JP2007241561A - Ic tag label and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag label capable of preventing an adhesive from sticking out and its manufacturing method. <P>SOLUTION: The IC tag label 1 comprises a surface layer part 10; a first adhesive layer 20 provided on one side of the surface layer part 10; an IC tag inlet 30 whose one side is stuck to the surface layer part 10 by the first adhesive layer 20; and a second adhesive layer 40 provided on the other side of the IC tag inlet 30, with at least a portion of its periphery located inward of the periphery of the first adhesive layer 20. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC tag label in which an adhesive layer is provided on an IC tag inlet, and a method for manufacturing the IC tag label.

  The IC tag is also referred to as RFID (Radio Frequency Identification), and can write data to the IC chip and read data held by the IC chip in a non-contact state by wireless communication. Such an IC tag is useful for managing products etc. in various fields such as transportation, factory process management, distribution, etc., and an IC tag holding data relating to the products etc. is affixed to the products etc. with double-sided tape etc. Is done.

Here, an IC tag is known that has been processed into a label shape in advance in order to facilitate sticking to a product or the like.
This IC tag label is provided with an adhesive layer on one surface portion side of the IC tag inlet, and on the other surface portion side, a surface layer portion that is formed of paper or the like and on which information on products such as characters and marks is printed. I have.
A plurality of such IC tag labels are provided side by side on a strip-like release paper, and are supplied to a label printer, whereby characters, marks, and the like are printed on the surface layer portion (see, for example, Patent Document 1).
JP 2005-255405 A

However, this conventional IC tag label is sandwiched and pressed by a conveyance roller provided in the printer, thereby bonding the surface layer portion and the IC tag inlet, and the IC tag inlet and the release paper. The adhesive provided therebetween may protrude from the edge of the IC tag label, and the protruding adhesive may adhere to the conveyance roller of the printer, causing a conveyance failure or a printing failure.
The subject of this invention is providing the manufacturing method of the IC tag label which can prevent the protrusion of an adhesive agent, and an IC tag label.

The present invention solves the above problems by the following means.
According to the first aspect of the present invention, a surface layer portion, a first adhesive layer provided on one surface portion of the surface layer portion, and one surface portion of the surface layer portion are attached to the surface layer portion by the first adhesive layer. IC tag inlet and a second adhesive layer provided on the other surface side of the IC tag inlet, at least a part of the edge of which is disposed inside the edge of the first adhesive layer Is an IC tag label.
According to a second aspect of the present invention, in the IC tag label according to the first aspect, the at least part of the edge of the second adhesive layer is 2 mm or more and 9 mm or less than the edge of the first adhesive layer. The IC tag label is arranged on the inner side.

According to a third aspect of the present invention, there is provided an IC tag inlet attaching step of attaching an IC tag inlet to a base portion formed on a sheet and having a base side adhesive layer on the surface thereof, the IC tag inlet and the base side adhesion Removing step of removing at least part of the agent layer from the base and forming the position of at least a part of the edge of the IC tag inlet on the base to be the same as the position of the edge of the base side adhesive layer And a surface layer portion formed in a sheet shape and having a surface side adhesive layer on the surface thereof, an edge of the surface layer side adhesive layer is the edge of the base side adhesive layer and the IC tag inlet A method for producing an IC tag label, comprising: a surface layer part attaching step for attaching to the base part in a state where the position on the base part is arranged on the outer side with respect to the part formed at the same position.
According to a fourth aspect of the present invention, in the method for producing an IC tag label according to the third aspect, the base side adhesive layer is covered with the IC tag inlet by attaching the IC tag inlet to the base. The manufacturing method of the IC tag label.

  As described above, the IC tag label and the IC tag label manufacturing method according to the present invention include the second adhesive layer, the edge of the base side adhesive layer as the first adhesive layer, and the edge of the surface layer side adhesive layer. Furthermore, since it arrange | positioned inside each so that the edge part of an adhesive bond layer may not overlap, the protrusion of an adhesive agent can be prevented.

  An object of the present invention is to provide an IC tag label and a method for manufacturing the IC tag label that can prevent the adhesive from protruding, and the edge of the second adhesive layer that bonds the IC tag inlet and the release paper is attached to the IC tag inlet. This problem has been solved by disposing the inner side of the edge of the first adhesive layer that bonds the surface layer portion and the surface layer portion.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of an IC tag label to which the present invention is applied and an IC tag label manufacturing method will be described with reference to the drawings.
1A and 1B are diagrams showing an embodiment of an IC tag label to which the present invention is applied. FIG. 1A is a plan view, and FIG. 1B is a sectional view taken along the line bb in FIG.
FIG. 2 is a plan view showing an IC tag inlet included in the IC tag label of FIG.
The IC tag label 1 of the embodiment includes a surface layer portion 10, a first adhesive layer 20, an IC tag inlet 30, a second adhesive layer 40, and a release paper 50. The sheets are stacked in this order with the paper 50 as the bottom layer.

The surface layer portion 10 is a white sheet material whose planar shape is formed in a substantially rectangular shape by polyethylene terephthalate (PET), and the long side dimension is, for example, 86 mm, and the short side dimension is, for example, 54 mm. ing. Further, the four corner portions of the surface layer portion 10 are curved.
The surface layer portion 10 is printed with information related to a pasting object (not shown) on which the IC tag label 1 is pasted on one surface portion. Hereinafter, the surface portion on which this information is printed will be referred to as a “printing surface portion” of the surface layer portion 10.
The information regarding the pasting object printed on the printing surface portion is not particularly limited, and examples thereof include characters, marks, barcodes, and the like. In FIG. 1, these printed information are not shown.

The first adhesive layer 20 adheres the surface layer portion 10 and the IC tag inlet 30 and is provided on the lower layer side of the surface layer portion 10.
The first adhesive layer 20 is formed by applying a pressure-sensitive adhesive over substantially the entire surface of the surface layer portion 10 opposite to the printed surface portion, and the planar shape has long sides and short sides. The dimension is substantially the same as the surface layer portion 10.

Here, in the present specification, the “adhesive layer” refers to a sheet material that serves as a base, such as a double-sided tape, and both side portions thereof, in addition to those formed of an adhesive as in the first adhesive layer 20. It also includes those formed by the adhesive applied to the surface.
In the present specification, “pressure-sensitive adhesive” means a kind of adhesive, and “adhesive” includes “pressure-sensitive adhesive”.

As shown in FIG. 2, the IC tag inlet 30 includes a base film 31, an antenna 32, and an IC chip 33, and performs radio communication with a communication device provided outside using a radio wave having a frequency of, for example, 13.56 MHz. It is a well-known thing.
The base film 31 is a sheet material whose planar shape is formed in a rectangular shape by PET, and has a long side dimension of, for example, 86 mm and a short side dimension of, for example, 48 mm.
The antenna 32 is a part that transmits and receives radio waves when the IC tag inlet 30 performs wireless communication with the communication device.
The antenna 32 is a planar antenna formed on one surface portion of the base film 31, and is a loop antenna formed in a spiral shape on the edge portion of the base film 31. Hereinafter, the surface portion on which the antenna is formed will be referred to as a “circuit surface portion” of the IC tag inlet 30.
The antenna 32 is formed by etching using aluminum, and includes an IC chip mount portion 34 formed by cutting a part on the innermost peripheral side.

The IC chip 33 is a memory device that holds ID information that makes it possible to identify an individual of the IC tag inlet 30 and data such as EPC related to a pasting object to which the IC tag label 1 is attached.
The IC chip 33 includes a pair of electrodes (not shown). One electrode is formed on one end of the antenna 32 formed on the IC chip mount 34 (antenna cut portion), and the other electrode is the other of the antenna 32. Are connected to the respective end portions of the two in a conductive manner.

Here, the short sides of the surface layer portion 10 and the first adhesive layer 20 are, for example, 6 mm longer than the short side of the IC tag inlet 30, and the IC tag inlet 30 is formed by the first adhesive layer 20. It is affixed to the central part in the direction (width direction) parallel to the short side of 10.
As a result, the first adhesive layer 20 is hatched in, for example, a 3 mm wide band-like region (FIG. 1A) that does not adhere to the IC tag inlet 30 at both ends in the direction parallel to the short side. Region M) is provided.
Here, FIG. 1B exaggerates the thickness of each element in order to facilitate understanding of the configuration of the IC tag label 1, and in FIG. It is assumed that this region M is adhered to the release paper 50.

The second adhesive layer 40 adheres the IC tag inlet 30 and the release paper 50, and is provided on the lower layer side of the IC tag inlet 30. The second adhesive layer 40 is a double-sided tape composed of a base (not shown) and an adhesive applied to both sides of the base.
The planar shape of the second adhesive layer 40 is rectangular, and the long side and short side dimensions are, for example, 86 mm and 48 mm, respectively, similarly to the base 1 of the IC tag inlet 30. The entire surface portion of the tag inlet 30 opposite to the circuit surface portion is covered.

  Here, the dimensions in the direction parallel to the short sides of the first adhesive layer 20 and the second adhesive layer 40 (hereinafter referred to as “the width direction”) and the edge portions are described. Paying attention to the position, the width direction dimension of the first adhesive layer 20 is 6 mm longer than the width direction dimension of the second adhesive layer 40, and the second adhesive layer 40 is formed of the first adhesive layer. Since the second adhesive layer 40 is disposed at the center portion in the width direction of the layer 20, the both edges in the width direction of the second adhesive layer 40 are respectively inside the both edges in the width direction of the first adhesive layer 20. Is arranged.

  Here, “the edge portion of the second adhesive layer 40 is disposed inside the edge portion of the first adhesive layer 20” means that when these adhesive layers are viewed in a superimposed manner, The position of the edge portion of the adhesive layer 20 and the position of the edge portion of the second adhesive layer 40 are arranged in a state shifted in a direction orthogonal to the thickness direction, and the second adhesive layer 40 is disposed. It is assumed that the edge portion of the first layer overlaps with a portion on the inner side of the edge portion of the first adhesive layer 20.

The release paper 50 is a sheet material having a rectangular planar shape provided to protect the second adhesive layer 40 and a part (region M) of the first adhesive layer 20.
The dimensions of the long side and the short side of the release paper 50 are, for example, 102 mm and 70 mm, respectively.

Next, the manufacturing method of the IC tag label 1 will be described for each process.
3A and 3B are diagrams showing the manufacturing process of the IC tag label, where FIG. 3A is a plan view and FIG. 3B is a cross-sectional view taken along the line bb in FIG.
When manufacturing this IC tag label 1, the double-sided tape 60, the inlet roll 70, and the PET film 80 are prepared.
The double-sided tape 60 is a base portion that is prepared in a state of being formed into a strip shape and processed into a roll shape. The double-sided tape 60 is composed of a base-side adhesive layer 61 and a set of release papers 62 that protect both sides of the base-side adhesive layer 61 (one of the set of release papers 62). (The illustration is omitted).

In this double-sided tape 60, the width direction dimension of the release paper 62 is, for example, 70 mm, whereas the width direction dimension of the base side adhesive layer 61 is, for example, 20 mm narrower than the release paper 62, 50 mm. It has become.
Further, the base side adhesive layer 61 is provided in the center portion in the width direction of the release paper 62, and the release paper 62 is not provided with the base side adhesive layer 61 at both edges in the width direction. For example, a strip-shaped blank area having a width of 10 mm is provided.

The inlet roll 70 is an aggregate of IC tag inlets 30 in which a plurality of the antennas 32 and the IC chips 33 described above are arranged in the longitudinal direction on a base sheet formed in a band shape by PET.
In the inlet roll 70, the dimension of the base sheet in the width direction is, for example, 4 mm longer and 52 mm than the dimension of the short side of the base film 31 of the IC tag inlet 30.

  The PET film 80 is prepared in a state of being formed into a belt shape and processed into a roll shape with PET. This PET film is a strip-shaped seal having a width direction dimension of, for example, 54 mm, and having a surface layer side adhesive layer 81 provided on one surface portion in advance by applying an adhesive. The surface layer side adhesive layer 81 is protected by a release paper (not shown).

(Process I: Release paper removal process)
The double-sided tape 60 is supported by a plurality of conveyance rollers (not shown) in the middle in the longitudinal direction with the surface portion orthogonal to the vertical direction. In addition, the double-sided tape 60 is provided with winding shafts (not shown) at both ends thereof, and travels on the conveying roller by rotating these winding shafts.
In the double-sided tape 60, the release paper (not shown) on the upper side in the vertical direction is sequentially removed from the front side in the running direction, thereby exposing the base side adhesive layer 61 (the portion indicated by hatching in FIG. 3A). ).

(Process II: Inlet roll pasting process)
The inlet roll 70 is bonded to the base side adhesive layer 61 by a so-called roll-to-roll type bonding method. Specifically, the inlet roll 70 travels in a state where the longitudinal direction of the inlet roll 70 and the longitudinal direction of the double-sided tape 60 are parallel, and is pressed toward the double-sided tape 60 by a roller or the like. 61 is pasted together.
At this time, although the inlet roll 70 is affixed to the center part of the width direction of the double-sided tape 60, the width direction dimension of the inlet roll 70 is 2 mm wider than the base side adhesive bond layer 61 as mentioned above, for example. The inlet roll 70 is provided with a 1 mm wide band-like region that is not bonded to the double-sided tape 60 at both edges in the width direction.

(Step III: Removal step)
Next, both edge portions in the width direction of each of the inlet roll 70 and the base side adhesive layer 61 are removed, and the positions on the release paper 62 of both edges in the width direction of the inlet roll 70 and the base side adhesive layer 62 are removed. Form the same.
The manufacturing apparatus for the IC tag label 1 includes a first cutter device (not shown). The first cutter device includes a pair of tooth portions, and these tooth portions are arranged, for example, 48 mm apart in a direction orthogonal to the traveling direction of the double-sided tape 60. Further, the centers of these tooth portions substantially coincide with the centers of the double-sided tape 60.

Thereby, the base side adhesive layer 61 is, for example, the inner portion of 1 mm from both edges in the width direction, and the inlet roll 70 is, for example, both from the both edges in the width direction. A 2 mm inner portion is cut substantially parallel to the longitudinal direction of the double-sided tape 60.
In addition, the inlet roll 70 and the base-side adhesive layer 61 are also removed from the release paper 62 in regions outside the cut position.

Here, in this removal process, the first cutter device performs a so-called half cut in which only the base side adhesive layer 61 and the inlet roll 70 are cut and the release paper 62 of the double-sided tape 60 is not cut.
(Process IV: PET film pasting process)
The PET film 80 is bonded to the inlet roll 70 in a state where the release paper is removed and the longitudinal direction thereof is parallel to the longitudinal direction of the double-sided tape 60. This PET film 80 is also bonded to the inlet roll 70 by a roll-to-roll method.

(Process V: Label formation process)
The manufacturing apparatus for the IC tag label 1 includes a second cutter device (not shown) on the downstream side in the traveling direction of the double-sided tape 60 with respect to the first cutter device in the above-described (Step III).
This second cutter device cuts the PET film 80, the surface layer side adhesive layer 81, the inlet sheet 70, and the base side adhesive layer 61, respectively, so that the surface layer portion 10 of the IC tag label 1 and the first adhesive layer 20 are cut. The IC tag inlet 30 and the second adhesive layer 40 are formed.
The second cutter device includes substantially rectangular teeth whose long and short sides are 86 mm and 56 mm, for example, and whose corners are curved, and the antenna 32 of the inlet roll 70 and The PET film 80, the surface side adhesive layer 81, the inlet sheet 70, and the base side adhesive layer 61 are punched out so as to avoid the portion where the IC chip 33 is formed.
This second cutter also performs half-cutting so that the release paper 62 of the double-sided tape 60 is not cut.

After this, the PET film 80, the surface layer side adhesive layer 81, the inlet sheet 70, and the base side adhesive layer 61 are removed from the region outside the cut portion by the tooth portion of the second cutter device (margin portion). . As a result, a plurality of IC tag labels 1 are continuously formed along the longitudinal direction of the release paper 62.
The plurality of IC tag labels 1 are supplied to a printer (not shown) in which the release paper 62 is wound again in a roll shape and information on the object to be pasted is printed on the printing surface portion of the surface layer portion 10 (PET film 80).

Next, the effects of the IC tag label 1 of this embodiment and the manufacturing method of the IC tag label 1 will be described in comparison with a comparative example.
FIG. 4 is a view showing a comparative example of the IC tag label of the present invention, and is a cross-sectional view corresponding to FIG.
The IC tag label 100 of the comparative example includes an adhesive layer 140 provided between the IC tag inlet 130 and the release paper 150, and an adhesive layer 120 provided between the IC tag inlet 130 and the surface layer portion 110. The edge portions of the release paper 150 are formed in substantially the same position, and the adhesive layers 120 and 140 are overlapped (doubled) over the entire periphery of the edge portion of the IC tag label 100. Yes.
On the other hand, in the IC tag label 1 of the example, since the edge in the width direction of the second adhesive layer 40 is arranged inside the edge of the first adhesive layer 20, Compared with the IC tag label 100, even when printing is performed on the surface layer portion 10 by a printer, the adhesive is prevented from protruding from the edge portion even if it is sandwiched and pressed by a conveyance roller provided in the printer.

In addition, according to the IC tag label 1 and the manufacturing method of the IC tag label 1 of the embodiment, the following effects can be obtained.
(1) The IC tag label 1 of the embodiment is manufactured by bonding the inlet roll 70 formed wider than the base side adhesive layer 61 to the double-sided tape 60 while covering the entire surface of the base side adhesive layer 61. Therefore (inlet roll sticking step), the adhesive of the base side adhesive layer 61 does not adhere to the roller that presses the inlet roll 70 in order to attach the inlet roll 70 to the double-sided tape 60, thereby preventing poor conveyance and the like. .
(2) When manufacturing the IC tag label 1 of the present embodiment, the width direction dimensions of the base side adhesive layer 61 and the inlet roll 70 are made the same in advance, and the inlet roll 70 is set to the base so that these edges overlap. Although it can be considered that the side adhesive layer 61 is bonded to the side adhesive layer 61, the double-sided tape 60 meanders in the width direction when it travels, and such manufacture is difficult.
On the other hand, in the IC tag label of Example 1, the inlet roll 70 is formed in advance wider than the base side adhesive layer 61, and the position of the edge of the inlet roll 70 and the base side adhesive layer 61 are removed by the removing process. Since the edge portion is formed at the same position, the IC tag label 1 in a state where the base side adhesive layer 61 protrudes from the edge portion of the inlet roll 70 can be prevented from being manufactured.
(3) Since adhesives such as double-sided tapes have fluidity, they may protrude (exude) from the edge of double-sided tapes and the like even if the surface is not pressed over time after production.
In contrast, in the IC tag label 1 of the present embodiment, the edge of the inlet roll 70 (IC tag inlet 30) and the edge of the base-side adhesive layer 61 (second adhesive layer 40) overlap in the removal process. Therefore, these cut edges are fresh, and the sticking out of the adhesive is prevented.

(Modification)
The present invention is not limited to the embodiments described above, and various modifications and changes are possible, and these are also within the technical scope of the present invention.
(1) The configuration of the IC tag label of the present invention is not limited to that of the embodiment, and can be appropriately changed. For example, the edge of the second adhesive layer may be inside the edge of the first adhesive layer over the entire circumference.
(2) Although the surface layer part of the Example was formed of PET, the material of the surface layer part is not limited thereto, and may be, for example, glossy paper or water-resistant synthetic paper.

It is a figure which shows the Example of the IC tag label to which this invention is applied. It is a top view which shows the IC tag inlet contained in the IC tag label of FIG. It is a figure which shows the manufacturing method of the IC tag label of FIG. It is sectional drawing which shows the IC tag label of the comparative example of this invention.

Explanation of symbols

1 IC Tag Label 10 Surface Layer 20 First Adhesive Layer 30 IC Tag Inlet 40 Second Adhesive Layer 50 Release Paper

Claims (4)

The surface layer,
A first adhesive layer provided on one surface portion of the surface layer portion;
An IC tag inlet having one surface portion affixed to the surface layer portion by the first adhesive layer;
An IC tag label comprising: a second adhesive layer provided on the other surface portion side of the IC tag inlet, wherein at least a part of the edge portion is disposed inside the edge portion of the first adhesive layer. . The IC tag label according to claim 1,
The IC tag label, wherein the at least part of the edge of the second adhesive layer is disposed 2 mm or more and 9 mm or less of the edge of the first adhesive layer. An IC tag inlet pasting step for pasting an IC tag inlet to a base formed with a base side adhesive layer on the surface thereof, which is formed in a sheet shape;
At least a part of the IC tag inlet and the base side adhesive layer is removed from the base, and the position of at least a part of the edge of the IC tag inlet on the base is the edge of the base side adhesive layer. Removing step to form the same as the position of
A surface layer portion formed in a sheet shape and provided with a surface layer side adhesive layer on the surface thereof, an edge portion of the surface layer side adhesive layer is on the IC tag inlet and the base portion of the edge portion of the base portion side adhesive layer And a surface layer part pasting step of pasting the base part in a state of being disposed outside the part formed at the same position. In the manufacturing method of the IC tag label according to claim 3,
The method of manufacturing an IC tag label, wherein the base side adhesive layer is covered with the IC tag inlet by attaching the IC tag inlet to the base.

Images