JP7459878B2 - 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置 - Google Patents

光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置 Download PDF

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JP7459878B2
JP7459878B2 JP2021541884A JP2021541884A JP7459878B2 JP 7459878 B2 JP7459878 B2 JP 7459878B2 JP 2021541884 A JP2021541884 A JP 2021541884A JP 2021541884 A JP2021541884 A JP 2021541884A JP 7459878 B2 JP7459878 B2 JP 7459878B2
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Prior art keywords
optical semiconductor
resin composition
thermosetting resin
semiconductor element
light
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JP2021541884A
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Japanese (ja)
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JPWO2021038772A1 (zh
Inventor
貴一 稲葉
光 須藤
高士 山本
直紀 奈良
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021541884A 2019-08-28 2019-08-28 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置 Active JP7459878B2 (ja)

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PCT/JP2019/033794 WO2021038772A1 (ja) 2019-08-28 2019-08-28 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

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JPWO2021038772A1 JPWO2021038772A1 (zh) 2021-03-04
JP7459878B2 true JP7459878B2 (ja) 2024-04-02

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JP (1) JP7459878B2 (zh)
KR (1) KR20220055470A (zh)
CN (1) CN114174372A (zh)
WO (1) WO2021038772A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189554A (ja) 2009-02-18 2010-09-02 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
WO2012111543A1 (ja) 2011-02-18 2012-08-23 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び金属箔張積層板
CN106752452A (zh) 2016-12-07 2017-05-31 江西龙正科技发展有限公司 一种led灯具用散热涂料

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102408543B (zh) 2006-11-15 2014-10-29 日立化成工业株式会社 光反射用热固化性树脂组合物、用该组合物的光半导体元件搭载用基板及其光半导体装置
EP2540776B1 (en) * 2007-09-25 2017-08-09 Hitachi Chemical Co., Ltd. Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device
JP5665285B2 (ja) 2009-06-15 2015-02-04 日立化成株式会社 光半導体素子搭載用部材及び光半導体装置
JP2018070680A (ja) * 2016-10-25 2018-05-10 日立化成株式会社 エポキシ樹脂組成物及びこれを用いたエポキシ樹脂硬化物、電子部品装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189554A (ja) 2009-02-18 2010-09-02 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
WO2012111543A1 (ja) 2011-02-18 2012-08-23 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び金属箔張積層板
CN106752452A (zh) 2016-12-07 2017-05-31 江西龙正科技发展有限公司 一种led灯具用散热涂料

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JPWO2021038772A1 (zh) 2021-03-04
CN114174372A (zh) 2022-03-11
WO2021038772A1 (ja) 2021-03-04
KR20220055470A (ko) 2022-05-03

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