JP6664052B2 - Method of manufacturing RFID recording medium sheet - Google Patents

Description

The present invention relates to a method for manufacturing an RFID recording medium sheet and a card.

  In recent years, RFID (Radio Frequency Identification) technology for transmitting and receiving information from an IC chip capable of storing information by non-contact communication has been applied to various fields. As an example, a tag attached to a product, a label attached to the product, a wristband for personal identification used in a hospital or the like, an ID card used for an identification card in a company or a school, a member's card used in a store or the like, It has been proposed to incorporate an RFID-specific IC chip and an antenna pattern inside cards such as a point card (see Patent Document 1).

  In the tag described in Patent Document 1, a mount (separator) is temporarily attached to the back surface of a printing paper (label piece) in an unfolded state via an adhesive, and an RFID inlet is arranged between the label piece and the separator. It is a thing. By folding the printing paper in the unfolded state with the back side inside and the folding line, a tag having a built-in RFID inlet can be obtained.

  In the case of manufacturing the tag described in Patent Document 1, a commercially available RFID inlet and a commercially available continuous label body in which a separator is temporarily attached to the back surface of a label piece can be used. If the tag is to be handled in the unfolded state, it is necessary to peel off the separator from the label continuum, place the RFID inlet, and temporarily attach the separator again to the adhesive surface of the label piece.

JP-A-2004-265126

In the distribution process, the tag described in Patent Literature 1 is assumed to be handled in a deployed state with a separator, or to be handled as a completed tag by separating and folding the separator.

Since the RFID inlet has a bulge corresponding to the thickness of the IC chip, stress is concentrated on the bulge of the IC chip when a plurality of sheets are overlapped in either the unfolded state or the completed body, and the IC chip is damaged or the IC chip is damaged. In some cases, the joint between the antenna and the antenna pattern was damaged.

  In particular, since cards use label pieces having higher breaking strength and folding strength than tags, the stress applied to the IC chip when a plurality of cards are overlapped is higher than that of tags. Therefore, in the case of cards, the IC chip is likely to be damaged. For this reason, urgent measures were required.

Further, when manufacturing the tag described in Patent Document 1, after the RFID inlet is arranged, the tag is originally temporarily attached to the label piece in order to reduce the cost of the separator for temporarily attaching the label piece again. It is being considered to use the separator again.

  However, if the separator has been subjected to processing such as an opening or a slit, the adhesive surface of the label piece is exposed from the opening or the slit. For this reason, the separator could not be reused in some cases.

  Accordingly, an object of the present invention is to prevent the IC chip from being damaged due to superposition and to realize an efficient manufacturing process, regardless of whether the RFID recording medium sheet is in an expanded state or a completed state. And

According to an embodiment of the present invention, an IC chip and the IC are provided between a label piece and the separator in a continuous label body in which a label piece cut into a desired shape is temporarily attached to a long strip-shaped separator. A method of manufacturing an RFID recording medium sheet in which an RFID inlet having an antenna pattern connected to a chip is arranged, wherein the label piece and the separator are provided at specific positions of the plurality of label pieces in the label continuum. And a step of peeling off the separator from the label piece, and when re-arranging the label piece on the peeled-off separator, the IC chip passes through the label piece. placing said RFID inlet to be positioned in the hole, the separator the RFID inlet is disposed, said As the through-hole of the separator is positioned between the plurality of label pieces, the method of manufacturing the RFID recording medium sheet and a step of rearranging the label strip is provided.

According to another aspect of the present invention, there is provided a card including an RFID inlet having an IC chip and an antenna pattern connected to the IC chip, and a label piece on which the RFID inlet is arranged, wherein the label piece is And a pressure-sensitive adhesive surface on which a pressure-sensitive adhesive is disposed, and a through-hole penetrating the label piece is formed at a specific position of the label piece, and the RFID inlet has the IC chip corresponding to the through-hole. The card is provided on the label piece such that the label piece is folded into a predetermined shape with the adhesive surface inside.

  According to the above aspect, in either the developed state or the completed state, damage of the IC chips due to superposition can be prevented, and the efficiency of the manufacturing process can be realized.

FIG. 1 is a plan view of an RFID recording medium sheet 1 manufactured by a manufacturing method according to an embodiment of the present invention, as viewed from a side on which label pieces are arranged, with a main part partially cut away. FIG. 2 is a plan view of the RFID recording medium sheet 1 as viewed from the separator side. FIG. 3 is a plan view for explaining a card developing body D1 in which the RFID inlet 5 is arranged on the label piece 2. FIG. FIG. 4 is a perspective view of a card obtained by folding the card development body D1 shown in FIG. FIG. 5 is a schematic diagram illustrating a process of folding the label piece 2 peeled from the RFID recording medium sheet 1 into a card shape. FIG. 5A is a cross-sectional view of a main part of the card developing body D1 in which the RFID inlet 5 is arranged on the label piece 2. FIG. 5B is a cross-sectional view showing a state where the section A1 and the section A2 are bent at the folding line L1. FIG. 5C is a cross-sectional view showing a state in which the section A3 is folded toward the front side of the section A1 with the back surface of the section A1 and the back surface of the section A2 stuck together. FIG. 5D is a cross-sectional view of a card obtained by folding card expansion body D1. FIG. 6 is a schematic diagram of a manufacturing apparatus 100 that executes the method of manufacturing the RFID recording medium sheet 1 according to the present embodiment. FIG. 7 is a plan view of the label continuum 4 viewed from the label piece 2 side. FIG. 8 is a plan view of the label continuum 4 viewed from the separator continuum 3 side. FIG. 9 is a plan view showing a state where the RFID inlet 5 is arranged on the continuous separator body 3 separated from the label piece 2. FIG. 10 is a plan view of a state in which the RFID inlet 5 is arranged in the separator continuum 3 as viewed from the back side of the separator continuum 3. FIG. 11 is a plan view of the RFID recording medium sheet 1 in which the RFID inlet 5 is arranged between the label piece 2 and the separator continuum 3 as viewed from the label piece 2 side. FIG. 12 is a plan view illustrating the card developing body D2. FIG. 13 is a plan view illustrating the card developing body D3. FIG. 14 is a plan view illustrating the card developing body D4. FIG. 15 is a plan view illustrating the card developing body D5.

[RFID recording medium sheet]
Prior to description of a method for manufacturing an RFID recording medium sheet according to an embodiment of the present invention, an RFID recording medium sheet 1 manufactured using the manufacturing method will be described. In the present embodiment, the label continuum refers to a label in which a plurality of label pieces are arranged on a long strip-shaped separator. The long strip-shaped separator is hereinafter referred to as a separator continuum. The RFID recording medium sheet refers to a sheet in which an RFID inlet is arranged between each of a plurality of label pieces and a continuous body of separators. In addition, the label piece on which the RFID inlet is arranged becomes a card shape when folded along a predetermined folding line, and thus may be referred to as a card development body.

  In the present embodiment, a card produced by folding the card expansion body can be used as an ID card used for an identification card in a company or a school, a members card used in a store or the like, a point card, or the like. Since the card has a built-in RFID inlet, information about the user and information about services that the user can receive can be stored.

  FIG. 1 is a plan view of an RFID recording medium sheet 1 manufactured by the manufacturing method according to the present embodiment, as viewed from a side where a label piece is arranged, and showing a main part partially cut away. FIG. 2 is a plan view of the RFID recording medium sheet 1 as viewed from the separator continuum side.

  As shown in FIG. 1, the RFID recording medium sheet 1 includes a plurality of label pieces 2 and a continuous body of separators 3. The plurality of label pieces 2 form a label continuous body 4 by being temporarily attached to the separator continuous body 3 with an adhesive. The RFID recording medium sheet 1 has an RFID inlet 5 disposed between the label piece 2 and the separator continuum 3 of the label continuum 4.

  In the RFID recording medium sheet 1, a label opening 21 is formed at a specific position of the label piece 2. The IC chip 53 of the RFID inlet 5 attached to the back surface of the label piece 2 is exposed from the label opening 21. Further, a separator opening 31 is formed at a specific position of the separator continuous body 3. The label opening 21 and the separator opening 31 are originally one through hole. Details of the label opening 21 formed in the label piece 2 and the separator opening 31 formed in the separator continuum 3 will be described later.

  In the present embodiment, as a material applicable to the label piece 2, paper such as high-quality paper, coated paper, polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, a resin film alone such as polyethylene naphthalate, or these resin films may be used. A multilayer film formed by laminating a plurality of layers is exemplified.

  Further, the thickness of the label piece 2 may be a thickness such that the total thickness in the folded and card-shaped state conforms to 0.76 mm specified in the card standard. The thickness of the label piece 2 is preferably 120 μm or more and 250 μm or less.

  An adhesive is applied to the label piece 2. The pressure-sensitive adhesive applicable in the present embodiment includes an acrylic pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, and the like.

  Further, the adhesive strength of the adhesive is preferably classified as so-called strong viscosity, and is preferably 400 gf / 25 mm or more in a 180 ° peel test (JIS Z 0237).

  The separator continuum 3 is subjected to a non-adhesion process using a release agent or the like.

  The RFID inlet 5 includes an inlet base material 51, an antenna pattern 52 provided on the first surface of the inlet base material 51, and an RFID (Radio Frequency Identification) specification IC chip 53 connected to the antenna pattern.

  In the present embodiment, as the material applicable to the inlet base material 51, papers such as high-quality paper, coated paper, polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, a resin film alone such as polyethylene naphthalate, or these resin films Are laminated.

  It is preferable that the thickness of the inlet base material 51 is 25 μm or more and 300 μm or less. When papers are used as the inlet base material 51, the thickness can be 50 μm or more and 260 μm or less, and preferably 80 μm, in the above range. When a resin film is used as the inlet substrate, the thickness can be set to 25 μm or more and 200 μm or less within the above range. From among these, it can be appropriately selected according to the application.

  The antenna pattern 52 has a UHF band (300 MHz to 3 GHz, particularly 860 MHz to 960 MHz), a microwave (1 to 30 GHz, particularly around 2.45 GHz), and an HF band (3 MHz to 30 MHz, especially 13.2 GHz) according to the specification of the RFID. (In the vicinity of 56 MHz).

  As shown in FIG. 2, alignment marks for determining the position of the label piece 2 with respect to the separator continuum 3 are provided on the separator continuum 3 of the RFID recording medium sheet 1. The separator continuum 3 has an inlet mark 32 and a rearrangement mark 33 as alignment marks. The separator continuum 3 has a reference mark 34 indicating a position at which the label piece 2 is die-cut.

In addition, as shown in FIG. 2, the inlet mark 32 is for determining an area where the RFID inlet 5 is arranged. The inlet mark 32 is provided such that the position of the IC chip 53 corresponds to the position corresponding to the label opening 21 formed in the label piece 2 .

  Further, the rearrangement mark 33 is used to determine a position where the label piece 2 is temporarily attached again so that the separator opening 31 formed in the separator continuous body 3 is located in the gap between each label piece 2. belongs to. Details of the step of rearranging the RFID inlet 5 and the label piece 2 based on the inlet mark 32 and the rearrangement mark 33 will be described later.

  The inlet mark 32, the rearrangement mark 33, and the reference mark 34 are provided on the surface of the separator continuum 3 opposite to the surface on which the label pieces 2 are arranged. The body 3 can also be seen through when viewed from the label piece 2 side.

  FIG. 3 is a plan view for explaining a card developing body D1 in which the RFID inlet 5 is arranged on the label piece 2. FIG. FIG. 4 is a perspective view of a card C obtained by folding the card development body D1 shown in FIG. FIG. 5 is a schematic diagram for explaining a process of folding the label piece 2 peeled from the RFID recording medium sheet 1 into a card shape.

  Each of the plurality of label pieces 2 has two folding lines L1 and L2 and a label opening 21 formed therein. Perforations are formed at the positions of the two folding lines L1 and L2. The label piece 2 is divided into three sections A1, A2, A3 by folding lines L1, L2.

  In the label piece 2, an adhesive is coated in advance on a surface (referred to as a back surface) on a side on which the RFID inlet 5 is arranged. For this reason, when the label piece 2 is folded as shown in FIG. 5, the sections A1 to A3 are adhered by the adhesive to have a card shape.

  FIG. 5A is a cross-sectional view of a main part of the card developing body in which the RFID inlet 5 is arranged on the card developing body. FIG. 5B is a cross-sectional view showing a state where the section A1 and the section A2 are bent at the folding line L1. FIG. 5C is a cross-sectional view showing a state in which the section A3 is folded toward the front side of the section A1 with the back surface of the section A1 and the back surface of the section A2 stuck together. FIG. 5D is a cross-sectional view of the card C obtained by folding the card development body.

  As shown in FIG. 5B, the label piece 2 is folded so that the back surface of the section A1 and the back surface of the section A2 match at the folding line L1. Subsequently, as shown in FIG. 5C, the label piece 2 is folded so that the back surface of the section A3 and the front surface of the section A1 match. Thereby, the label piece 2 becomes a card shape as shown in FIG. 5D. After being folded in this way, the IC chip 53 fits into the label opening 21, so that the IC chip 53 does not swell.

[Method of Manufacturing RFID Recording Medium Sheet] Hereinafter, a method of manufacturing the RFID recording medium sheet 1 according to the embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a schematic diagram of a manufacturing apparatus 100 that executes the method of manufacturing the RFID recording medium sheet 1 according to the present embodiment.

  The method for manufacturing the RFID recording medium sheet 1 according to the present embodiment includes a step P1 of separating the continuous separator 3 from the label piece 2 and disposing the RFID inlet 5 on the separated separator 3 based on the inlet mark 32. A step P2 of rearranging the label pieces 2 based on the rearrangement marks 33 such that the separator openings 31 formed in the continuous separator body 3 are located between the plurality of label pieces 2; And

  As shown in FIG. 6, the manufacturing apparatus 100 includes a peeling mechanism 101, an inlet arrangement mechanism 102, and a rearrangement mechanism 103.

  In the manufacturing apparatus 100, the step P <b> 1 in the method for manufacturing the RFID recording medium sheet 1 is performed by the peeling mechanism 101. The peeling mechanism 101 peels off the label roll 110 around which the label continuous body 4 is wound, the feed roller 111 which conveys the label continuous body 4 sent out from the label roll 110, and the separator continuous body 3 from the label continuous body 4. A turning plate 112 is provided.

  FIG. 7 is a plan view of the label continuum 4 viewed from the label piece 2 side. FIG. 8 is a plan view of the label continuum 4 viewed from the separator continuum 3 side.

  As shown in FIG. 7, the label continuous body 4 has a through hole 41 penetrating the label piece 2 and the separator continuous body 3. The through hole 41 corresponds to the label opening 21 in the label piece 2 and corresponds to the separator opening 31 in the separator continuum 3.

  As shown in FIG. 8, an inlet mark 32, a rearrangement mark 33, and a reference mark 34 are provided at specific positions of the separator continuum 3 of the label continuum 4. In FIG. 8, the label pieces 2 arranged on the surface of the continuous separator 3 opposite to the surface on which the marks are provided are indicated by broken lines. As shown in FIG. 8, before the separator continuum 3 is peeled off, the label pieces 2 are arranged such that the ends of the label pieces 2 match the reference marks 34.

  The separator continuous body 3 separated from the label piece 2 by the turning plate 112 arranges the RFID inlet 5 along the outline arrow shown in FIG. 6 by the transport mechanism including the transport rollers 121, 122, 123 and 124. It is conveyed to the inlet arrangement mechanism 102. The label piece 2 is transported in the transport direction F shown in FIG.

  The following process P2 is executed by the inlet arrangement mechanism 102. The inlet arrangement mechanism 102 includes an inlet roll 130, a turning plate 131, a take-up roll 132, a nip roll 133, and a support roller 134.

  The inlet roll 130 is wound around an inlet sheet SI in which a plurality of RFID inlets 5 each having a surface coated with an adhesive are arranged in a continuum M of a mount. The inlet roll 130 sends out the inlet sheet SI.

  The turning plate 131 separates the mount backing body M from the inlet sheet SI.

  The take-up roll 132 collects the peeled backing sheet M.

  The nip roll 133 and the support roller 134 pinch and hold the separator continuum 3 sent from the peeling mechanism 101 and the RFID inlet 5 arranged on the separator continuum 3.

  The inlet arrangement mechanism 102 separates the RFID inlet 5 from the inlet sheet SI, and arranges the RFID inlet 5 on the continuous separator body 3 sent from the separation mechanism 101. At this time, the inlet arrangement mechanism 102 arranges the RFID inlet 5 based on the inlet mark 32 provided on the continuous separator 3. The separator continuum 3 on which the RFID inlet 5 is arranged is sent to the rearrangement mechanism 103.

  Since the above-described inlet mark 32 can be seen through from the label piece 2 side, for example, by irradiating light from the separator continuum 3 side and detecting the inlet mark 32 with an optical sensor on the label piece 2 side, RFID The alignment of the inlet 5 can be performed.

  FIG. 9 is a plan view showing a state where the RFID inlet 5 is arranged on the continuous separator body 3 separated from the label piece 2. FIG. 10 is a plan view of a state in which the RFID inlet 5 is arranged in the separator continuum 3 as viewed from the back side of the separator continuum 3.

  In FIG. 10, the dashed lines indicate the RFID inlets 5 arranged on the opposite surface of the continuous separator 3 on which the marks are provided. As shown in FIG. 10, the RFID inlet 5 is arranged so as to match the inlet mark 32.

  The following process P3 is executed by the rearrangement mechanism 103. The rearrangement mechanism 103 includes a nip roll 151, a support roller 152, and a take-up roll 153.

  The rearrangement mechanism 103 rearranges the label piece 2 on the separator continuum 3 in which the RFID inlet 5 sent from the inlet arrangement mechanism 102 is arranged. At this time, the rearrangement mechanism 103 arranges the label pieces 2 based on the rearrangement marks 33.

  The nip roll 151 and the support roller 152 sandwich and hold the label piece 2 and the continuous separator 3 on which the RFID inlet 5 sent from the inlet arrangement mechanism 102 is arranged.

  The peeling mechanism 101 and the rearrangement mechanism 103 are arranged adjacently on the production line. Therefore, immediately after the separator continuous body 3 is separated from the label piece 2 by the peeling mechanism 101, the label piece 2 is rearranged by the rearrangement mechanism 103 to the separator continuous body 3 on which the RFID inlet 5 is arranged.

  Similarly, when the label piece 2 is rearranged, light is irradiated from the separator continuum 3 side, and the label sensor 2 detects the rearrangement mark 33 on the label piece 2 side, thereby aligning the label piece 2. It can be carried out.

  FIG. 11 is a plan view of the RFID recording medium sheet 1 in which the RFID inlet 5 is arranged between the label piece 2 and the separator continuum 3 as viewed from the label piece 2 side.

  FIG. 2 is a plan view of the RFID recording medium sheet 1 as viewed from the side of the continuous separator body 3. In FIG. 2, the label pieces 2 and the RFID inlets 5 arranged on the opposite surfaces of the continuous separator 3 on which the marks are provided are indicated by broken lines. As shown in FIG. 2, the label pieces 2 to be rearranged are arranged such that the ends of the label pieces 2 match the rearrangement marks 33.

  The RFID recording medium sheet 1 formed by rearranging the label pieces 2 is once taken up by the take-up roll 153. Thereafter, the RFID recording medium sheets 1 are shipped separately in rolls having a small diameter, or shipped in a state in which a predetermined number of the RFID recording medium sheets 1 are folded together at folds provided between the label pieces.

  According to the method for manufacturing the RFID recording medium sheet 1 according to the present embodiment described above, the IC chip 53 of the RFID inlet 5 fits in the label opening 21 formed in the label piece 2, so that the label piece 2 is continuously connected to the separator. Regardless of whether the IC chip 53 is temporarily attached to the body 3 or is folded and formed into a card shape, the swelling due to the thickness of the IC chip 53 does not appear on the card surface. The breakage of the chip 53 can be prevented.

  In addition, since the swelling due to the thickness of the IC chip 53 does not appear on the card surface, the unevenness of the printing surface can be suppressed to a range allowable for the printing performance of the printer. Can also prevent printing defects.

  In the punching process, since an opening is formed in the separator continuous body, when used to rearrange the punched separator continuous body, the adhesive surface of the label piece is exposed from the opening formed in the separator. Things can happen. For this reason, there has been a concern that the adhesive surface exposed from the opening may reduce the adhesive force due to contact with a worker or a packaging material, or the adhesive force may decrease due to the attachment of dust or the like. On the other hand, according to the method of manufacturing the RFID recording medium sheet 1 according to the embodiment of the present invention, the label piece 2 can be rearranged at a position where the adhesive surface of the label piece 2 does not interfere with the separator opening 31. Therefore, even the separator continuous body 3 subjected to the punching process can be reused.

  In the present embodiment, an inlet mark 32 and a rearrangement mark 33 are provided on the separator continuum 3 of the RFID recording medium sheet 1 as alignment marks for determining the position of the label piece 2 with respect to the separator continuum 3. Have.

  In this embodiment, the arrangement of the RFID inlet 5 and the rearrangement of the label pieces 2 are performed based on these alignment marks, so that the separator opening 31 is located between the label pieces 2. The label pieces 2 can be arranged shifted from the initial state. Thereby, even if the separator continuous body 3 is used again, the adhesive surface of the label piece 2 is not exposed by the separator opening 31.

In the present embodiment, the inlet mark 32 is provided such that the position of the IC chip 53 corresponds to the position corresponding to the label opening 21 formed in the label piece 2 . Thus, when the RFID inlet 5 is arranged based on the inlet mark 32, the IC chip 53 can be securely accommodated in the label opening 21 .

  As described above, according to the method for manufacturing the RFID recording medium sheet 1 according to the embodiment of the present invention, the loss of the separator continuum 3 can be eliminated, and the efficiency of the manufacturing process can be improved.

[Modification]
In the present embodiment, the case where the label continuous body 4 in which the through-hole is formed in advance is used has been described. However, in the method of manufacturing the RFID recording medium sheet 1 according to the present embodiment, a label continuous body in which a through hole is not formed can be used. In this case, even before the step of separating the continuous separator 3 and the label piece 2 from each other, a hole forming step of forming a through hole at a position corresponding to the IC chip 53 of the RFID inlet to be arranged may be provided. Good.

  Thus, according to the present embodiment, it is possible to continuously work from the state of the label continuous body 4 to the manufacture of the RFID recording medium sheet 1 on the same line.

  When the manufacturing method of the RFID recording medium sheet 1 includes a hole forming step, it is preferable that the continuous separator 3 is provided with a through-hole mark as an alignment mark for determining the position of the through-hole. .

  The method for manufacturing the RFID recording medium sheet 1 according to the present embodiment further includes the above-described through-hole for the through-hole on the surface of the continuous separator 3 opposite to the surface on which the label piece 2 is temporarily attached before the hole forming step. A mark printing step of printing alignment marks such as marks, inlet marks 32, rearrangement marks 33, and reference marks 34 may be provided.

  Thus, according to the present embodiment, it is possible to continuously work from the state of the label continuous body 4 to the manufacture of the RFID recording medium sheet 1 on the same line.

  In the method of manufacturing the RFID recording medium sheet 1 according to the present embodiment, the area where the label opening 21 is formed may be any position where the IC chip 53 corresponds to the folded state.

  The shape of the card developing body D1 used in the description of the present embodiment is an example, and various modifications are possible. FIG. 12 is a plan view illustrating the card developing body D2. As long as the card can be folded into a card shape, the deployable body may be L-shaped.

  FIG. 13 is a plan view illustrating the card developing body D3. FIG. 14 is a plan view illustrating the card developing body D4. The card shape may not be a general section shape. That is, it may be hexagonal after being folded, or triangular after being folded.

  FIG. 15 is a plan view illustrating the card developing body D5. The card developing body D5 has a shape in which some sections are larger than other sections. That is, there is an area that is not covered by another section even when the sections are overlapped. For example, in such a card developing body D5, a section to be exposed can be used as a sticking allowance.

  As described above, the embodiments of the present invention have been described. However, the above embodiments are only some of the application examples of the present invention, and the technical scope of the present invention is limited to the specific configurations of the above embodiments. is not.

DESCRIPTION OF SYMBOLS 1 RFID recording medium sheet 2 Label piece 3 Separator continuous body 4 Label continuous body 5 RFID inlet 21 Label opening 31 Separator opening 32 Inlet mark 33 Rearrangement mark 34 Reference mark 41 Through hole 51 Inlet base material 52 Antenna pattern 53 IC chip 100 Manufacturing apparatus 101 Peeling mechanism 102 Inlet arrangement mechanism 103 Rearrangement mechanism 110 Label roll 111 Feed roller 112 Turning plate 121, 122, 123, 124 Conveying roller 130 Inlet roll 131 Turning plate 132 Take-up roll 133 Nip roll 134 Support roller 151 Nip roll 152 Support roller 153 Take-up roll A1, A2, A3 Section D1, D2, D3, D4, D5 Card development body L1, L2 Folding line SI inlet sheet

Claims (6)

A label continuum in which a label piece cut into a desired shape is temporarily attached to a long strip-shaped separator, between the label piece and the separator, an IC chip and an antenna pattern connected to the IC chip. A method for manufacturing an RFID recording medium sheet in which an RFID inlet is arranged,
At a specific position of each of the plurality of label pieces in the label continuum, a through hole that penetrates the label piece and the separator is formed,
Peeling the separator from the label piece,
A step of arranging the RFID inlet so that the IC chip is located in a through hole of the label piece when re-arranging the label piece on the peeled separator,
A step of rearranging the label pieces, so that the RFID inlet is disposed on the separator, so that a through hole of the separator is located between the plurality of label pieces.
A method for manufacturing an RFID recording medium sheet having: It is a manufacturing method of the RFID recording medium sheet of Claim 1, Comprising:
The separator is provided with an inlet mark for determining a position of the RFID inlet with respect to the separator,
The method of manufacturing an RFID recording medium sheet, wherein, in the step of disposing the RFID inlet, the RFID inlet is disposed on the separator based on the mark for the inlet. It is a manufacturing method of the RFID recording medium sheet according to claim 1 or 2,
The separator is provided with a rearrangement mark for determining a rearrangement position of the label piece with respect to the separator,
The method of manufacturing an RFID recording medium sheet, wherein in the rearranging step, the label pieces are rearranged based on the rearrangement marks on the separator on which the RFID inlet is disposed. It is a manufacturing method of the RFID recording medium sheet according to any one of claims 1 to 3,
Before the step of separating the separator and the label piece, a hole forming step of forming a through hole that penetrates the label piece and the separator at a specific position of the label continuous body , further comprising: an RFID recording medium sheet Manufacturing method. It is a manufacturing method of the RFID recording medium sheet according to any one of claims 1 to 4,
A method for manufacturing an RFID recording medium sheet, wherein each of the plurality of label pieces is defined by at least two folding lines, and is folded into a card shape by the folding lines. It is a manufacturing method of the RFID recording medium sheet of Claim 5, Comprising:
A method for manufacturing an RFID recording medium sheet, wherein the number of the folding lines is two.

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