JP7466414B2 - Method for manufacturing a joint member and a joint member - Google Patents

Description

This disclosure relates to a manufacturing method for a joining member in which a metal or alloy is deposited on a base material using a laser or an arc, etc., and the joining member.

Patent Document 1 discloses the structure of an electrode for an electronic component having an underlying metal layer made of an alloy mainly composed of titanium (Ti), a barrier metal layer disposed on the underlying metal layer, and a soldering metal layer made of an alloy mainly composed of nickel (Ni) and disposed on the barrier metal layer. The barrier metal layer has a thermal expansion coefficient close to that of the underlying metal layer and the soldering metal layer, and is made of vanadium (V) that does not react with the underlying metal layer and the soldering metal layer during soldering. By providing the barrier metal layer, the formation of a brittle intermetallic compound phase between the underlying metal layer and the soldering metal layer is suppressed.

JP 2012-129480 A

However, the technology described in Patent Document 1 is intended for electrodes in electronic components such as semiconductor chips, and the barrier metal layer is formed by sputtering. The film thickness that can be formed by sputtering is on the order of microns. Therefore, when the technology described in Patent Document 1 is applied to a portion to which an external force is applied, there is a problem that the reliability of the bonding strength is low because the thickness of the barrier metal layer formed by sputtering is thin.

The present disclosure has been made in consideration of the above, and aims to provide a method for manufacturing a joining member that can improve the reliability of the joining strength compared to conventional methods when joining a member made of an alloy mainly composed of Ti to a member made of an alloy mainly composed of Ni, Fe, or Cu.

In order to solve the above-mentioned problems and achieve the object, the present disclosure provides a method for manufacturing a bonded member in which a first member made of Ti or an alloy containing Ti as a main component element and a second member made of an alloy containing Ni, Fe or Cu as a main component element are bonded via an intermediate material. The method for manufacturing the bonded member includes an intermediate material forming step and a bonded layer forming step. In the intermediate material forming step, an intermediate material is formed using one of the first member and the second member as a base material, and the intermediate material raw material member is a material containing a main component element constituting the intermediate material, and the intermediate material raw material member arranged on the base material is melted and solidified together with the base material on which the intermediate material raw material member is arranged. In the bonded layer forming step, the other of the first member and the second member is formed using a bonded layer, and the intermediate material is a material containing a main component element constituting the bonded layer, and the bonded layer raw material member arranged on the intermediate material is melted and solidified together with the base material on which the bonded layer raw material member is arranged. The intermediate material raw material member is a simple metal or alloy containing one element selected from the group consisting of V, Mo and W. When the substrate is a first member made of Ti or a Ti alloy, and the raw material member for the bonded layer is a Ni alloy containing 41 wt% or more and 54 wt% or less of Ni and 17 wt% or more and 20 wt% or less of Fe among all alloying elements, the bonded layer formation step is performed after the thickness of the intermediate material is reached such that the Ti component ratio at a position corresponding to the surface of the intermediate material formed in the intermediate material formation step when the bonded layer is formed on the intermediate material in the bonded layer formation step is more than 0 wt% and not more than 5.0 wt%, which is the range in which an alloy is formed with respect to the total amount of Ni, Fe and Ti and no intermetallic compound is formed.

According to the present disclosure, when joining a member made of an alloy mainly composed of Ti to a member made of an alloy mainly composed of Ni, Fe or Cu, it is possible to achieve an effect of improving the reliability of the joining strength compared to the conventional case.

FIG. 1 is a cross-sectional view showing a schematic example of a joining member according to a first embodiment; FIG. 1 is a cross-sectional view showing a schematic example of a structure of a bonding member in which a bonded layer is formed on a base material using an intermediate material according to the first embodiment; A side view showing an example of cladding Ternary phase diagram of Ni, Fe and Ti FIG. 1 shows a composition image by a scanning electron microscope and characteristic X-ray images of Ti and Ni on the surface of the buildup layer of the intermediate material when the Ti component ratio on the surface of the buildup layer of the intermediate material exceeds 5.0 wt %. FIG. 1 shows a composition image by a scanning electron microscope and characteristic X-ray images of Ti and Ni on the surface of the buildup layer of an intermediate material when the Ti component ratio on the surface of the buildup layer of the intermediate material is 5.0 wt % or less.

The manufacturing method of the joining member and the joining member according to the embodiment of the present disclosure are described in detail below with reference to the drawings. Note that the cross-sectional views of the parts including the joining member used in the following embodiments are schematic, and the relationship between the thickness and width of the layers and the thickness ratio of each layer may differ from the actual ones.

Embodiment 1.
1 is a cross-sectional view showing an example of a joining member according to the first embodiment. The joining member 1 according to the first embodiment includes a base material 10 made of Ti or an alloy mainly composed of Ti, a joining layer 30 made of an alloy mainly composed of Ni, Fe or Cu, and an intermediate material 20 for joining the base material 10 and the joining layer 30. The intermediate material 20 is made of a metal or alloy that is completely dissolved or two-phase separated with Ti, which is the main component element constituting the base material 10, and Ni, Fe or Cu, which is the main component element constituting the joining layer 30, or is similar thereto. In one example, the intermediate material 20 is a simple metal or alloy containing one element selected from the group consisting of V, molybdenum (Mo) and tungsten (W). However, the intermediate material 20 contains elements constituting the base material 10 and elements constituting the bonded layer 30, and in reality, the intermediate material 20 is an alloy of at least one element selected from the group of V, Mo, and W, the main component element constituting the base material 10, and the main component element constituting the bonded layer 30. At the interface between the intermediate material 20 and the bonded layer 30, the component ratio of Ti to the total amount of the main component element constituting the base material 10, i.e., Ti, and the main component element constituting the bonded layer 30, i.e., at least one element of Ni, Fe, or Cu, is within a range that forms an alloy but does not form an intermetallic compound. Ti or an alloy containing Ti as a main component element corresponds to the first member, and an alloy containing Ni, Fe, or Cu as a main component element corresponds to the second member.

In FIG. 1, for convenience, a boundary line is drawn between the bonded layer 30 and the intermediate material 20, and between the intermediate material 20 and the substrate 10. In reality, the region including the interface between the bonded layer 30 and the intermediate material 20 is formed by melting and solidifying, and the region including the interface between the intermediate material 20 and the substrate 10 is also formed by melting and solidifying. Therefore, the metal components melt and mix with each other, so the concentration changes continuously. In reality, the boundary line between the bonded layer 30 and the intermediate material 20, and between the intermediate material 20 and the substrate 10 is unclear. In addition, the composition of the portion that is to be the intermediate material 20 includes the above-mentioned materials, the elements that make up the substrate 10, and the elements that make up the bonded layer 30. In other words, the intermediate material 20 is an alloy that includes one element selected from the group consisting of V, Mo, and W.

Figure 2 is a cross-sectional view showing a schematic example of the structure of a joining member in which a joining layer is formed on a base material using an intermediate material according to embodiment 1. Looking at Figure 1 from another perspective, the joining member 1 includes a base material 10, an intermediate material 20, a joining layer 30, a boundary layer 40 that is a second boundary layer disposed between the base material 10 and the intermediate material 20, and a boundary layer 50 that is a first boundary layer disposed between the intermediate material 20 and the joining layer 30.

The boundary layer 40 is a layer formed at the interface between the substrate 10 and the intermediate material 20. The boundary layer 40 is composed of an alloy of Ti, which is the main component element constituting the substrate 10, and one element selected from the group consisting of V, Mo, and W, which are the main component elements constituting the intermediate material 20.

The boundary layer 50 is a layer formed at the interface between the intermediate material 20 and the bonded layer 30, and is made of a material containing Ti, which is the main component element constituting the base material 10, one element selected from the group of V, Mo, and W, which are the main component elements constituting the intermediate material 20, and Ni, Fe, or Cu, which are the main component elements constituting the bonded layer 30. In the boundary layer 50, the component ratio of Ti to the total amount of Ti and at least one element of Ni, Fe, and Cu is in a range that does not form an intermetallic compound but forms an alloy. The component ratio of Ti at this time indicates the amount of Ti to the total amount of Ni, Fe, or Cu, which is a metal element contained in the boundary layer 50 and constituting the bonded layer 30, and Ti, which is a metal element contained in the boundary layer 50 and constituting the base material 10.

The intermediate material 20 and the bonded layer 30 are formed by placing the raw material of the intermediate material 20 or the bonded layer 30 on the base and melting and solidifying the raw material and the base using a laser beam or an arc as a heat source. The melted and solidified layers may also be stacked in the height direction. An example of a method for forming layers by melting and solidifying is build-up processing. When the intermediate material 20 is formed, the raw material and the base are melted, so that the upper part of the intermediate material 20 contains Ti, which is the main component element of the base material 10.

Next, a manufacturing method of the joining member 1 according to the first embodiment will be described. In the following, an example will be described in which the base material 10 is a Ti-6Al (aluminum)-4V alloy, the intermediate material raw material member that is the raw material of the intermediate material 20 is a V metal, and the joining layer raw material member that is the raw material of the joining layer 30 is an alloy containing Ni as the main component element. In the base material 10, the component ratio of Ti in all alloy elements is 90 wt%. In the joining layer raw material member, the component ratio of Ni in all alloy elements is 47 wt%, and the component ratio of Fe is 18 wt%. Note that the other elements in the joining layer raw material member are elements that do not react with Ti or elements that react with Ti only in small amounts. Therefore, in the following description, other elements in the joining layer raw material member can be ignored.

Here, a case where the intermediate material 20 and the bonded layer 30 are formed by build-up processing will be described. FIG. 3 is a side view showing an example of build-up processing. Build-up processing is performed by a build-up processing device 100. The build-up processing device 100 includes a stage 101 for placing the substrate 10, a raw material material supply unit 102 for supplying raw material material 110 that is the raw material for the build-up layer 112, and a nozzle 103 for irradiating laser light L to melt the raw material material 110.

In one example, the raw material supply unit 102 is a wire nozzle that supplies a wire-shaped raw material 110 to a predetermined position on the stage 101. In this example, when forming the intermediate material 20, a wire made of a material containing the main component element constituting the intermediate material 20, i.e., V, which is the intermediate material raw material, is used as the raw material 110. When forming the bonded layer 30, a wire made of a material containing the main component element constituting the bonded layer 30, i.e., Ni, which is the bonded layer raw material, is used as the raw material 110.

The nozzle 103 emits the laser light L and also ejects a shielding gas G that suppresses oxidation of the area irradiated by the laser light L so as to surround the laser light L. An example of the shielding gas G is argon, which is an inert gas.

At least one of the stage 101 and the nozzle 103 is provided with a movement mechanism, which allows the stage 101 and the nozzle 103 to move relatively. The stage 101 and the nozzle 103 are capable of moving relatively in a horizontal plane. In this case, the stage 101 can be made movable along one of two orthogonal axes provided in the horizontal plane, and the nozzle 103 can be made movable along the other axis in the horizontal plane. The nozzle 103 is attached to a guide rail aligned with the axis.

In the build-up process, first, the substrate 10 is placed on the stage 101, and the wire-shaped raw material 110 is fed from the raw material supply unit 102 to the build-up point. That is, the raw material 110 is fed onto the base. Next, the stage 101 and the nozzle 103 are moved relative to each other so that the nozzle 103 is positioned above the position where the raw material 110 is fed. Then, a shielding gas G is sprayed from the nozzle 103, and the laser light L is emitted in an environment where the shielding gas G is sprayed. The laser light L is irradiated onto the raw material 110. The laser light L serves as a heat source, and the wire-shaped raw material 110 is melted. At this time, the base on which the raw material is placed is also melted at the same time. As a result, a molten portion 111 is formed in which the base and the raw material 110 are in a liquid phase. Then, at least one of the nozzle 103 and the stage 101 is moved within a horizontal plane. As a result, the molten portion 111 outside the irradiation area of the laser light L solidifies, and a build-up layer 112 is formed on the base. That is, the wire-shaped raw material member 110 is piled up on the base. In the molten portion 111, an alloy is formed from the elements that make up the base and the raw material member 110, and the raw material member 110 is bonded to the base. By doing the above, or by repeating the above process, the required amount of material is piled up on the base.

The manufacturing method of the joining member 1 includes an intermediate material forming process of forming an intermediate material 20 on the base material 10, and a bonded layer forming process of forming a bonded layer 30 on the intermediate material 20. In the intermediate material forming process, the base is the base material 10 and the build-up layer 112 is formed, but when the second layer or later is laminated, the base becomes the build-up layer 112 that constitutes the intermediate material 20. In other words, the intermediate material 20 has a structure in which a plurality of build-up layers 112 made of an alloy containing Ti, the main component element of the base material 10, are laminated in the height direction. In this way, in the intermediate material forming process, the intermediate material 20 including one or more build-up layers 112 is formed. In each build-up layer 112, the metal components of the raw material member 110 and the base melt, mix, and solidify, so that the component ratio changes depending on the position in the thickness direction of the laminate. The intermediate material 20 is formed until the Ti component ratio at a position corresponding to the surface of the intermediate material 20 formed in the intermediate material forming step when the bonded layer 30 is formed on the intermediate material 20 in the bonded layer forming step becomes a range that forms an alloy with the total amount of Ti, Ni, and Fe and does not form an intermetallic compound. In the case of this example, the intermediate material 20 is formed until the Ti component ratio at a position corresponding to the surface of the intermediate material 20 formed in the intermediate material forming step when the bonded layer 30 is formed on the intermediate material 20 in the bonded layer forming step becomes more than 0 wt % and 5.0 wt % or less with respect to the total amount of Ti, Ni, and Fe. In the intermediate material forming process, when the Ti component ratio on the upper surface of the buildup layer 112 formed by one buildup process is more than 0 wt% and not more than 5.0 wt%, the condition that the Ti component ratio on the surface of the intermediate material 20 when the bonded layer 30 is formed in the bonded layer forming process is more than 0 wt% and not more than 5.0 wt% with respect to the total amount of Ti, Ni, and Fe is satisfied. In addition, after the bonded layer 30 is formed, the position corresponding to the position of the surface of the intermediate material 20 when the bonded layer raw material member is placed in the bonded layer forming process is considered to be the surface of the intermediate material 20 when the bonded layer 30 is formed in the bonded layer forming process, and is considered to be the interface between the intermediate material 20 and the bonded layer 30.

When the first buildup layer 112 of the intermediate material 20 is formed, the base is the base material 10 made of an alloy containing Ti as the main component element. A wire-shaped raw material member 110 made of V, which is an intermediate material raw material member, is supplied onto this base material 10, and the raw material member 110 and the base are melted by irradiation with laser light L to form a new buildup layer 112. This buildup layer 112 is an alloy formed by Ti, which is the main component element of the base, and V, which is a constituent element of the raw material member 110. In one example, in this part, i.e., in the manufacturing method of the joining member 1, the first buildup layer 112 formed on the base material 10 corresponds to the boundary layer 40 shown in FIG. 2, and the buildup layer 112 formed above the boundary layer 40 becomes the intermediate material 20 shown in FIG. 2.

In the bonded layer formation process, the intermediate material 20 serves as the base and the build-up layer 112 is formed, but when the second and subsequent layers are laminated, the base becomes the build-up layer 112 that constitutes the bonded layer 30. In other words, the bonded layer 30 is formed by the build-up layer 112 made of an alloy containing Ni as the main component element on the intermediate material 20 whose Ti content is greater than 0 wt% and less than or equal to 5.0 wt%. The build-up layer 112 is laminated on the bonded layer 30 to a thickness that is predetermined for the product. In this way, in the bonded layer formation process, the bonded layer 30 is formed, which includes one or more build-up layers 112.

When the first build-up layer 112 of the bonded layer 30 is formed, the base becomes the intermediate material 20 made of a V alloy containing more than 0 wt% and 5.0 wt% or less of Ti. A wire-shaped raw material member 110 made of an alloy containing Ni as the main component element, which is the raw material member of the bonded layer, is supplied onto this intermediate material 20, and the raw material member 110 and the base are melted by irradiation with laser light L to form a new build-up layer 112. In this build-up layer 112, an alloy is formed by Ti contained in the underlying intermediate material 20 and Ni and Fe, which are elements constituting the raw material member 110 and react with Ti, as described later. In one example, in this part, i.e., in the manufacturing method of the bonding member 1, the first build-up layer 112 formed on the intermediate material 20 corresponds to the boundary layer 50 shown in FIG. 2, and the build-up layer 112 formed above the boundary layer 50 becomes the bonded layer 30 shown in FIG. 2.

As described above, in the intermediate material forming process, the intermediate material 20 is melted and solidified while being built up to a thickness at which the Ti component ratio of the surface of the intermediate material 20 is greater than 0 wt% and less than 5.0 wt% relative to the total amount of Ni, Fe, and Ti when the bonded layer 30 is formed on the intermediate material 20 in the bonded layer forming process. Then, after the Ti component ratio of the surface of the intermediate material 20 is greater than 0 wt% and less than 5.0 wt% relative to the total amount of Ni, Fe, and Ti, the bonded layer forming process is carried out. The thickness at which the Ti component ratio of the build-up surface of the intermediate material 20 is greater than 0 wt% and less than 5.0 wt% relative to the total amount of Ni, Fe, and Ti is determined in advance by experiment. When Ti-6Al-4V is used as the base material 10 and V is used as the intermediate material 20, the build-up thickness at which the Ti component ratio on the surface of the build-up layer 112 is 5.0 wt% or less relative to the total amount of Ni, Fe, and Ti is 1.8 mm or more.

An example of a Ti quantification means is an X-ray fluorescence analyzer or an X-ray analyzer attached to an electron microscope. These devices can analyze the results of depositing the intermediate material 20 and the bonded layer 30 on the substrate 10, and determine the thickness of the intermediate material 20 at which the Ti component ratio on the surface of the intermediate material 20 is 5.0 wt% or less. In addition, since an X-ray fluorescence analyzer can perform analysis in the atmosphere, it can be attached to the deposition processing device 100 that performs the above-mentioned deposition processing. In this case, the component ratio on the surface of the deposition layer 112 can be grasped on the spot in parallel with the deposition processing, so that it is possible to eliminate the need to perform an experiment in advance to determine the thickness of the intermediate material 20 at which the Ti component ratio is more than 0 wt% and 5.0 wt% or less.

By the above steps, a joining member 1 can be obtained in which a joining layer 30 made of an alloy mainly composed of Ni is firmly joined to a base material 10 made of an alloy mainly composed of Ti via an intermediate material 20 made of V.

Next, the reason why the Ti component ratio at the position corresponding to the surface of the intermediate material 20 formed in the intermediate material forming process when the bonded layer 30 is formed on the intermediate material 20 in the bonded layer forming process is set to be more than 0 wt% and 5.0 wt% or less with respect to the total amount of Ni, Fe, and Ti will be explained. FIG. 4 is a ternary phase diagram of Ni, Fe, and Ti. When Ti is contained in the alloy mainly composed of Ni constituting the bonded layer 30 described above, the component ratio of Fe to the total amount of Ni and Fe in the bonded layer 30 is about 28 wt%, so the composition ratio with the change in the Ti amount is located on the line 200. That is, when Ti is contained in the buildup layer 112 of the bonded layer 30 described above, the composition of the buildup layer 112 changes along the line 200. On the line 200 in FIG. 4, the region where the Ti component ratio exceeds 5.0 wt% becomes the region 220 where an intermetallic compound is formed. In this case, an intermetallic compound is formed as a brittle layer in the region between the intermediate material 20 and the bonded layer 30. When an intermetallic compound is formed, the intermetallic compound becomes the starting point for cracking, and the intermediate material 20 no longer functions. In other words, the intermediate material 20 is no longer able to bond the bonded layer 30 to the substrate 10.

On the other hand, in the region where the Ti component ratio is more than 0 wt% and less than 5.0 wt%, no intermetallic compounds are formed, and Ti forms an alloy with an alloy containing Ni and Fe, forming a region 210. Therefore, when the Ti component ratio in the buildup layer 112 is more than 0 wt% and less than 5.0 wt%, a brittle layer containing intermetallic compounds is not formed in the region between the intermediate material 20 and the bonded layer 30. In other words, a boundary layer 50 is formed that contains Ti but has the same structure as an alloy mainly composed of Ni. Therefore, the intermediate material 20 does not contain defects such as cracks, and therefore the substrate 10 and the bonded layer 30 can be firmly bonded.

Figure 5 shows a composition image by a scanning electron microscope (SEM) and characteristic X-ray images of Ti and Ni on the surface of the buildup layer of the intermediate material when the Ti component ratio of the buildup layer surface of the intermediate material exceeds 5.0 wt%. Figure 6 shows a composition image by a scanning electron microscope and characteristic X-ray images of Ti and Ni on the surface of the buildup layer of the intermediate material when the Ti component ratio of the buildup layer surface of the intermediate material is 5.0 wt% or less. Here, the intermediate material 20 made of V and the bonded layer 30 made of an alloy containing 47 wt% Ni and 18 wt% Fe were formed on the substrate 10 made of Ti-6Al-4V alloy by the above buildup processing, and were observed by SEM and analyzed by an X-ray analyzer attached to the SEM. Specifically, the results are from observing the composition image using an SEM and measuring the element distribution using an X-ray analyzer for a region that is about 50 μm higher than the height of the build-up layer 112 of the original intermediate material 20, i.e., a region within the bonded layer 30.

As shown in the composition image 300, the characteristic X-ray image of Ti 310, and the characteristic X-ray image of Ni 320 in FIG. 5, when the Ti component ratio exceeds 5.0 wt%, the distribution of Ti and Ni, i.e., the concentration, varies depending on the location, and it can be seen that an intermetallic compound is formed. In fact, although not shown, in this state, cracks occur between the bonded layer 30 and the intermediate material 20, and the bonded member 1 cannot be obtained.

On the other hand, as shown in the composition image 300A, the characteristic X-ray image of Ti 310A, and the characteristic X-ray image of Ni 320A in FIG. 6, when the Ti component ratio is greater than 0 wt% and less than or equal to 5.0 wt%, the distribution, i.e., the concentration, of Ti and Ni is uniform without any bias depending on the location. In other words, it can be seen that a good joint member 1 can be obtained without the formation of intermetallic compounds.

In the above, we have given an example of joining a Ti-6Al-4V alloy and an alloy mainly composed of Ni, specifically an alloy in which the Ni content ratio in all alloy elements is 47 wt% and the Fe content ratio is 18 wt%, using an intermediate material 20 made of V. However, by controlling the build-up thickness of the intermediate material 20 based on the phase diagram so that the content ratio is such that an intermetallic compound is not formed due to Ti diffusion at the interface between the intermediate material 20 and the bonded layer 30, it is possible to use the intermediate material 20 to bond an alloy mainly composed of Ni, as well as an alloy mainly composed of Fe or Cu, to the bonded layer 30 and the substrate 10.

In the above description, the case where the alloy containing Ni as the main component element is an alloy in which Ni is 47 wt% and Fe is 18 wt% of all alloy elements is given as an example. However, in FIG. 4, if the component ratio of Ni and Fe in the region 210 when the Ti concentration is 0 wt%, even if Ti is contained in the alloy containing Ni and Fe in the Ti concentration range in the region 210, Ti can form an alloy without forming an intermetallic compound with the alloy containing Ni and Fe. In one example, if an alloy in which Ni is 41 wt% to 54 wt% and Fe is 17 wt% to 20 wt% of all alloy elements is used as the raw material member for the bonded layer, the thickness of the intermediate material 20 can be adjusted so that the upper part of the intermediate material 20 has the same component ratio, that is, the component ratio of Ti to the total amount of Ni, Fe, and Ti is 5.0 wt% or less, and a crack-free intermediate material 20 can be obtained.

Furthermore, in the first embodiment, the alloy containing Ti as the main component element is used as the substrate 10, and the alloy containing any one of Ni, Fe, and Cu as the main component element is used as the bonded layer 30, but the substrate 10 and the bonded layer 30 may be reversed. That is, the substrate 10 may be an alloy containing any one of Ni, Fe, and Cu as the main component element, and the bonded layer 30 may be an alloy containing Ti as the main component element. This allows the components of the substrate 10 that form an intermetallic compound with Ti to be diluted by the intermediate material 20, and the formation of an intermetallic compound between Ti and the components of the substrate 10 between the intermediate material 20 and the bonded layer 30 is suppressed. In addition, the cladding method is not limited to the method shown in FIG. 3, as long as the raw material member 110 and the base are melted while the raw material member 110 is cladded. Furthermore, in the above example, the intermediate material raw material member is V, but the intermediate material raw material member may be a single metal or alloy containing one element selected from the group consisting of V, Mo, and W.

In addition, in the deposition processing device 100 of FIG. 3, the range of motion of at least one axis of the nozzle 103 and the stage 101 depends on the length of the guide rail (not shown) that holds the nozzle 103 or the size of the stage 101. Therefore, by lengthening the guide rail or changing the size of the stage 101 according to the part, which is the substrate 10 to be applied, it is possible to easily accommodate large parts.

As described above, in the first embodiment, the raw material 110 is placed on the base, and the raw material 110 is melted and solidified together with the base by a heat source of laser light L or an arc, to form the intermediate material 20 and the bonded layer 30 on the base material 10. The base material 10 is Ti or an alloy mainly composed of Ti, the bonded layer 30 is an alloy mainly composed of Ni, Fe or Cu, and the intermediate material 20 is a single metal or alloy containing one element selected from the group of V, Mo and W. In addition, the intermediate material 20 is overlaid so that the composition ratio of Ti and at least one element of Ni, Fe and Cu on the surface of the intermediate material 20 when the bonded layer 30 is formed is such that an intermetallic compound is not formed with respect to the total amount. As a result, when the bonded layer 30 is overlaid on the intermediate material 20 by overlay processing, it is possible to bond in a liquid phase state and suppress the precipitation of an intermetallic compound between the intermediate material 20 and the bonded layer 30. As a result, the first member made of Ti or an alloy mainly composed of Ti and the second member made of an alloy mainly composed of Ni, Fe or Cu can be firmly joined without causing defects such as cracks caused by intermetallic compounds at the interface between the intermediate material 20 and the bonded layer 30. In other words, the reliability of the bond strength between the base material 10 and the bonded layer 30 can be improved compared to the conventional case.

The configurations shown in the above embodiments are merely examples, and may be combined with other known technologies. Parts of the configurations may be omitted or modified without departing from the spirit of the invention.

1 Joining member, 10 Base material, 20 Intermediate material, 30 Joined layer, 40, 50 Boundary layer, 100 Overlay processing device, 101 Stage, 102 Raw material supply unit, 103 Nozzle, 110 Raw material, 111 Melted portion, 112 Overlay layer.

Claims (4)

A method for manufacturing a bonded member in which a first member made of Ti or an alloy containing Ti as a main component element and a second member made of an alloy containing Ni, Fe or Cu as a main component element are bonded together via an intermediate material, the method comprising the steps of:
an intermediate material forming process for forming the intermediate material including at least one build-up layer by melting and solidifying an intermediate material raw material member disposed on the base material, the intermediate material being a material containing a main component element constituting the intermediate material, together with a base on which the intermediate material raw material member is disposed, using one of the first member and the second member as a base material;
a bonded layer forming step of forming the bonded layer including at least one build-up layer, the build-up layer being formed by melting and solidifying a bonded layer raw material member disposed on the intermediate material together with a base on which the bonded layer raw material member is disposed, the build-up layer being made of a material containing a main component element constituting the bonded layer, the build-up layer being formed of the material containing a main component element constituting the bonded layer, the build-up layer being formed of a material containing a main component element constituting the bonded layer, the main component element being ...
Including,
The intermediate material raw material member is a metal or alloy containing one element selected from the group consisting of V, Mo, and W;
%と3.0wt％以下。 English: The method for manufacturing a joining member, wherein the base material is the first member made of Ti or a Ti alloy, and the raw material member for the joining layer is a Ni alloy containing 41 wt% or more and 54 wt% or less of Ni and 17 wt% or more and 20 wt% or less of Fe among all alloying elements, and the intermediate material forming step is performed after the intermediate material has a thickness such that when the joining layer is formed on the intermediate material in the joining layer forming step, the Ti component ratio at a position corresponding to the surface of the intermediate material formed in the intermediate material forming step is more than 0 wt% and less than 5.0 wt% , which is a range that forms an alloy with respect to the total amount of Ni, Fe and Ti and does not form an intermetallic compound. In the intermediate material forming step, the intermediate material raw material member and a base on which the intermediate material raw material member is arranged are melted using a laser beam or an arc as a heat source,
2. The method for manufacturing a bonded member according to claim 1, wherein in the bonding layer forming step, the bonding layer raw material member and a base on which the bonding layer raw material member is placed are melted using a laser beam or an arc as a heat source. A first member made of Ti or an alloy containing Ti as a main component element;
A second member made of an alloy containing Ni, Fe or Cu as a main component element;
an intermediate material that joins the first member and the second member and is made of a material containing one element selected from the group consisting of V, Mo, and W;
Equipped with
a component ratio of Ti to a total amount of Ti and at least one element of Ni, Fe, and Cu at an interface between the second member and the intermediate material is a composition ratio that does not form an intermetallic compound,
A joining member characterized in that, when the second member is made of a Ni alloy containing 41 wt% or more and 54 wt% or less of Ni and 17 wt% or more and 20 wt% or less of Fe among all alloy elements, the Ti component ratio at the interface between the second member and the intermediate material is more than 0 wt% and 5.0 wt% or less with respect to the total amount of Ti, Ni and Fe. The joining member according to claim 3, characterized in that an alloy of Ti and one element selected from the group consisting of V, Mo and W is formed at the interface between the first member and the intermediate member.

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