in which a liner 10 is attached to at least one side of a corrugated flute 11 (core), and an RF tag 12 having an antenna 120 and an IC chip 121 connected to it mounted on a base sheet 122 is sandwiched between the liner 10 and the flute 11 with the surface of the RF tag 12 mounting the IC chip 121 facing one side of the flute 11.

本実施形態に係るＲＦタグ付き段ボール１は，波形に加工したフルート１１の片面にライナ１０を貼り合わせた片面段ボールの形態でも実現可能であるが，図１で図示したＲＦタグ付き段ボール１は，波形に加工したフルート１１の両面それぞれにライナ１０（表ライナ１０ａと裏ライナ１０ｂ）を貼り合わせた両面段ボールの形態になっている。フルート１１と共にＲＦタグ１２を挟み込むライナ１０は裏ライナ１０ｂにすることもできるが，図１では，フルート１１と共にＲＦタグ１２を挟み込むライナ１０は表ライナ１０ａになっている。 The RF-tagged cardboard 1 according to this embodiment can also be realized in the form of single-sided cardboard with a liner 10 attached to one side of the corrugated flutes 11, but the RF-tagged cardboard 1 illustrated in FIG. 1 is in the form of double-sided cardboard with liners 10 (front liner 10a and back liner 10b) attached to both sides of the corrugated flutes 11. The liner 10 that sandwiches the RF tag 12 together with the flutes 11 can also be the back liner 10b, but in FIG. 1, the liner 10 that sandwiches the RF tag 12 together with the flutes 11 is the front liner 10a.

図２で図示したように，ライナ１０とフルート１１の間に挟ませるＲＦタグ１２は，アンテナ１２０とこれに接続するＩＣチップ１２１を基材シート１２２に実装した構造になっている。一般的なＲＦタグラベルにはＩＣチップ１２１を保護するシートを積層するが，ＲＦタグ付き段ボール１に内蔵するＲＦタグ１２にはこのシートは積層されず，ＲＦタグ付き段ボール１では，フルート１１がこのシートの役割を果たす。なお，段ボールの製造では，紙と紙を貼り合わせる接着剤（例えば，コンスターチ）を利用するため，ＲＦタグ１２の基材シート１２２には紙素材を用いることが好適である。 As shown in FIG. 2, the RF tag 12 sandwiched between the liner 10 and the flute 11 has a structure in which an antenna 120 and an IC chip 121 connected to it are mounted on a base sheet 122. A sheet that protects the IC chip 121 is laminated on a typical RF tag label, but this sheet is not laminated on the RF tag 12 built into the RF tagged cardboard 1, and in the RF tagged cardboard 1, the flute 11 plays the role of this sheet. Note that, since an adhesive (e.g., cornstarch) is used to bond paper to paper in the manufacture of cardboard, it is preferable to use a paper material for the base sheet 122 of the RF tag 12.

ライナ１０とフルート１１の間に挟み込むＲＦタグ１２の形態は，図２で示した形態に限定されない。例えば，図２では，ＲＦタグ１２に実装するアンテナ１２０は２枚の放射板を備えた構造になっているが，ＲＦタグ１２に実装するアンテナ１２０の構造は線状やループ状など任意に決定できる。また，ＩＣチップ１２１に電極を接続させたストラップシートを用意し，ストラップシートの電極とアンテナ１２０を異方性導電フィルムや異方性導電ペースにより接合させた構造にＲＦタグ１２をすることもできる。 The shape of the RF tag 12 sandwiched between the liner 10 and the flute 11 is not limited to the shape shown in Fig. 2. For example, in Fig. 2, the antenna 120 mounted on the RF tag 12 has a structure with two radiation plates, but the structure of the antenna 120 mounted on the RF tag 12 can be arbitrarily determined, such as linear or loop-shaped. In addition, the RF tag 12 can be structured by preparing a strap sheet with electrodes connected to the IC chip 121, and joining the electrodes of the strap sheet and the antenna 120 with an anisotropic conductive film or anisotropic conductive paste.

図３で図示したように，ＲＦタグ付き段ボール１において，ＲＦタグ１２は，ライナ１０とフルート１１の間に挟み込まれた状態になっており，段ボールの製造工程にてフルート１１の段頂に塗布する接着剤（糊）を利用して，ＲＦタグ１２はフルート１１に接着している。また，ＲＦタグ１２が存在しない箇所については，この接着剤を利用して，フルート１１の両面にライナ１０が接着している。 As shown in Figure 3, in the RF tag-attached cardboard 1, the RF tag 12 is sandwiched between the liner 10 and the flutes 11, and the RF tag 12 is adhered to the flutes 11 using adhesive (glue) that is applied to the tops of the flutes 11 during the manufacturing process of the cardboard. In addition, in areas where the RF tag 12 is not present, the liner 10 is adhered to both sides of the flutes 11 using this adhesive.

ＲＦタグ１２に実装したＩＣチップ１２１が，波形に加工されたフルート１１の段頂と接触すると，ＲＦタグ１２に実装したＩＣチップ１２１が破損する危険性が増すため，ＲＦタグ付き段ボール１では，波形に加工されたフルート１１の段頂と段頂の間にある空間に，ＩＣチップ１２１が収まるようにＲＦタグ１２を挟み込んでいる。このように，ライナ１０とフルート１１の間にＲＦタグ１２を挟み込むことで，ＲＦタグ１２に実装したＩＣチップ１２１の上には空間が存在するため，ＲＦタグ１２に実装したＩＣチップ１２１が破損する危険性を減らすことができる。 When the IC chip 121 mounted on the RF tag 12 comes into contact with the tops of the corrugated flutes 11, there is an increased risk of the IC chip 121 being damaged. Therefore, in the RF tag-attached cardboard 1, the RF tag 12 is sandwiched so that the IC chip 121 fits in the space between the tops of the corrugated flutes 11. By sandwiching the RF tag 12 between the liner 10 and the flutes 11 in this way, there is a space above the IC chip 121 mounted on the RF tag 12, reducing the risk of the IC chip 121 mounted on the RF tag 12 being damaged.

図４は，ＲＦタグ付き段ボール１の製造方法を説明する図で，図４では，ＲＦタグ付き段ボール１の製造ライン２の概略を図示している。 Figure 4 is a diagram explaining the manufacturing method of RF tagged cardboard 1, and shows an outline of the manufacturing line 2 for RF tagged cardboard 1.

図４で図示した製造ライン２において，まず，２本のローラ２０によりフルート１１の原紙１１０を波形に加工する工程Ｐ１と，第１のグルーマシン２１によりフルート１１の片面の段頂に接着剤（糊）を塗布する工程Ｐ２と，第１の圧着機構２２によりフルート１１と裏ライナ１０ｂを貼り合わせる工程Ｐ３が実行されて，片面にライナ１０を貼り合わせた片面段ボールが製造される。次に，片面にライナ１０を貼り合わせたフルート１１においてライナ１０を貼り合わせていない面の段頂に，第２のグルーマシン２３により接着剤を塗布する工程Ｐ４と，第２の圧着機構２５によりフルート１１と表ライナ１０ａを貼り合わせる工程Ｐ６が実行されて，フルート１１の両面にライナ１０を貼り合わせた両面段ボールが製造される。 In the manufacturing line 2 shown in FIG. 4, first, process P1 is performed in which the base paper 110 of the flute 11 is corrugated by two rollers 20, process P2 is performed in which an adhesive (glue) is applied to the crests on one side of the flute 11 by a first glue machine 21, and process P3 is performed in which the flute 11 and the back liner 10b are bonded together by a first pressure bonding mechanism 22, thereby producing a single-sided corrugated board with the liner 10 bonded to one side. Next, process P4 is performed in which an adhesive is applied to the crests on the side of the flute 11 with the liner 10 bonded to one side by a second glue machine 23, and process P6 is performed in which the flute 11 and the front liner 10a are bonded together by a second pressure bonding mechanism 25, thereby producing a double-sided corrugated board with the liner 10 bonded to both sides of the flute 11.

図４で示したＲＦタグ付き段ボール１の製造ライン２では，段ボールの製造段階でＲＦタグ１２を段ボールにソースタギングできるように，第２のグルーマシン２３と第２の圧着機構２５の間に，第２のグルーマシンにより接着剤を塗布したフルート１１の面にＲＦタグ１２を貼り付ける貼り付け装置２４を設けている。第２のグルーマシン２３と第２の圧着機構２５の間に貼り付け装置２４を設けることで，図４で図示した製造ライン２では，工程Ｐ４と工程Ｐ６の間に，ＩＣチップ１２１を実装した面と第２のグルーマシン２３により接着剤を塗布したフルート１１の面を対向させた状態で，このフルート１１の面にＲＦタグ１２を貼り付ける工程５を含ませることができるようになっている。なお，ＩＣチップ１２１の破損を防止するために，工程５において，フルート１１の段頂と段頂の間にある空間にＲＦタグ１２のＩＣチップ１２１を収める状態で，接着剤を塗布したフルート１１の面にＲＦタグ１を貼り付けることが望ましい。 In the manufacturing line 2 of the RF tagged cardboard 1 shown in FIG. 4, a pasting device 24 is provided between the second glue machine 23 and the second crimping mechanism 25 to paste the RF tag 12 on the surface of the flute 11 to which adhesive has been applied by the second glue machine, so that the RF tag 12 can be source tagged on the cardboard during the manufacturing stage of the cardboard. By providing the pasting device 24 between the second glue machine 23 and the second crimping mechanism 25, the manufacturing line 2 shown in FIG. 4 can include, between process P4 and process P6, process 5 in which the RF tag 12 is pasted on the surface of the flute 11 in a state in which the surface on which the IC chip 121 is mounted faces the surface of the flute 11 to which adhesive has been applied by the second glue machine 23. In order to prevent damage to the IC chip 121, it is preferable to paste the RF tag 1 on the surface of the flute 11 to which adhesive has been applied in a state in which the IC chip 121 of the RF tag 12 is placed in the space between the step tops of the flute 11 in process 5.

図５は，ＲＦタグ付き段ボール１を利用した段ボール箱３を説明する図である。これまで説明したＲＦタグ付き段ボール１は，製品の搬送に用いる段ボール箱に応用できる。図５（ａ）では，段ボール箱３を展開した展開シート３ａを示している。展開シート３ａにおいて，ＲＦタグ１２は，展開シート３ａを段ボール箱３に成形した際，段ボール箱３の側面になる一つのパネルの一部に挟み込まれている。なお，図５（ａ）で図示した展開シート３ａは，ＲＦタグ付き段ボール１を加工することで製造できる。 Figure 5 is a diagram explaining a cardboard box 3 that uses cardboard 1 with an RF tag attached. The cardboard 1 with an RF tag attached that has been explained so far can be applied to cardboard boxes used for transporting products. Figure 5(a) shows an expanded sheet 3a in which a cardboard box 3 is expanded. In the expanded sheet 3a, the RF tag 12 is sandwiched between part of one panel that will become the side of the cardboard box 3 when the expanded sheet 3a is formed into the cardboard box 3. The expanded sheet 3a shown in Figure 5(a) can be manufactured by processing cardboard 1 with an RF tag attached.

図５（ｂ）は，展開シート３ａを成形した段ボール箱３を示している。図５（ｂ）で図示した段ボール箱３において，ライナ１０とフルート１１の間にＲＦタグ１２を挟み込んだ箇所は一つの側面にあるため，リーダライタの電波を側面方向から照射することで，ライナ１０とフルート１１の間に挟まれたＲＦタグ１２と無線交信できる。 Figure 5(b) shows a cardboard box 3 in which an unfoldable sheet 3a has been formed. In the cardboard box 3 shown in Figure 5(b), the RF tag 12 is sandwiched between the liner 10 and the flutes 11 at one side, so that radio waves from a reader/writer can be irradiated from the side to wirelessly communicate with the RF tag 12 sandwiched between the liner 10 and the flutes 11.

１ ＲＦタグ付き段ボール
１０ ライナ
１０ａ 表ライナ
１０ｂ 裏ライナ
１１ フルート
１２ ＲＦタグ
１２０ アンテナ
１２１ ＩＣチップ
 REFERENCE SIGNS LIST 1 RF tag attached cardboard 10 Liner 10a Front liner 10b Back liner 11 Flute 12 RF tag 120 Antenna 121 IC chip

Claims (4)

波形に加工したフルートの少なくとも片面にライナを貼り合わせた構造の段ボールであって，アンテナとこれに接続するＩＣチップを紙素材の基材シートに実装したＲＦタグを，前記ＩＣチップを実装した面と前記フルートの片面を対向させた状態で前記ライナと前記フルートの間に挟み込み，紙と紙を貼り合わせる接着剤により前記ライナと前記フルートを貼り合わせていることを特徴とするＲＦタグ付き段ボール。 This is a cardboard with an RF tag , which has a structure in which a liner is attached to at least one side of corrugated flutes, and an RF tag having an antenna and an IC chip connected to it mounted on a base sheet made of paper is sandwiched between the liner and the flute with the surface mounting the IC chip facing one side of the flute, and the liner and the flute are attached together with an adhesive that bonds paper to paper . 前記フルートの段頂と段頂の間にある空間に前記ＲＦタグの前記ＩＣチップを収めていることを特徴とする，請求項１に記載したＲＦタグ付き段ボール。 The cardboard with an RF tag according to claim 1, characterized in that the IC chip of the RF tag is housed in the space between the tops of the flutes. 波形に加工したフルートの片面に紙と紙を貼り合わせる接着剤を塗布する工程ａと，アンテナとこれに接続するＩＣチップを紙素材の基材シートに実装したＲＦタグを，前記ＩＣチップを実装した面と前記接着剤を塗布した前記フルートの面を対向させた状態で，前記接着剤を塗布した前記フルートの面に貼り付ける工程ｂと，接着剤を塗布した前記フルートの面にライナを貼り付ける工程ｃを含むことを特徴とするＲＦタグ付き段ボールの製造方法。 A method for manufacturing cardboard with RF tags, comprising the steps of: a) applying an adhesive to one side of a corrugated flute to bond paper to paper ; b) attaching an RF tag, which has an antenna and an IC chip connected to it mounted on a base sheet made of paper, to the adhesive-coated side of the flute, with the side having the IC chip mounted facing the adhesive-coated side of the flute; and c) attaching a liner to the adhesive-coated side of the flute. 前記工程ｂにおいて，前記フルートの段頂と段頂の間にある空間に前記ＲＦタグの前記ＩＣチップを収める状態で，前記接着剤を塗布した前記フルートの面に前記ＲＦタグを貼り付けることを特徴とする，請求項３に記載したＲＦタグ付き段ボールの製造方法。 4. A method for manufacturing cardboard with an RF tag as described in claim 3, characterized in that in step b, the RF tag is attached to the surface of the flute on which the adhesive has been applied, with the IC chip of the RF tag being placed in the space between the step tops of the flutes.
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Publication number Priority date Publication date Assignee Title
JP2005293537A (en) 2004-04-05 2005-10-20 Fuji Xynetics Kk Cardboard with ic tag
JP2007007888A (en) 2005-06-28 2007-01-18 Oji Paper Co Ltd Non-contact ic chip mount body mounting corrugated cardboard and its manufacturing method
WO2008096574A1 (en) 2007-02-06 2008-08-14 Murata Manufacturing Co., Ltd. Packing material provided with electromagnetically coupled module
JP2008221636A (en) 2007-03-13 2008-09-25 Oji Paper Co Ltd Integrated circuit mounted corrugated fiberboard

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005293537A (en) 2004-04-05 2005-10-20 Fuji Xynetics Kk Cardboard with ic tag
JP2007007888A (en) 2005-06-28 2007-01-18 Oji Paper Co Ltd Non-contact ic chip mount body mounting corrugated cardboard and its manufacturing method
WO2008096574A1 (en) 2007-02-06 2008-08-14 Murata Manufacturing Co., Ltd. Packing material provided with electromagnetically coupled module
JP2008221636A (en) 2007-03-13 2008-09-25 Oji Paper Co Ltd Integrated circuit mounted corrugated fiberboard

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