JP7463837B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
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- JP7463837B2 JP7463837B2 JP2020085092A JP2020085092A JP7463837B2 JP 7463837 B2 JP7463837 B2 JP 7463837B2 JP 2020085092 A JP2020085092 A JP 2020085092A JP 2020085092 A JP2020085092 A JP 2020085092A JP 7463837 B2 JP7463837 B2 JP 7463837B2
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- 239000002245 particle Substances 0.000 claims description 132
- 229920005989 resin Polymers 0.000 claims description 112
- 239000011347 resin Substances 0.000 claims description 112
- 239000002923 metal particle Substances 0.000 claims description 57
- 239000004020 conductor Substances 0.000 claims description 32
- 239000000843 powder Substances 0.000 claims description 27
- 238000000605 extraction Methods 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 description 18
- 238000000576 coating method Methods 0.000 description 18
- 238000004804 winding Methods 0.000 description 14
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000002003 electrode paste Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000010191 image analysis Methods 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 239000011859 microparticle Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- -1 etc. Polymers 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229910017061 Fe Co Inorganic materials 0.000 description 1
- 229910017082 Fe-Si Inorganic materials 0.000 description 1
- 229910017133 Fe—Si Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910002796 Si–Al Inorganic materials 0.000 description 1
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000005385 borate glass Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- CPSYWNLKRDURMG-UHFFFAOYSA-L hydron;manganese(2+);phosphate Chemical compound [Mn+2].OP([O-])([O-])=O CPSYWNLKRDURMG-UHFFFAOYSA-L 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
- H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Coils Or Transformers For Communication (AREA)
Description
金属粒子と、樹脂と、を含む素体と、
前記素体の外面の一部である電極対向部に形成してある樹脂電極層と、を有し、
前記樹脂電極層が、樹脂成分と導体粉末とを含み、
前記電極対向部は、前記素体の最表面において前記樹脂が除去されて、最表面に位置する前記金属粒子の外周縁の一部が露出している露出部を有しており、
前記樹脂電極層と、前記電極対向部の前記露出部と、が接合してある。
本実施形態のインダクタ2において、端子電極8と接する素子本体4の電極対向部20には、露出部20bが存在しており、この露出部の最表面では、樹脂14が除去されて、最表面に位置する外周縁の一部が露出している。そして、本実施形態のインダクタ2では、端子電極8の樹脂電極層81と、電極対向部20の露出部20bとが、接合してある。
以上、本発明の実施形態について説明してきたが、本発明は上述した実施形態に限定されるものではなく、本発明の範囲内で種々に改変することができる。
4 … 素子本体
4a … 上面
4b … 底面
4c~4f … 側面
41 … 第1コア部
41a … 鍔部
41b … 巻芯部
41c … 切り欠き部
42 … 第2コア部
6α … コイル部
6 … ワイヤ
61 … 導体部
62 … 絶縁層
6a … リード部
8 … 端子電極
81 … 樹脂電極層
82 … 樹脂成分
83 … 導体粉末
83a … 第1粒子
83b … 第2粒子
20 … 電極対向部
20a … 取出電極部
20b … 露出部
20c … 非露出部
Claims (5)
- 金属粒子と、樹脂と、を含む素体と、
前記素体の外面の一部である電極対向部に形成してある樹脂電極層と、を有し、
前記樹脂電極層が、樹脂成分と導体粉末とを含み、
前記電極対向部は、前記素体の最表面において前記樹脂が除去されて、最表面に位置する前記金属粒子の外周縁の一部が露出している露出部を有しており、
前記電極対向部は、前記素体の内部に位置する導体の一部が露出している取出電極部と、前記樹脂が除去されていない非露出部と、をさらに有し、
前記電極対向部の平面方向において、前記取出電極部の周囲には前記露出部が位置してあり、
前記非露出部は、前記露出部の周囲の外側に位置し、
前記樹脂電極層が、前記電極対向部の前記露出部および前記非露出部の双方に接合してある電子部品。 - 前記樹脂電極層の前記導体粉末は、粒径がマイクロメートルオーダの第1粒子と、粒径がナノメートルオーダの第2粒子とを含む請求項1に記載の電子部品。
- 前記露出部の最表面では、前記金属粒子の間に、前記樹脂電極層の前記第2粒子が入り込んでいる請求項2に記載の電子部品。
- 前記樹脂電極層の前記導体粉末は、粒径がナノメートルオーダの第2粒子を含んでおり、
前記露出部の最表面では、前記金属粒子の間に、前記第2粒子が入り込んでいる請求項1に記載の電子部品。 - 前記素体に含まれる前記金属粒子は、平均粒径が異なる少なくとも2種以上の粒子群で構成してある請求項1~4のいずれかに記載の電子部品。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020085092A JP7463837B2 (ja) | 2020-05-14 | 2020-05-14 | 電子部品 |
CN202110521092.8A CN113674967A (zh) | 2020-05-14 | 2021-05-13 | 电子部件 |
CN202110521575.8A CN113674968A (zh) | 2020-05-14 | 2021-05-13 | 电子部件 |
US17/320,402 US20210358683A1 (en) | 2020-05-14 | 2021-05-14 | Electronic component |
US17/320,380 US20210358682A1 (en) | 2020-05-14 | 2021-05-14 | Electronic component |
Applications Claiming Priority (1)
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JP2020085092A JP7463837B2 (ja) | 2020-05-14 | 2020-05-14 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
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JP2021180265A JP2021180265A (ja) | 2021-11-18 |
JP7463837B2 true JP7463837B2 (ja) | 2024-04-09 |
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JP2020085092A Active JP7463837B2 (ja) | 2020-05-14 | 2020-05-14 | 電子部品 |
Country Status (3)
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US (1) | US20210358682A1 (ja) |
JP (1) | JP7463837B2 (ja) |
CN (1) | CN113674967A (ja) |
Families Citing this family (1)
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JP2023107555A (ja) * | 2022-01-24 | 2023-08-03 | 株式会社トーキン | 組成物及び射出成形体 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014225590A (ja) | 2013-05-17 | 2014-12-04 | 東光株式会社 | 面実装インダクタの製造方法 |
JP2016058418A (ja) | 2014-09-05 | 2016-04-21 | 東光株式会社 | 表面実装インダクタ及びその製造方法 |
JP2017191941A (ja) | 2017-04-25 | 2017-10-19 | 株式会社村田製作所 | 表面実装インダクタ及びその製造方法 |
JP2017201718A (ja) | 2017-07-20 | 2017-11-09 | 株式会社村田製作所 | 表面実装インダクタ及びその製造方法 |
JP2018107198A (ja) | 2016-12-22 | 2018-07-05 | 株式会社村田製作所 | 表面実装インダクタ |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5832355B2 (ja) * | 2012-03-30 | 2015-12-16 | 東光株式会社 | 面実装インダクタの製造方法 |
JP2021027203A (ja) * | 2019-08-06 | 2021-02-22 | 株式会社村田製作所 | インダクタ |
-
2020
- 2020-05-14 JP JP2020085092A patent/JP7463837B2/ja active Active
-
2021
- 2021-05-13 CN CN202110521092.8A patent/CN113674967A/zh active Pending
- 2021-05-14 US US17/320,380 patent/US20210358682A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014225590A (ja) | 2013-05-17 | 2014-12-04 | 東光株式会社 | 面実装インダクタの製造方法 |
JP2016058418A (ja) | 2014-09-05 | 2016-04-21 | 東光株式会社 | 表面実装インダクタ及びその製造方法 |
JP2018107198A (ja) | 2016-12-22 | 2018-07-05 | 株式会社村田製作所 | 表面実装インダクタ |
JP2017191941A (ja) | 2017-04-25 | 2017-10-19 | 株式会社村田製作所 | 表面実装インダクタ及びその製造方法 |
JP2017201718A (ja) | 2017-07-20 | 2017-11-09 | 株式会社村田製作所 | 表面実装インダクタ及びその製造方法 |
Also Published As
Publication number | Publication date |
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JP2021180265A (ja) | 2021-11-18 |
CN113674967A (zh) | 2021-11-19 |
US20210358682A1 (en) | 2021-11-18 |
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