JP6856238B2 - Manufacturing method of tip member of heating tool - Google Patents

Description

The present invention relates to a method for manufacturing a tip member of a heating tool and a tip member of a heating tool.

Conventionally, as disclosed in Patent Documents 1 and 2 below, various methods for manufacturing a soldering iron tip, which is a tip member of a heating tool, are known. The tip of the soldering iron is made of a copper substrate connected to the heater, and its tip is a working part for contacting a molten bonding material such as solder. By coating the tip of the iron tip with a surface layer such as iron, wettability against solder can be ensured and erosion of solder into the inside of the substrate can be prevented.

Patent Document 1 below describes forming a surface layer of pure iron by plating on a working portion of a copper iron tip substrate. Further, Patent Document 2 below describes a method of producing a surface layer cap by a metal powder injection molding (MIM) method and joining the cap to the working portion of the iron tip substrate.

Japanese Unexamined Patent Publication No. 7-1122272 Japanese Patent No. 4546833

When a surface layer is formed on the working portion of the iron tip substrate by plating as in Patent Document 1, there is a problem that it takes a long time to form the surface layer because the iron precipitation rate is slow. Moreover, in the forming method by plating, a treatment such as masking is required to form a surface layer only on the tip portion of the iron tip substrate, which poses a problem in terms of manufacturing efficiency.

In Patent Document 2, a surface layer cap is produced by the MIM method, but it is technically difficult to produce a surface layer having a thickness of 400 μm or less by a general MIM method. Therefore, by forming the surface layer thinner, there is room for further improving the efficiency of heat conduction from the working portion of the iron tip to the solder or the work. Further, the sintering density of this surface layer remains at about 94 to 96%, and there is room for improvement in the surface of suppressing solder erosion and the influence on the temperature characteristics as well.

The present invention has been made in view of the above problems, and one of the purposes thereof is the tip of a heating tool having a high density, excellent corrosion resistance, high wettability that cannot be obtained by plating, and a thin surface layer. It is to provide a method capable of efficiently manufacturing a member. Another object of the present invention is to provide a tip member of a heating tool having high density, excellent corrosion resistance, and high wettability that cannot be obtained by plating.

A method for manufacturing a tip member of a heating tool according to one aspect of the present invention comprises a substrate having a flat tip surface that is oblique to the axial direction and a surface layer that covers the tip surface. This is a method for manufacturing a tip member of a heating tool provided. In this method, the substrate is installed diagonally so that the tip surface faces upward, and the metal powder, which is a metal material, is supplied to the tip surface, and the tip surface is covered with the metal powder. By irradiating the metal powder covering the tip surface with a laser beam or an electron beam or by arc discharge to melt the metal powder covering the tip surface and solidifying the melted metal material, the tip comprising a shaped step of shaping the front Symbol surface layer that is integral to the surface.

In the method for manufacturing the tip member of the heating tool, the surface layer covering the tip surface of the substrate is formed by melting and solidifying the metal material using a laser beam, an electron beam, or an arc discharge generated between the substrate and the electrode as a heat source. To model. According to this method, the time required for forming the surface layer can be further shortened as compared with the case where the surface layer is formed by plating as in the conventional case, and the manufacturing efficiency can be further improved. Moreover, since there are many types of materials that can be used as compared with plating, it is possible to select an arbitrary alloy material having high wettability with respect to the bonding material and to form the alloy film as a surface layer. Further, by adjusting the conditions of laser light, electron beam, arc discharge, etc., it is possible to form a thinner surface layer than in the case of the conventional MIM method. Moreover, the surface layer formed by this method has a higher density than the surface layer formed by the MIM method. Therefore, according to the above method, it is possible to efficiently manufacture the tip member of the heating tool having a high-density and thin surface layer by a short-time modeling process. Further, by directly molding the surface layer on the tip surface of the substrate by the powder bed type metal lamination molding, high adhesion between the tip surface of the substrate and the surface layer can be ensured. Further, it is not necessary to separately prepare a support material for supporting the surface layer which is a modeled object. Moreover, since the finished product has a surface layer formed on the tip surface of the substrate, it is not necessary to remove the modeled object (surface layer) from the support material (base), unlike the usual metal laminated molding. Therefore, it is preferable from the viewpoint of improving manufacturing efficiency.

In the method for manufacturing the tip member of the heating tool, a step of supplying a second metal powder different from the metal powder to a position different from the tip surface and covering the base at that position, and the step of covering the base. A step of irradiating the second metal powder with a laser beam to melt the second metal powder and solidifying the melted second metal powder to form a second surface layer may be further performed.

As a result, the substrate and the surface layer can be produced in one step, so that the production time can be significantly shortened.

In the method for manufacturing the tip member of the heating tool, in the molding step, a selection is made from the group consisting of Fe, Fe-Co alloy, Fe-Co-C alloy, Fe-Ni alloy and Fe-Ni-Co alloy. The surface layer made of at least one material to be alloyed may be shaped. This makes it possible to form a surface layer having high wettability with respect to solder, which is one of the bonding materials.

In the method for manufacturing the tip member of the heating tool, a soldering iron tip or a nozzle for a solder sucker may be manufactured as the tip member of the heating tool. As a result, it is possible to efficiently manufacture a soldering iron tip or a solder sucker nozzle that has high wettability against solder and can prevent solder erosion.

As is clear from the above description, according to the present invention, a tip member of a heating tool having a high density, excellent corrosion resistance, high wetting property that cannot be obtained by plating, and a thin surface layer can be efficiently manufactured. The possible methods can be provided. Further, it is possible to provide a tip member of a heating tool having high density, excellent corrosion resistance, and high wettability that cannot be obtained by plating.

It is a schematic diagram which shows the structure of the metal laminated modeling apparatus provided with the laser irradiation apparatus in Embodiment 1. FIG. It is a schematic diagram which shows the structure of the metal laminated modeling apparatus equipped with an electron beam gun. It is a flowchart which shows the flow of the manufacturing method of the tip member of the heating tool which concerns on Embodiment 1. It is a schematic diagram which shows the state of irradiating the metal powder covering the tip surface of a substrate with a laser beam or an electron beam. It is a schematic diagram which shows the appearance that the surface layer was formed on the tip surface of a substrate. It is a schematic diagram which shows the state of laminating the surface layer on the tip surface of a substrate. It is a schematic diagram which shows the substrate of the soldering iron tip used in Embodiment 1. It is a schematic diagram for demonstrating the manufacturing method of the tip member of the heating tool which concerns on Embodiment 2. It is a flowchart which shows the flow of the manufacturing method of the tip member of the heating tool which concerns on Embodiment 2. It is a schematic diagram for demonstrating the manufacturing method of the tip member of the heating tool which concerns on Embodiment 3. It is a flowchart which shows the flow of the manufacturing method of the tip member of the heating tool which concerns on Embodiment 3. It is a schematic diagram for demonstrating the manufacturing method of the tip member of the heating tool which concerns on Embodiment 4. FIG. It is a flowchart which shows the flow of the manufacturing method of the tip member of the heating tool which concerns on Embodiment 4. It is a schematic diagram for demonstrating the manufacturing method of the tip member of the heating tool which concerns on Embodiment 5. It is a schematic diagram for demonstrating the manufacturing method of the tip member of the heating tool which concerns on Embodiment 5. It is a schematic diagram for demonstrating the manufacturing method of the tip member of the heating tool which concerns on Embodiment 5. It is a schematic diagram for demonstrating the manufacturing method of the tip member of the heating tool which concerns on Embodiment 5. It is a schematic diagram for demonstrating the manufacturing method of the tip member of the heating tool which concerns on Embodiment 6. It is a schematic diagram which shows the base | substrate of the soldering iron tip in other embodiments. It is a schematic diagram which shows the base | substrate of the soldering iron tip in other embodiments. It is a schematic diagram which shows the shape of the surface layer in other embodiments. It is a schematic diagram which shows the shape of the surface layer in other embodiments. It is a schematic diagram which shows the shape of the surface layer in other embodiments. It is a schematic diagram which shows the substrate of the nozzle for sucker in other embodiment. It is a schematic diagram which shows the cap of the surface layer in other embodiments. It is a schematic diagram which shows the cap of the surface layer in other embodiments. It is a schematic diagram which shows the cap of the surface layer in other embodiments. It is a micrograph of the surface layer formed on the tip surface of the iron tip substrate in the Example. It is a magnified micrograph of the above surface layer. It is the photograph which observed the cross section of the tip part of the iron tip substrate which formed the surface layer. It is an enlarged photograph of the interface portion between a surface layer and a substrate in FIG. 30. It is a photograph which observed the cross section of the surface layer formed by the plating method.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
First, a method of manufacturing the tip member of the heating tool according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 7. A method for manufacturing a tip member of a heating tool according to the present embodiment is a soldering iron including a substrate 10 having a tip surface 10A in contact with molten solder (bonding material) and a surface layer 30 covering the tip surface 10A. This is a method for manufacturing a soldering iron tip (tip member of a heating tool), and the surface layer 30 is formed by powder bed type metal lamination molding. First, the configuration of the metal lamination modeling apparatus 1 used in this method will be described with reference to FIG.

[Metal laminate modeling equipment]
As shown in FIG. 1, the metal laminated modeling apparatus 1 mainly includes a vacuum chamber 2, a modeling table 3, metal powder supply units 5 and 6, an irradiation unit 8, and a control unit 9.

The vacuum chamber 2 is composed of a housing provided with a space 2A for performing metal laminating modeling. The vacuum chamber 2 is provided with a door (not shown) on the front side, and the substrate 10 can be taken in and out of the chamber by opening and closing the door. The door may be provided with a window portion for observing the inside of the space 2A from the outside.

A vacuum pump (not shown) is connected to the vacuum chamber 2 via an exhaust pipe, and the vacuum pump can reduce the pressure in the space 2A to a predetermined vacuum state. Further, in the vacuum chamber 2, a supply source of an inert gas such as _{argon (Ar) and nitrogen (N 2 ) and a supply source of a reducing gas such as hydrogen (H 2} ) are connected via a pipe, and the space 2A is connected. The inert gas and the reducing gas may be allowed to flow into the inside. The ratio of the reducing gas to the total atmospheric gas in the space 2A can be, for example, 5 to 10%. As a result, the surface layer 30 can be formed in an atmosphere containing a reducing gas, so that oxidation of the outermost surface layer of the surface layer 30 can be prevented and the surface layer 30 having wettability to solder can be formed.

The modeling table 3 is a portion for performing metal lamination modeling, and is installed at the bottom of the vacuum chamber 2. The modeling table 3 includes a table body 3A having a flat table surface 3AA, a plurality of support legs 3B (two in this embodiment) for supporting the table body 3A, and a support jig arranged on the table surface 3AA. It has 3C and. The modeling table 3 is configured to be movable up and down by the control unit 9, whereby the position of the table surface 3AA in the vertical direction can be freely changed.

As shown in FIG. 1, the base 10 of the soldering iron tip is installed on the table surface 3AA. The support jig 3C is a member for keeping the posture of the base 10 installed on the table surface 3AA constant, and as shown in FIG. 1, the support hole 3CC into which the base 10 is inserted penetrates in the thickness direction. It is provided to do so. The support jig 3C is fixed to the table body 3A by a fastening member such as a bolt (not shown). The upper end of the support leg 3B is connected to the lower surface of the table body 3A (the surface opposite to the table surface 3AA). As shown in FIG. 1, the metal laminated molding apparatus 1 is configured such that metal powder 7 as a raw material for metal laminated molding is spread in a region on the upper surface 31 side of the support jig 3C, and this region is powder. The bed is 3D.

The metal powder supply units 5 and 6 are provided to supply the metal powder 7, which is a raw material for metal lamination molding, to the powder bed unit 3D. As shown in FIG. 1, the metal powder supply units 5 and 6 are arranged inside the vacuum chamber 2 above the modeling table 3 and on both sides of the modeling table 3.

The metal powder supply units 5 and 6 are composed of tanks capable of accommodating the metal powder 7 inside. Then, as shown by the dotted arrow in the middle of FIG. 1, the metal powder supply units 5 and 6 supply the metal powder 7 from the supply ports 5A and 6A provided at the lower portion toward the powder bed unit 3D. Further, the metal lamination molding apparatus 1 further includes a rod-shaped squeegee 7A, and by sliding the squeegee 7A toward the powder bed portion 3D side, the upper surface of the layer of the metal powder 7 can be leveled flatly.

The irradiation unit 8 is composed of a laser irradiation device, and irradiates a laser beam 8A (for example, a fiber laser) toward the modeling table 3 as shown in FIG. The irradiation unit 8 includes a laser oscillator 22 that generates a laser beam 8A, a deflection lens 23, and a condenser lens 24.

The laser beam 8A generated by the laser oscillator 22 can focus on the metal powder 7 by the condenser lens 24, and can freely scan on the metal powder 7 by the deflection lens 23.

Further, the irradiation unit is not limited to the one configured by the laser irradiation device, and may be configured by the electron beam gun. As shown in FIG. 2, the irradiation unit 81 as an electron beam gun irradiates the electron beam 8AA toward the modeling table 3. The irradiation unit 81 includes a tubular electronic column 21 attached to the upper part of the vacuum chamber 2, a filament 21A for generating an electron beam 8AA, a focus coil 21B, and a deflection coil 21C.

The filament 21A is arranged at the upper part in the electronic column 21. The electron beam 8AA generated by the filament 21A can focus on the metal powder 7 by the focus coil 21B, and can freely scan on the metal powder 7 by the deflection coil 21C.

The control unit 9 is a part for controlling the operation of the metal laminating modeling device 1. The control unit 9 includes a display unit 94, a control unit 95, and a power supply unit 93. The control unit 95 controls the vertical movement of the modeling table 3, the supply operation of the metal powder 7 by the metal powder supply units 5 and 6, and the irradiation of the laser beam 8A and the electron beam 8AA by the irradiation units 8 and 81. The display unit 94 is a monitor for the operator to visually confirm the processing status of the metal lamination molding (for example, the output of the laser beam or the electron beam, the processing time, etc.). The power supply unit 93 supplies electric power required for various operations of the metal lamination modeling apparatus 1.

[Manufacturing method of tip member of heating tool]
Next, a method of manufacturing the tip member of the heating tool according to the present embodiment, which is carried out by using the metal laminated molding apparatus 1, will be described with reference to the flowchart shown in FIG. In the following description, only the method using the metal laminated modeling device 1 (FIG. 1) including the irradiation unit 8 composed of the laser irradiation device will be described, but the metal including the irradiation unit 81 composed of the electron beam gun will be described. A method using a laminated molding apparatus (FIG. 2) is also feasible.

First, the preparation step S10 for preparing the base 10 of the soldering iron tip is performed. As shown in FIG. 7, the substrate 10 prepared in step S10 has a substantially cylindrical shape and a shape in which the tip 10AA side is cut diagonally with respect to the axial direction. This cut surface is a flat tip surface 10A.

Inside the substrate 10, a hollow portion 11 that opens to the base end 10AB side (opposite side to the tip end 10AA) is provided along the axial direction, and a heater (not shown) can be inserted into the hollow portion 11. ing. The substrate 10 preferably has good thermal conductivity in order to transfer the heat of the heater to the solder and the work with high efficiency, and is made of a material such as oxygen-free copper. Further, the substrate 10 may be made of a copper alloy.

As shown in FIG. 7, a surface protective layer 12 is formed on the surface of the substrate 10 so that the wettability to solder is extremely lower than that of the surface layer 30 or the wettability to solder is not. The surface protective layer 12 is formed for the purpose of preventing erosion of solder into the inside of the substrate 10 and preventing oxidation of copper at a high temperature during soldering. The surface protective layer 12 is formed over the entire surface of the substrate 10 including the tip surface 10A.

As the surface protective layer 12, for example, the following configuration can be adopted. The surface protective layer 12 may be composed of an Fe layer (thickness 10 to 50 μm) directly formed on the surface of the substrate 10 and a Cr layer (thickness 1 to 10 μm) formed on the Fe layer. .. Further, the surface protective layer 12 may be composed of an Fe layer (thickness 10 to 50 μm) directly formed on the surface of the substrate 10 and an aluminum diffusion layer formed on the Fe layer. The surface protective layer 12 is formed on the Fe layer (thickness 10 to 50 μm) directly formed on the surface of the substrate 10, the Ni layer (thickness 5 to 50 μm) formed on the Fe layer, and the Ni layer. It may be composed of the aluminum diffusion layer made of. Further, the surface protective layer 12 may be composed of a Ni layer (thickness 5 to 50 μm) directly formed on the surface of the substrate 10 and an aluminum diffusion layer formed on the Ni layer.

The present invention is not limited to the case where the substrate 10 on which the surface protective layer 12 is previously formed is prepared. For example, a substrate 10 on which the surface protective layer 12 is not formed is prepared, a surface layer 30 is formed on the tip surface 10A of the substrate 10 by a process described later, the surface layer 30 is masked, and then a portion other than the surface layer 30 is formed. It is also possible to form the surface protective layer 12 having extremely low wettability with respect to solder or having no wettability with respect to solder.

Next, the installation step S20 for installing the substrate 10 on the modeling table 3 is performed. In this step S20, the substrate 10 prepared in step S10 is inserted into the support hole 3CC of the support jig 3C and installed on the table body 3A. As shown in FIG. 1, the substrate 10 is tilted at a predetermined angle (for example, 45 °) with respect to the table surface 3AA so that the base end contacts the table surface 3AA and the tip surface 10A faces the irradiation portion 8 side. It is installed in a good posture. At this time, as shown in FIG. 1, the tip surface 10A of the substrate 10 and the upper surface 31 of the support jig 3C are substantially flush with each other.

Next, the supply step S30 for supplying the metal powder 7 (metal material) to the modeling table 3 is performed. In this step S30, the metal powder 7 which is a raw material for the metal laminated molding is supplied to the powder bed portion 3D from the metal powder supply portions 5 and 6 arranged on both sides of the modeling table 3.

As the metal powder 7, a powder made of at least one material selected from the group consisting of Fe, Fe—Co alloys, Fe—Co—C alloys, Fe—Ni alloys and Fe—Ni—Co alloys is used. Can be used. The "Fe-Co-based alloy" means an alloy containing Fe as a main component and Co as an alloy component. The same applies to "Fe-Co-C-based alloys", "Fe-Ni-based alloys" and "Fe-Ni-Co-based alloys".

In this embodiment, maraging steel powder is used as the metal powder 7 made of a Fe—Ni—Co alloy. Typical malaging steels are 17% by mass or more and 19% by mass or less of nickel, 8.5% by mass or more and 9.5% by mass or less of cobalt, and 4.5% by mass or more and 5.2% by mass or less of molybdenum. , 0.6% by mass or more and 0.8% by mass or less of titanium, 0.05% by mass or more and 0.15% by mass or less of aluminum, 0.05% by mass or less of chromium, and 0.5% by mass or less. It contains copper and 0.03% by mass or less of carbon, and is composed of the balance iron and impurities, and has good wettability to solder. In particular, maraging steel powder having an average particle size of 20 μm is suitable for metal lamination molding of the surface layer 30. As the metal powder 7 made of Fe—Co—C alloy, for example, a metal powder 7 containing 3% by mass of cobalt and 0.65% by mass of carbon and composed of the balance iron and impurities can be used. The metal powder 7 is not limited to these materials as long as it can impart good wettability to the solder in the surface layer 30.

After the metal powder 7 is spread on the upper surface 31 of the support jig 3C and the tip surface 10A of the substrate 10, the upper surface of the layer of the metal powder 7 is flattened by sliding the squeegee 7A toward the powder bed portion 3D. To be leveled. As a result, as shown in FIG. 1, a layer of metal powder 7 having a uniform thickness is formed on the support jig 3C and the substrate 10, and the entire tip surface 10A of the substrate 10 is covered with the metal powder 7. It becomes.

Next, a modeling step S40 for modeling the surface layer 30 that covers the tip surface 10A of the substrate 10 is performed. In this step S40, the laser beam 8A generated by the laser oscillator 22 is scanned by the deflection lens 23 to irradiate the metal powder 7 covering the tip surface 10A of the substrate 10 with the laser beam 8A as shown in FIG. To do. As a result, the kinetic energy at the time of irradiation of the laser beam 8A is converted into heat energy, and the metal powder 7 is melted by the heat energy. Then, the molten metal powder 7 solidifies to form the surface layer 30 that covers the tip surface 10A as shown in FIG. That is, the surface layer 30 is formed by melting the metal powder 7 using a laser beam as a heat source and solidifying the melted metal powder 7.

In this step S40, the surface layer 30 covering the entire tip surface 10A is formed by scanning the laser beam 8A over the entire tip surface 10A of the substrate 10. Further, this modeling process is performed in a state where the inside of the vacuum chamber 2 is in an atmosphere containing an inert gas such as argon or nitrogen gas and a reducing gas such as hydrogen gas.

Then, the supply step S30 and the modeling step S40 are repeated until the thickness of the surface layer 30 reaches a desired value. Specifically, when the thickness of the surface layer 30 does not reach the desired value (S50: NO), the modeling table 3 is lowered one step, and then the support jig 3C is used as shown in FIG. The metal powder 7 is spread again so as to cover the upper surface 31 and the upper surface 30A of the surface layer 30. Then, as shown in FIG. 6, the surface layer 30 is sequentially laminated by irradiating the metal powder 7 covering the upper surface 30A of the surface layer 30 with the laser beam 8A. The thickness of the surface layer 30 can be set within the range of 50 μm or more and 1 mm or less, and can be set to, for example, 200 μm.

Then, when the thickness of the surface layer 30 reaches a desired value (S50: YES), the extraction step S60 is subsequently performed. In this step S60, after stopping the irradiation of the laser beam 8A or the like, the front door of the vacuum chamber 2 is opened, and the soldering iron tip formed so that the surface layer 30 covers the tip surface 10A by the metal lamination molding. 40 (FIG. 6) is taken out of the chamber.

Here, in ordinary metal laminated modeling, the modeled object is supported by a plate-shaped support material arranged on the table body 3A during modeling, and after the completed modeled object is taken out from the vacuum chamber 2 together with the support material, the modeled object is taken out from the vacuum chamber 2. Further steps are required to remove this model from the support material. On the other hand, in the present embodiment, the substrate 10 is used as a support material for supporting the surface layer 30 (modeled object) during the modeling of the surface layer 30. Then, as described above, the soldering iron tip 40 (FIG. 6) in which the substrate 10 and the surface layer 30 are integrated is taken out as a finished product, so that the surface layer 30 (modeled object) is used as the base after the take-out step S60. There is no need to perform the step of removing from 10 (support material).

In ordinary metal laminated molding, the complexity of the work of removing the finished model from the support material becomes a problem, whereas in the present embodiment, this work does not need to be performed, which is preferable in terms of manufacturing efficiency. As described above, the soldering iron tip 40 is manufactured, and the method for manufacturing the tip member of the heating tool according to the present embodiment is completed.

[Tip member of heating tool]
The soldering iron tip 40, which is the tip member of the heating tool according to the present embodiment, is manufactured by the method for manufacturing the tip member of the heating tool according to the present embodiment, and includes the substrate 10 and the surface layer 30. , Is equipped. The substrate 10 has a tip surface 10A that comes into contact with the molten solder. The surface layer 30 covers the tip surface 10A.

The surface layer 30 is made of at least one material selected from the group consisting of Fe, Fe—Co alloys, Fe—Co—C alloys, Fe—Ni alloys and Fe—Ni—Co alloys. For example, it is made of Fe—Ni—Co alloy. In particular, the surface layer 30 made of Fe-Co-based alloy, Fe-Co-C-based alloy and Fe-Ni-Co-based alloy is difficult to form by the plating method, but can be easily formed by using the above-mentioned metal lamination molding method. Can be formed into. As a result, good wettability with respect to solder can be obtained.

Further, since the surface layer 30 is formed by the above-mentioned metal additive manufacturing method, it has a density of 99% or more. As described above, by solidifying the metal powder 7 melted by irradiation with the laser beam 8A to form the surface layer 30, a higher density can be achieved as compared with the MIM method or the like. Thereby, the erosion resistance of the substrate 10 can be enhanced.

[Characteristics and effects of Embodiment 1]
As described above, the method for manufacturing the tip member of the heating tool according to the present embodiment includes a substrate 10 having a tip surface 10A in contact with the molten solder (bonding material), a surface layer 30 covering the tip surface 10A, and the surface layer 30. This is a method for manufacturing a soldering iron tip 40 (tip member of a heating tool) provided with the above. This method includes a molding step S40 for molding the surface layer 30 by melting the metal powder 7 (metal material) using the laser beam 8A as a heat source and solidifying the melted metal powder 7.

The manufacturing method includes an installation step S20 for installing the substrate 10 on the modeling table 3, and a supply step S30 for supplying the metal powder 7 to the modeling table 3 so that the tip surface 10A is covered with the metal powder 7. ing. The tip surface 10A is flat. In the modeling step S40, the surface layer 30 covering the tip surface 10A is modeled by irradiating the metal powder 7 covering the tip surface 10A with laser light 8A. In the modeling step S40, the substrate 10 is used as a support material for supporting the surface layer 30 which is a modeled object.

According to the above-mentioned manufacturing method, the time required for forming the surface layer can be further shortened as compared with the case where the surface layer is formed by plating, and the manufacturing efficiency can be further improved. Further, by adjusting the output of the laser beam 8A, the particle size of the metal powder 7, and the like, it is possible to form a thinner surface layer 30 than in the case of the MIM method. Moreover, the surface layer 30 formed by this method has a higher density (density 99% or more) than the surface layer formed by the MIM method. Further, by directly molding the surface layer 30 on the tip surface 10A of the substrate 10, high adhesion between the substrate 10 and the surface layer 30 can be ensured.

(Embodiment 2)
Next, a method of manufacturing the tip member of the heating tool according to the second embodiment of the present invention will be described with reference to FIGS. 8 and 9. In the method for manufacturing the tip member of the heating tool according to the second embodiment, a substrate 60 having a curved tip surface 60A is prepared, and the first metal powder 42 is supplied to the tip surface 60A and irradiation with laser light 44A. By simultaneously performing the above, the surface layer 62 covering the tip surface 60A is formed. Hereinafter, only the points different from the above-described first embodiment will be described in detail according to the flowchart shown in FIG.

First, in the preparation step S70, the substrate 60 shown in FIG. 8 is prepared. As shown in FIG. 8, the substrate 60 has a shape extending in the axial direction from the base end 60AB toward the tip 60AA, and the tip 60AA side has a conical shape. Further, in the substrate 60, the conical surface near the apex of the conical shape is a curved end surface 60A. Similar to the first embodiment, the substrate 60 is made of a material having good thermal conductivity such as copper or a copper alloy, and surface protection for preventing solder erosion and copper oxidation inside the substrate 60. Layer 12 (FIG. 7) is formed over the entire surface.

Next, in the installation step S80, the drive device 61 is connected to the base end 60AB side of the substrate 60 prepared in the step S70. The drive device 61 has, for example, a rotation mechanism such as a motor or a slide mechanism. As a result, as shown by the arrow in FIG. 8, the substrate 60 can be moved in the axial direction while rotating about the axis.

Next, in the modeling step S90, first, the laser nozzle 41 is positioned near the tip 60AA of the substrate 60. The laser nozzle 41 is connected to the laser light source 44, the metal powder supply source 45, and the gas supply source 46, respectively. Then, the laser nozzle 41 emits the laser light 44A generated by the laser light source 44 from the nozzle tip 41A, and the shield supplied from the first metal powder 42 and the gas supply source 46 supplied from the metal powder supply source 45. The gas 43 is ejected from the nozzle tip 41A. The shield gas 43 is used for the purpose of preventing oxidation of the metal material. Further, as shown in FIG. 8, the laser beam 44A passes near the center of the axis of the laser nozzle 41, the first metal powder 42 passes around the laser nozzle 41, and the shield gas 43 passes around the laser light 44A.

In the modeling step S90, the laser beam 44A is irradiated to the curved tip surface 60A and the first metal powder 42 is supplied while the substrate 60 is rotated about the axis by driving the driving device 61. As a result, the tip surface 60A is heated by the irradiation of the laser beam 44A, and the first metal powder 42 is supplied to the heated tip surface 60A, so that the first metal powder 42 is melted. Then, the molten first metal powder 42 solidifies on the tip surface 60A to form a surface layer 62 that covers the entire curved tip surface 60A. That is, in the present embodiment, the surface layer 62 is formed by melting the first metal powder 42 (metal material) using the laser beam 44A as a heat source and solidifying the melted first metal powder 42. Further, by performing the above-mentioned modeling process while moving the substrate 60 in the axial direction by the driving device 61, it is possible to form the surface layer 62 having a constant width in the axial direction from the tip as shown in FIG.

As described above, in the method for manufacturing the tip member of the heating tool according to the second embodiment, the tip surface 60A of the substrate 60 is irradiated with the laser beam 44A and the first metal powder 42 is supplied. Modeling is done. As a result, unlike the case of the first embodiment, the surface layer 62 can be easily formed even on the curved tip surface 60A which is difficult to be covered with the metal powder.

(Embodiment 3)
Next, a method of manufacturing the tip member of the heating tool according to the third embodiment of the present invention will be described with reference to FIGS. 10 and 11. The method for manufacturing the tip member of the heating tool according to the third embodiment is basically the same as that of the second embodiment, but after the surface layer 62 is formed, the wettability to the solder is extremely lower than that of the surface layer 62. Alternatively, it differs in that the protective layer 63 having no wettability against solder is further formed. Hereinafter, only the points different from the second embodiment will be described in detail according to the flowchart shown in FIG.

First, in the preparation step S100, similarly to the second embodiment, a tapered substrate 60 having a curved tip surface 60A and having a conical tip 60AA side is prepared (FIG. 10). Here, in the third embodiment, the substrate 60 is prepared in which the surface protective layer 12 (FIG. 7) for preventing solder erosion and copper oxidation inside the substrate 60 is not formed on the surface.

After that, as in the second embodiment, the substrate 60 is connected to the drive device 61 (installation step S110), and the tip surface 60A is irradiated with the laser beam 44A and the first metal powder 42 is supplied at the same time. The surface layer 62 that covers the tip surface 60A is modeled (modeling step S120).

In this modeling step S120, after the surface layer 62 is modeled, the protective layer 63 is further modeled as follows. Specifically, as shown in FIG. 10, in a state where the base 60 is rotated about the axis and moved in the axial direction by driving the drive device 61, the base end 60AB side of the surface layer 62 of the base 60 The second metal powder 45 (a metal powder different from the first metal powder 42) is supplied while irradiating the portion of the laser beam 44A. As a result, the substrate 60 is heated by the irradiation of the laser beam 44A, and the second metal powder 45 is supplied to the heated substrate 60, so that the second metal powder 45 is melted. Then, the molten second metal powder 45 solidifies, so that the protective layer 63 is formed on the conical surface on the base end 60AB side of the surface layer 62.

The protective layer 63 is a layer for preventing the molten solder from rising from the tip of the iron tip to the proximal end side, and has extremely lower wettability to the solder (or wettability to the solder) than the surface layer 62. There is no such thing). Specifically, the protective layer 63 is made of at least one material selected from the group consisting of stainless steel, titanium, chromium and aluminum and oxides thereof. The protective layer 63 may be made of one kind of material selected from the above group, or may be made of a plurality of kinds of materials selected from the above group.

As described above, in the method for manufacturing the tip member of the heating tool according to the present embodiment, the protective layer 63 is further formed in addition to the surface layer 62 that covers the tip surface 60A of the substrate 60. This makes it possible to manufacture a soldering iron tip capable of preventing solder from flowing from the tip 60AA of the substrate 60 to the base 60AB. Further, unlike the first and second embodiments, the step of preliminarily forming the surface protective layer 12 (FIG. 7) on the surface of the substrate 60 can be omitted.

(Embodiment 4)
Next, a method of manufacturing the tip member of the heating tool according to the fourth embodiment of the present invention will be described with reference to FIGS. 12 and 13. In the method for manufacturing the tip member of the heating tool according to the fourth embodiment, the substrate 10 and the surface layer 30 formed by metal lamination molding are prepared as separate bodies, and then the substrate 10 and the surface layer 30 are joined to each other. By doing so, a soldering iron tip is manufactured. Hereinafter, a method of manufacturing the tip member of the heating tool according to the present embodiment will be described in order according to the flowchart shown in FIG.

First, in the preparation step S140, the substrate 10 shown in FIG. 7 is prepared in the same manner as in the first embodiment.

Next, in the modeling step S150, the surface layer 30 is prepared as a separate body from the substrate 10 by modeling the surface layer 30 by metal lamination modeling. Specifically, in the powder bed type metal lamination molding apparatus 1 shown in FIG. 1, the support jig 3C for supporting the substrate 10 is removed from the table body 3A. Then, the data of the three-dimensional shape of the surface layer 30 to be modeled is input to the control unit 9. After that, the metal powder 7 is spread on the table surface 3AA, the laser beam 8A is irradiated from the irradiation unit 8, and the modeling table 3 is lowered repeatedly. As a result, the metal layers in which the metal powder 7 is melted and solidified are laminated in order, and the surface layer 30 having a shape that matches the input data can be formed. The surface layer 30 has a cap shape that covers the tip of the substrate 10.

Next, using the joining device 100 shown in FIG. 12, a joining step S160 for joining the cap-shaped surface layer 30 formed in step S150 to the tip surface 10A of the substrate 10 is performed. First, the configuration of the joining device 100 will be described with reference to FIG.

The joining device 100 is a device for joining the substrate 10 and the surface layer 30 to each other in an atmosphere containing an inert gas such as _{Ar or N 2 and a reducing gas such as H 2.} As shown in FIG. 12, the joining device 100 mainly includes a heating coil 101, a tubular body 102, a gas passage forming block 103, and a joining block 105.

The tubular body 102 has a space 102A for joining the substrate 10 and the surface layer 30 inside, and one of the open ends is closed by the gas passage forming block 103. The gas passage forming block 103 is a member in which a gas passage 103A through which an inert gas such as _{Ar or N 2 and a reducing gas such as H 2} passes is formed, and the gas passage 103A communicates with the space 102A. There is. Therefore, as shown in FIG. 12 arrow, the reducing gas such as an inert gas and H _2, such as Ar and N _2, can be made to flow into the space 102A through the gas passage 103A.

The joining block 105 is a member for pressing the tip of the base 10, and as shown in FIG. 12, the upper surface is cut along the shape of the tip of the base 10. The heating coil 101 heats the substrate 10 and the surface layer 30 by induction heating, and is wound around the outer peripheral portion of the tubular body 102. As shown in FIG. 12, the heating coil 101 is arranged so as to be at substantially the same height as the joining block 105.

In joining step S160, firstly, by flowing a reducing gas such as an inert gas and _{H 2,} such as Ar or _{N 2} into space 102A through the gas passage 103A, the space 102A is a reducing atmosphere. Next, as shown in FIG. 12, the surface layer 30 is arranged along the notch inclined surface 105A of the joining block 105, and the substrate 10 is placed so that the tip surface 10A is in close contact with the inner surface of the surface layer 30. It is inserted into the cap of the surface layer 30.

Next, the substrate 10 and the surface layer 30 are heated to a temperature at which diffusion bonding is possible by induction heating using the heating coil 101. Then, as shown in FIG. 12, by pressing the substrate 10 downward and applying pressure, atoms are diffused at the joint surface between the tip surface 10A of the substrate 10 and the surface layer 30, and the surface layer 30 is formed on the tip surface 10A. Be joined.

As described above, in the method for manufacturing the tip member of the heating tool according to the present embodiment, the substrate 10 and the surface layer 30 are brought into close contact with each other while being heated in a state where the surface layer 30 is in contact with the tip surface 10A of the substrate 10. The surface layer 30 is joined to the tip surface 10A by applying pressure in the direction. This makes it possible to ensure high adhesion between the substrate 10 and the surface layer 30. The joining method can be carried out using not only the surface layer (cap) 30 formed by the metal additive manufacturing method but also the surface layer formed by the press method or the MIM method. However, while the press method and the MIM method require a mold for forming the surface layer, the metal additive manufacturing method according to the present embodiment does not require a mold. Therefore, according to the present embodiment, it becomes easier to deal with the formation of surface layers having various shapes as compared with the case of using the press method or the MIM method.

(Embodiment 5)
Next, a method of manufacturing the tip member of the heating tool according to the fifth embodiment of the present invention will be described with reference to FIGS. 14 to 17. In the method for manufacturing the tip member of the heating tool according to the fifth embodiment, not only the surface layer 112 but also the substrate 113 and the surface are formed by the deposition type metal lamination molding using the laser nozzle as described in the second and third embodiments. By molding the layers 112 together, a soldering iron tip is manufactured in one step.

In the modeling step of the fifth embodiment, first, a step of modeling the substrate 113 is performed. In this step, as shown in FIG. 14, while moving the laser nozzle 41AA (first nozzle) in the lateral direction, the laser light 44A is irradiated from the laser nozzle 41AA, and the first metal material 49 (copper powder) and the first metal material 49 (copper powder) and Shield gas 43 is ejected. The first metal material 49 is melted by the thermal energy of the laser beam 44A, and the melted first metal material 49 is solidified. As a result, as shown in FIG. 14, the copper base portion 110 is laminated and molded.

Further, as shown in FIG. 14, the chromium base portion 111 is similarly laminated and formed on the surface of the copper base portion 110. Specifically, the laser nozzle 41AA is retracted at the modeling position of the chromium substrate portion 111, and the other laser nozzle 41AB is moved to the modeling position. Then, the laser light is irradiated from the laser nozzle 41AB and the chromium powder is ejected. As a result, the ejected chromium powder is melted by the thermal energy of the laser beam, and the molten chromium powder is solidified, so that the chromium base portion 111 is formed so as to cover the surface of the copper base portion 110.

Then, as shown in FIGS. 14 to 17, the copper base portion 110 and the chromium base portion 111 are laminated in the axial direction. As a result, the base 113 having the tip surface 113A and being composed of the copper base portion 110 and the chromium base portion 111 is formed. As shown in FIG. 17, a hollow portion 113B for inserting a heater is formed on the base end side of the substrate 113.

Next, a step of forming the surface layer 112 on the tip surface 113A of the substrate 113 is performed. In this step, first, the laser nozzle 41AC (second nozzle) different from the one used for the laminated modeling of the substrate 113 is moved to the modeling position. Then, in the vicinity of the tip surface 113A of the substrate 113, the laser beam 44A is irradiated from the laser nozzle 41AC, and the second metal material 49A (Fe powder, Fe—Co alloy powder) having higher wettability to solder than the first metal material 49 is obtained. , Fe—Co—C alloy powder, Fe—Ni—Co alloy powder, etc.). Then, the second metal material 49A is melted by the thermal energy of the laser beam 44A, and the melted second metal material 49A is solidified. As a result, as shown in FIG. 17, the surface layer 112 that covers the tip surface 113A of the substrate 113 is formed.

As described above, in the method for manufacturing the tip member of the heating tool according to the present embodiment, the metal materials (first metal material 49, second metal material 49A) made of different metal materials are ejected at different positions in the molding step. The substrate 113 and the surface layer 112 can be formed together by melting and solidifying the metal by irradiating the laser beam 44A. Therefore, the entire iron tip (base 113 and surface layer 112) can be manufactured in one step, and the manufacturing time can be significantly shortened.

(Embodiment 6)
Next, a method of manufacturing the tip member of the heating tool according to the sixth embodiment of the present invention will be described with reference to FIG. In the method for manufacturing the tip member of the heating tool according to the sixth embodiment, a plurality of metal materials are combined and laminated on the copper base member 122 by the powder bed type metal additive manufacturing method as described in the first embodiment. As a result, it is possible to manufacture a large number of different types of soldering iron tips by one process.

As shown in FIG. 18, first, a plurality of base members 122 are arranged on the table surface 3AA. The base member 122 is made of copper and is provided with a hollow portion 122A into which a heater is inserted. Further, the plurality of base members 122 may each have the same shape. As shown in FIG. 18, the base members 122 are arranged in an upright posture substantially perpendicular to the table surface 3AA so that the opening of the hollow portion 122A faces the table surface 3AA side. As the base member 122, a copper member which has not been surface-treated may be used, or a member having a Ni layer (thickness 5 μm) formed on the surface thereof, for example, may be used.

Next, the process of spreading the metal powder on the base member 122, melting and solidifying the metal powder by irradiation with laser light, and then lowering the modeling table 3 is repeated. As a result, the plurality of modeling layers 130 (130A, 130B ... 130E) in which the metal powder is melt-solidified are sequentially laminated on the upper surface 122B of the base member 122.

Specifically, in the formation of the molding layers 130A to 130D, first, the copper molding portion 131 is formed by spreading copper powder and irradiating the laser beam, and then by spreading the SUS powder and irradiating the laser beam. By forming the SUS modeling portion 132, a single layer modeling layer 130 is formed. Further, in the formation of the molding layer 130E, first, the copper molding portion 131 is formed by spreading copper powder and irradiating the laser beam, and then the iron powder (or iron alloy powder) is spread and irradiating the laser beam. As a result, the iron molding portion 133 is formed. As the iron alloy powder for forming the iron molding portion 133, for example, one containing 3% by mass of cobalt and 0.6% by mass of carbon and composed of the balance iron and impurities can be used.

As a result, a soldering iron tip having a base 120 (base member 122, copper molding portion 131, SUS molding portion 132) and a surface layer 121 (iron molding portion 133) covering the tip surface of the base 120 can be provided. Can be manufactured. According to this method, a large amount of soldering iron tips can be manufactured in a short time by one step, so that the manufacturing efficiency can be significantly improved. Moreover, as shown in FIG. 18, different types of soldering iron tips having different tip shapes (the tip on the left side in FIG. 18 is curved and the tip on the right side in FIG. 18 is flat) are manufactured by one step. can do.

(Other embodiments)
Finally, other embodiments of the present invention will be described.

In the first embodiment, the case where the laser beam 8A is irradiated to the metal powder 7 has been described, but the present invention is not limited to this, and the metal powder 7 may be irradiated with an electron beam. Further, the surface layer 30 may be formed by melting the metal powder 7 using the arc discharge generated between the substrate 10 and the electrode as a heat source.

In the first embodiment, the case where the base 10 having the shape shown in FIG. 7 is used has been described. However, as shown in FIGS. 19 and 20, the flat tip surfaces 90A and 91A are formed similarly to the base 10 in FIG. It is also possible to use other types of substrates 90 and 91 having the same. A knife-shaped substrate 90 capable of line contact, surface contact, and point contact with the work as shown in FIG. 19 may be used, or line contact and surface contact with the work as shown in FIG. 20. A flat-blade screwdriver type substrate 91 that can be contacted may be used.

Further, as the surface layer 30, those having the shapes shown in FIGS. 21 to 23 can also be formed. In the surface layer 30 having the V-shaped groove 30AA shown in FIG. 21, the contact area with the lead wire L becomes large at the time of soldering, and the thermal conductivity can be further improved. In the surface layer 30 having the recess 30AB shown in FIG. 22, the solder 30AC can be stored in the portion of the recess 30AB. Further, in the surface layer 30 having the gate-shaped recess 30AD shown in FIG. 23, operations such as removal of the chip component C can be easily performed at the time of soldering. As described above, since the surface layer 30 having a complicated shape that is difficult to be manufactured by machining such as a shape having a groove or a depression can be easily formed, the tip of the iron tip suitable for various soldering applications can be easily formed. The structure can be obtained. Such variations in the shape of the surface layer 30 can be realized in any of the above embodiments 1 to 6.

The present invention is not limited to the method of manufacturing the soldering iron tip 40 as described in the first to sixth embodiments, and is applied to the method of manufacturing a nozzle for a solder sucker as a tip member of another heating tool. You can also do it. In this case, in the metal lamination molding apparatus 1 shown in FIG. 1, the base 92 (FIG. 24) of the suction device nozzle is installed on the molding table 3 instead of the base 10 of the soldering iron tip. Then, the metal powder 7 is supplied so as to cover the tip surface 92A of the substrate 92, and the metal powder 7 is irradiated with the laser beam 8A. Thereby, as in the case of the soldering iron tip 40 described in the first embodiment, the surface layer covering the tip surface 92A of the substrate 92 can be formed by metal lamination molding. Further, the methods described in the above embodiments 2 to 6 can also be applied to the manufacture of the suction device nozzle in the same manner.

In the fourth embodiment, the case where the substrate 10 and the surface layer 30 are bonded by diffusion bonding has been described, but the present invention is not limited to this, and the substrate 10 and the surface layer 30 are bonded by another bonding method such as brazing bonding. You may. Specifically, it is also possible to bond the substrate 10 and the surface layer 30 using Ti wax or Al—Si wax. However, a brazing material such as silver wax that gets wet with solder is not preferable because the surface layer 30 is eroded by the solder during use of the soldering iron and the surface layer 30 falls off.

Further, in the fourth embodiment, the case where the substrate 10 having the shape shown in FIG. 7 is used has been described, but it is also possible to use a substrate having another shape. For example, when the substrates 90 and 91 having the shapes shown in FIGS. 19 and 20 are used, cap-shaped surface layers 90B and 91B having insertion portions 90BB and 91BB into which the tips thereof can be inserted (FIGS. 25 and 20). 26) is produced by metal lamination molding. Further, as shown in FIG. 8, when the base 60 having a conical tip 60AA side is used, the cap-shaped surface layer 60C having the insertion portion 60CC into which the conical tip can be inserted is formed by metal lamination molding. It is made (Fig. 27).

Further, the surface layer may be formed by a plasma powder overlay welding method (PTA; Plasma Transferred Arc). In this method, an arc discharge is generated between the substrate 10 and the electrodes arranged on the substrate 10, and a plasma generating gas is supplied to generate a plasma arc between the substrate 10 and the electrodes. Then, by supplying a metal powder (metal material) into the plasma arc and migrating the metal powder onto the tip surface 10A of the substrate 10 while melting the metal powder, the surface layer 30 made of a built-up metal can be formed. .. In this method, the arc discharge generated between the substrate 10 and the electrode serves as a heat source for melting and solidifying the metal powder.

Further, the surface layer 30 may be formed by laser cladding. In this method, a metal powder or a metal wire is used as a metal material for overlaying, and the surface layer 30 is provided by supplying the metal powder or the metal wire to the tip surface 10A of the substrate 10 heated by irradiation with a laser beam. Can be formed.

Further, the surface layer 30 may be formed not only by the metal lamination molding of the laser light or electron beam method but also by the metal lamination molding of the arc welding method. As a method of arc welding, TIG (Tungsten Inert Gas) welding may be used.

An experiment was conducted in which the surface layer 30 covering the tip surface 10A of the base 10 of the soldering iron tip was modeled by the metal additive manufacturing method as follows.

As the metal lamination molding apparatus, the one shown in FIG. 1 was used (EOSINT M280 manufactured by EOS). As the substrate of the soldering iron tip, a copper one having the shape shown in FIG. 7 having an Fe layer (thickness 20 μm) and an aluminum diffusion layer formed on the surface was used. As the metal powder, a maraging steel powder having an average particle size of 20 μm and having a typical composition described in the above-described embodiment was used.

A 200 W fiber laser was used as a heat source, and the beam diameter was set to φ0.1 mm. The inside of the chamber had a nitrogen atmosphere, and the oxygen concentration was 0.5% or less. An attempt was made to form a surface layer having a thickness of 200 μm by laminating five layers having a thickness of 40 μm.

FIG. 28 is a photograph showing the appearance of the tip of a soldering iron with the surface layer 30 formed on the tip surface 10A of the substrate 10 (magnification: 40 times). FIG. 29 is an enlarged photograph of the portion of the surface layer 30 (magnification: 120 times). In this way, the surface layer 30 covering the tip surface 10A could be formed by the metal additive manufacturing method.

FIG. 30 is a photograph of a cross-sectional observation of the tip portion of the substrate 10 on which the surface layer 30 is formed. FIG. 31 is an enlarged photograph of the interface portion between the surface layer 30 and the substrate 10 in FIG. FIG. 32 is a cross-sectional observation photograph of a surface layer formed by Fe plating as a reference example.

As can be seen from FIG. 31, it was found that no gap was formed between the substrate 10 and the surface layer 30, and high adhesion between the substrate 10 and the surface layer 30 was ensured. Further, as is clear from the comparison between FIGS. 31 and 32, in the surface layer 30 (FIG. 31) formed by the metal additive manufacturing method, almost all voids are observed as in the surface layer 300 (FIG. 32) formed by Fe plating. It was found that high density was achieved.

The time required to laminate five 40 μm modeling layers on the 15 substrates 10 was 2 minutes and 32 seconds. Therefore, it was found that the time was significantly shortened as compared with the plating method which required several hours to form the surface layer. Based on the above results, it is possible to mass-produce high-quality soldering iron tips by forming a surface layer with high density and high adhesion to the substrate in a short time by using the metal lamination molding method. Was suggested.

It should be understood that the embodiments and examples disclosed this time are exemplary in all respects and are not restrictive. The scope of the present invention is shown by the scope of claims rather than the above description, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

1 Metal laminate modeling equipment 2 Vacuum chamber 3 Modeling table 5, 6 Metal powder supply unit 7 Metal powder (metal material)
8 Irradiation part 8A, 44A Laser light 9 Control unit 10 Base 10A Tip surface 30 Surface layer 40 Soldering iron tip (tip member of heating tool)
41 Laser nozzle 41AA 1st nozzle 41AC 2nd nozzle 42 1st metal powder 43 Shield gas 45 2nd metal powder 49 1st metal material 49A 2nd metal material 63 Protective layer

Claims (4)

A method for manufacturing a tip member of a heating tool including a substrate having a flat tip surface that is oblique to the axial direction and a surface layer that covers the tip surface.
An installation step in which the substrate is installed diagonally so that the tip surface faces upward,
A supply step in which a metal powder, which is a metal material, is supplied to the tip surface and the tip surface is covered with the metal powder.
By irradiating the metal powder covering the tip surface with a laser beam or an electron beam or by arc discharge, the metal powder covering the tip surface is melted and the melted metal material is solidified to form the tip surface. characterized in that it comprises a shaped step of shaping the front Symbol surface layer integrated method of the tip member of the heating tool. A step of supplying a second metal powder different from the metal powder to a position different from the tip surface and covering the substrate at the position.
The second metal powder covering the substrate is further provided with a step of irradiating the second metal powder with a laser beam to melt the second metal powder and solidifying the melted second metal powder to form a second surface layer. The method for manufacturing a tip member of a heating tool according to claim 1, wherein the tip member of the heating tool is manufactured. In the molding step, the surface layer made of at least one material selected from the group consisting of Fe, Fe—Co alloys, Fe—Co—C alloys, Fe—Ni alloys and Fe—Ni—Co alloys. The method for manufacturing a tip member of a heating tool according to claim 1 or 2, wherein the tip member of the heating tool is manufactured. The method for manufacturing a tip member of a heating tool according to any one of claims 1 to 3, wherein a soldering iron tip or a nozzle for a solder sucker is manufactured as the tip member of the heating tool.

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