JP7463191B2 - 半導体装置及び半導体装置の製造方法 - Google Patents
半導体装置及び半導体装置の製造方法 Download PDFInfo
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- JP7463191B2 JP7463191B2 JP2020095751A JP2020095751A JP7463191B2 JP 7463191 B2 JP7463191 B2 JP 7463191B2 JP 2020095751 A JP2020095751 A JP 2020095751A JP 2020095751 A JP2020095751 A JP 2020095751A JP 7463191 B2 JP7463191 B2 JP 7463191B2
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020200132431A KR20210052244A (ko) | 2019-10-30 | 2020-10-14 | 반도체 장치 및 반도체 장치의 제조 방법 |
CN202011136670.8A CN112750796A (zh) | 2019-10-30 | 2020-10-22 | 半导体装置以及半导体装置的制造方法 |
TW109137027A TW202117973A (zh) | 2019-10-30 | 2020-10-26 | 半導體裝置、以及半導體裝置的製造方法 |
US17/082,531 US11929342B2 (en) | 2019-10-30 | 2020-10-28 | Semiconductor device with leads having step surfaces |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2019196951 | 2019-10-30 | ||
JP2019196951 | 2019-10-30 |
Publications (2)
Publication Number | Publication Date |
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JP2021072434A JP2021072434A (ja) | 2021-05-06 |
JP7463191B2 true JP7463191B2 (ja) | 2024-04-08 |
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Application Number | Title | Priority Date | Filing Date |
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JP2020095751A Active JP7463191B2 (ja) | 2019-10-30 | 2020-06-01 | 半導体装置及び半導体装置の製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7463191B2 (ko) |
KR (1) | KR20210052244A (ko) |
TW (1) | TW202117973A (ko) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017028152A (ja) | 2015-07-24 | 2017-02-02 | 株式会社三井ハイテック | リードフレーム及びその製造方法 |
JP2017174849A (ja) | 2016-03-18 | 2017-09-28 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
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